Patents by Inventor Shin-Hung Chen
Shin-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170954Abstract: A motor control method for coupled an electronic vehicle is provided. The motor controller controls a motor and is powered by a battery. The motor control method includes: when a main relay of the motor controller suddenly breaks contact, in a first phase, feeding back a surge current into the battery to suppress the surge current by a diode and a first current limit resistor of a first protecting circuit of the motor controller; and, in a second phase, conducting a discharge switch of a second protecting circuit of the motor controller by a control unit of the motor controller, and releasing the surge current to a reference voltage range by the discharge switch and a second current limit resistor of the second protecting circuit.Type: ApplicationFiled: December 27, 2022Publication date: May 23, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Nan-Hsiung TSENG, Bing-Ren CHEN, Shin-Hung CHANG, Chin-Hone LIN
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Publication number: 20240142301Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.Type: ApplicationFiled: December 14, 2022Publication date: May 2, 2024Inventors: Ming-Yao CHEN, Chang-Hung LI, Shin-Shueh CHEN, Jui-Chi LO
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Patent number: 11971298Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.Type: GrantFiled: December 14, 2022Date of Patent: April 30, 2024Assignee: AUO CORPORATIONInventors: Ming-Yao Chen, Chang-Hung Li, Shin-Shueh Chen, Jui-Chi Lo
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Patent number: 11961779Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.Type: GrantFiled: May 27, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).Inventors: Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
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Publication number: 20240087974Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
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Patent number: 11913047Abstract: A method for producing ?-aminobutyric acid includes cultivating, in a culture medium containing glutamic acid or a salt thereof, a probiotic composition including at least one lactic acid bacterial strain selected from the group consisting of Bifidobacterium breve CCFM1025 which is deposited at the Guangdong Microbial Culture Collection Center under an accession number GDMCC 60386, Lactobacillus acidophilus TYCA06, Lactobacillus plantarum LPL28, and Bifidobacterium longum subsp. infantis BLI-02 which are deposited at the China General Microbiological Culture Collection Center respectively under accession numbers CGMCC 15210, CGMCC 17954, and CGMCC 15212, Lactobacillus salivarius subsp. salicinius AP-32 which is deposited at the China Center for Type Culture Collection under an accession number CCTCC M 2011127, and combinations thereof.Type: GrantFiled: January 7, 2022Date of Patent: February 27, 2024Assignee: GLAC BIOTECH CO., LTD.Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yu-Fen Huang, Chen-Hung Hsu, Wen-Yang Lin, Yi-Wei Kuo, Shin-Yu Tsai
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Publication number: 20220063145Abstract: A material of thermoplastic fusible inner mold is provided, including: a high crystalline polymeric material and a lubricant material, the high crystalline polymeric material mixed with the lubricant material. An inner mold is further provided, made of the material of thermoplastic fusible inner mold described above. A method for manufacturing hollow part is further provided, including the following steps of: providing the inner mold; covering the inner mold with a part material; heating the inner mold which is covered with the part material to form the part material; and heating the inner mold covered with the part material which is formed at a predetermined temperature to melt the inner mold out of the part material which is formed to form the hollow part.Type: ApplicationFiled: August 30, 2021Publication date: March 3, 2022Inventors: FENG-MAO HUANG, JEAN-SHYAN WANG, SHIN-HUNG CHEN
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Patent number: 10529701Abstract: A micro light-emitting diode (microLED) display panel includes microLEDs; a substrate for supporting the microLEDs, the substrate being divided into a plurality of sub-regions; and a plurality of chip-on-film (COF) packages mounted on surfaces of the sub-regions respectively, a plurality of drivers being disposed on the COF packages respectively.Type: GrantFiled: September 11, 2018Date of Patent: January 7, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Fa-Ming Chen, Shin-Hung Chen
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Patent number: 9127175Abstract: Disclosed is a method of forming a composite micropowder, including mixing 100 parts by weight of fluorine-containing polymer, 10 to 140 parts by weight of silane, catalyst, and water, such that the silane is in-situ polymerized in the fluorine-containing polymer to form a polysiloxane, and the fluorine-containing polymer and the polysiloxane form a composite. The composite is dried, and then physically crushed to form composite micropowder. The total weight of the fluorine-containing polymer and the silane and the weight of the catalyst have a ratio of 100:1 to 100:0.0001. The silane and the water have a molar ratio of 1:0.5 to 1:3. The composite micropowder has a diameter of 0.1 ?m to 15 ?m. The fluorine-containing polymer and the polysiloxane in the composite micropowder have a weight ratio of 95:5 to 60:40.Type: GrantFiled: August 29, 2013Date of Patent: September 8, 2015Assignee: Grand Tek Advance Material Science Co., Ltd.Inventors: Hseuh-Tso Lin, Shin-Hung Chen, Dick Zhong
