Abstract: There is provided a time of flight sensor including a light source, a first pixel, a second pixel and a processor. The first pixel generates a first output signal without receiving reflected light from an external object illuminated by the light source. The second pixel generates a second output signal by receiving the reflected light from the external object illuminated by the light source. The processor calculates deviation compensation and deviation correction associated with temperature variation according to the first output signal to accordingly calibrate a distance calculated according to the second output signal.

Abstract: There is provided a time of flight sensor including a light source, a first pixel, a second pixel and a processor. The first pixel generates a first output signal without receiving reflected light from an external object illuminated by the light source. The second pixel generates a second output signal by receiving the reflected light from the external object illuminated by the light source. The processor calculates deviation compensation and deviation correction associated with temperature variation according to the first output signal to accordingly calibrate a distance calculated according to the second output signal.

Abstract: There is provided a time of flight sensor including a light source, a first pixel, a second pixel and a processor. The first pixel generates a first output signal without receiving reflected light from an external object illuminated by the light source. The second pixel generates a second output signal by receiving the reflected light from the external object illuminated by the light source. The processor calculates deviation compensation and deviation correction associated with temperature variation according to the first output signal to accordingly calibrate a distance calculated according to the second output signal.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: A wearable device includes: a light source, a sensor and a processor. The light source selectively operates in an illuminating mode or a non-illuminating mode, and generates an auxiliary light passing through a physical body in the illuminating mode. The sensor captures detecting images from the physical body, wherein the detecting images include at least one illuminating image captured while the light source is in the illuminating mode, at least one pre-illuminating image captured before the illuminating image is captured while the light source is in the non-illuminating mode, and at least one post-illuminating image captured after the illuminating image is captured while the light source is in the non-illuminating mode. The processor generates physiological information of the physical body according to the illuminating image, the pre-illuminating image and the post-illuminating image.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. Ahot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

Abstract: A differential signal transmitter including a driver circuit that generates a differential signal in response to data input. The amplitude of the voltage swings in the differential circuit is controlled by an electrical bias. Two data inputs, one being the original Data and the other being Data bar, are connected to the transistors and cause the required signal swings. The transmitter further includes a control circuit with an input for a single-bit control line for adjusting the bias to produce different swing amplitudes according to a control indicator inputted from the control line. The control circuit inputs one or more current sources and outputs the sum of one or more of the current sources according to the control indicator and the outputted current is used as the electrical bias.

Abstract: A differential signal transmitter including a driver circuit that generates a differential signal in response to data input. The amplitude of the voltage swings in the differential circuit is controlled by an electrical bias. Two data inputs, one being the original Data and the other being Data bar, are connected to the transistors and cause the required signal swings. The transmitter further includes a control circuit with an input for a single-bit control line for adjusting the bias to produce different swing amplitudes according to a control indicator inputted from the control line. The control circuit inputs one or more current sources and outputs the sum of one or more of the current sources according to the control indicator and the outputted current is used as the electrical bias.

Abstract: A differential voltage transmission circuit. The reference bias circuit outputs a first reference voltage, a second reference voltage and a reference current corresponding to a reference current adjusting signal. The differential comparator compares the difference between the first reference voltage and the second reference voltage with the difference between a first output voltage and a second output voltage, and outputs a result signal corresponding to the compared result. The decision circuit outputs the reference current adjusting signal corresponding to the result signal. The output circuit outputs the first output voltage and the second output voltage generated at both terminals of a termination resistor when the reference current flows through the termination resistor.

Abstract: A differential signal transmitter including a driver circuit that generates a differential signal in response to data input. The amplitude of the voltage swings in the differential circuit is controlled by an electrical bias. Two data inputs, one being the original Data and the other being Data bar, are connected to the transistors and cause the required current swings. The transmitter further includes a control circuit with an input for a single-bit control line for adjusting the bias to produce different swing amplitudes according to a control indicator inputted from the control line. The control circuit inputs one or more current sources and outputs the sum of one or more of the current sources according to the control indicator and the outputted current is used as the electrical bias.