Patents by Inventor Shin-Hung Chen

Shin-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12118091
    Abstract: A method for updating software comprises transmitting a first version of the software and a first decryption key to a computing system. The method further comprises generating a second version of the software and a second decryption key. The method further comprises encrypting the second version of the software and the second decryption key. The encrypted second version of the software is configured to be decrypted using the first decryption key and not the second decryption key. The method further comprises transmitting the encrypted second version of the software and the encrypted second decryption key to the computing system.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: October 15, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Zhi-Xian Yang, Zhen-An Hung, Chia-Yu Lin, Shin-Hong Chen
  • Patent number: 12119296
    Abstract: A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: October 15, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hung Chen, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 12087705
    Abstract: A package structure is provided. The package structure includes a substrate and a chip-containing structure bonded to the substrate. The package structure also includes a warpage-control element attached to the substrate. The warpage-control element has a protruding portion extending into the substrate.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: September 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Sheng Lin, Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20220063145
    Abstract: A material of thermoplastic fusible inner mold is provided, including: a high crystalline polymeric material and a lubricant material, the high crystalline polymeric material mixed with the lubricant material. An inner mold is further provided, made of the material of thermoplastic fusible inner mold described above. A method for manufacturing hollow part is further provided, including the following steps of: providing the inner mold; covering the inner mold with a part material; heating the inner mold which is covered with the part material to form the part material; and heating the inner mold covered with the part material which is formed at a predetermined temperature to melt the inner mold out of the part material which is formed to form the hollow part.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 3, 2022
    Inventors: FENG-MAO HUANG, JEAN-SHYAN WANG, SHIN-HUNG CHEN
  • Patent number: 10529701
    Abstract: A micro light-emitting diode (microLED) display panel includes microLEDs; a substrate for supporting the microLEDs, the substrate being divided into a plurality of sub-regions; and a plurality of chip-on-film (COF) packages mounted on surfaces of the sub-regions respectively, a plurality of drivers being disposed on the COF packages respectively.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: January 7, 2020
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Fa-Ming Chen, Shin-Hung Chen
  • Patent number: 9127175
    Abstract: Disclosed is a method of forming a composite micropowder, including mixing 100 parts by weight of fluorine-containing polymer, 10 to 140 parts by weight of silane, catalyst, and water, such that the silane is in-situ polymerized in the fluorine-containing polymer to form a polysiloxane, and the fluorine-containing polymer and the polysiloxane form a composite. The composite is dried, and then physically crushed to form composite micropowder. The total weight of the fluorine-containing polymer and the silane and the weight of the catalyst have a ratio of 100:1 to 100:0.0001. The silane and the water have a molar ratio of 1:0.5 to 1:3. The composite micropowder has a diameter of 0.1 ?m to 15 ?m. The fluorine-containing polymer and the polysiloxane in the composite micropowder have a weight ratio of 95:5 to 60:40.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 8, 2015
    Assignee: Grand Tek Advance Material Science Co., Ltd.
    Inventors: Hseuh-Tso Lin, Shin-Hung Chen, Dick Zhong
  • Publication number: 20140220345
    Abstract: Disclosed is a method of forming a composite micropowder, including mixing 100 parts by weight of fluorine-containing polymer, 10 to 140 parts by weight of silane, catalyst, and water, such that the silane is in-situ polymerized in the fluorine-containing polymer to form a polysiloxane, and the fluorine-containing polymer and the polysiloxane form a composite. The composite is dried, and then physically crushed to form composite micropowder. The total weight of the fluorine-containing polymer and the silane and the weight of the catalyst have a ratio of 100:1 to 100:0.0001. The silane and the water have a molar ratio of 1:0.5 to 1:3. The composite micropowder has a diameter of 0.1 ?m to 15 ?m. The fluorine-containing polymer and the polysiloxane in the composite micropowder have a weight ratio of 95:5 to 60:40.
    Type: Application
    Filed: August 29, 2013
    Publication date: August 7, 2014
    Applicant: Grand Tek Advanced Material Science Co., Ltd.
    Inventors: Hseuh-Tso LIN, Shin-Hung CHEN, Dick ZHONG
  • Patent number: 8377350
    Abstract: A method for controlling temperatures in hot runners of a multi-cavity injection mold, a warning method, and a control system based on those methods are provided, in which a temperature sensor is positioned at the same location as each of the cavities of the mold, one of the cavities is chosen as a standard cavity, and a standard filling time is defined. Besides, in every injection cycle, a calculating and controlling module is to calculate the differences between the standard filling time and the filling times of the cavities, and according to the differences, the temperatures in the hot runners may be adjusted by a temperature-adjusting device and a warning device may be started. So, the volumetric filling of the cavities can be balanced very quickly, the process can avoid fluctuations of external environment so as to reduce the time for product development, and the quality of production can be maintained.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: February 19, 2013
    Assignee: Precision Machinery Research Development Center
    Inventors: Jui-Wen Chang, Chih-Hsiung Chung, Shin-Hung Chen, Yi-Shu Hsu
  • Publication number: 20120193824
    Abstract: A method for controlling temperatures in hot runners of a multi-cavity injection mold, a warning method, and a control system based on those methods are provided, in which a temperature sensor is positioned at the same location as each of the cavities of the mold, one of the cavities is chosen as a standard cavity, and a standard filling time is defined. Besides, in every injection cycle, a calculating and controlling module is to calculate the differences between the standard filling time and the filling times of the cavities, and according to the differences, the temperatures in the hot runners may be adjusted by a temperature-adjusting device and a warning device may be started. So, the volumetric filling of the cavities can be balanced very quickly, the process can avoid fluctuations of external environment so as to reduce the time for product development, and the quality of production can be maintained.
    Type: Application
    Filed: January 31, 2011
    Publication date: August 2, 2012
    Applicant: PRECISION MACHINERY RESEARCH DEVELOPMENT CENTER
    Inventors: Jui-Wen CHANG, Chih-Hsiung CHUNG, Shin-Hung CHEN, Yi-Shu HSU
  • Patent number: 6683785
    Abstract: A mobile rack for hard disk drive has a removable cartridge with guiding rails, a pull back spring, a pivot block, a mounting bracket, and a driver door held by a pivot block. The driver door is set in with two base blocks, wherein each block contains a slider, wherein each slider is attached to a sliding plate for fitting against the corresponding sliding rails in the base block. Each slider has a latching pin extending out from the lateral side of the driver door to lock in the mobile rack. The pair of sliders is used to release the latching pins from the mounting bracket. When the driver door is opened outward, tension applied on the pull back spring automatically forces out the removable cartridge from the mounting bracket to make it easier to remove the hard disk drive from the computer.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: January 27, 2004
    Assignee: Inromatics Incorporated
    Inventor: Shin-Hung Chen
  • Patent number: 6277950
    Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having ortho-linked phenylene and pendant tert-butyl group, i.e., 1,2-bis(4-aminophenoxy)-4-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing at least one dianhydride selected from s-BPDA, DSDA, ODPA, 6FDA and other diether-dianhydrides.
    Type: Grant
    Filed: January 26, 2000
    Date of Patent: August 21, 2001
    Assignee: National Science Council
    Inventors: Chin-Ping Yang, Sheng-Huei Hsiao, Shin-Hung Chen