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Publication number: 20140220345Abstract: Disclosed is a method of forming a composite micropowder, including mixing 100 parts by weight of fluorine-containing polymer, 10 to 140 parts by weight of silane, catalyst, and water, such that the silane is in-situ polymerized in the fluorine-containing polymer to form a polysiloxane, and the fluorine-containing polymer and the polysiloxane form a composite. The composite is dried, and then physically crushed to form composite micropowder. The total weight of the fluorine-containing polymer and the silane and the weight of the catalyst have a ratio of 100:1 to 100:0.0001. The silane and the water have a molar ratio of 1:0.5 to 1:3. The composite micropowder has a diameter of 0.1 ?m to 15 ?m. The fluorine-containing polymer and the polysiloxane in the composite micropowder have a weight ratio of 95:5 to 60:40.Type: ApplicationFiled: August 29, 2013Publication date: August 7, 2014Applicant: Grand Tek Advanced Material Science Co., Ltd.Inventors: Hseuh-Tso LIN, Shin-Hung CHEN, Dick ZHONG
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Patent number: 8377350Abstract: A method for controlling temperatures in hot runners of a multi-cavity injection mold, a warning method, and a control system based on those methods are provided, in which a temperature sensor is positioned at the same location as each of the cavities of the mold, one of the cavities is chosen as a standard cavity, and a standard filling time is defined. Besides, in every injection cycle, a calculating and controlling module is to calculate the differences between the standard filling time and the filling times of the cavities, and according to the differences, the temperatures in the hot runners may be adjusted by a temperature-adjusting device and a warning device may be started. So, the volumetric filling of the cavities can be balanced very quickly, the process can avoid fluctuations of external environment so as to reduce the time for product development, and the quality of production can be maintained.Type: GrantFiled: January 31, 2011Date of Patent: February 19, 2013Assignee: Precision Machinery Research Development CenterInventors: Jui-Wen Chang, Chih-Hsiung Chung, Shin-Hung Chen, Yi-Shu Hsu
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Publication number: 20120193824Abstract: A method for controlling temperatures in hot runners of a multi-cavity injection mold, a warning method, and a control system based on those methods are provided, in which a temperature sensor is positioned at the same location as each of the cavities of the mold, one of the cavities is chosen as a standard cavity, and a standard filling time is defined. Besides, in every injection cycle, a calculating and controlling module is to calculate the differences between the standard filling time and the filling times of the cavities, and according to the differences, the temperatures in the hot runners may be adjusted by a temperature-adjusting device and a warning device may be started. So, the volumetric filling of the cavities can be balanced very quickly, the process can avoid fluctuations of external environment so as to reduce the time for product development, and the quality of production can be maintained.Type: ApplicationFiled: January 31, 2011Publication date: August 2, 2012Applicant: PRECISION MACHINERY RESEARCH DEVELOPMENT CENTERInventors: Jui-Wen CHANG, Chih-Hsiung CHUNG, Shin-Hung CHEN, Yi-Shu HSU
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Patent number: 6683785Abstract: A mobile rack for hard disk drive has a removable cartridge with guiding rails, a pull back spring, a pivot block, a mounting bracket, and a driver door held by a pivot block. The driver door is set in with two base blocks, wherein each block contains a slider, wherein each slider is attached to a sliding plate for fitting against the corresponding sliding rails in the base block. Each slider has a latching pin extending out from the lateral side of the driver door to lock in the mobile rack. The pair of sliders is used to release the latching pins from the mounting bracket. When the driver door is opened outward, tension applied on the pull back spring automatically forces out the removable cartridge from the mounting bracket to make it easier to remove the hard disk drive from the computer.Type: GrantFiled: September 4, 2002Date of Patent: January 27, 2004Assignee: Inromatics IncorporatedInventor: Shin-Hung Chen
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Patent number: 6277950Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having ortho-linked phenylene and pendant tert-butyl group, i.e., 1,2-bis(4-aminophenoxy)-4-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing at least one dianhydride selected from s-BPDA, DSDA, ODPA, 6FDA and other diether-dianhydrides.Type: GrantFiled: January 26, 2000Date of Patent: August 21, 2001Assignee: National Science CouncilInventors: Chin-Ping Yang, Sheng-Huei Hsiao, Shin-Hung Chen