Abstract: An integrated circuit package includes an interposer, the interposer including: a first redistribution layer, a second redistribution layer over the first redistribution layer in a central region of the interposer, a dielectric layer over the first redistribution layer in a periphery of the interposer, the dielectric layer surrounding the second redistribution layer in a top-down view, a third redistribution layer over the second redistribution layer and the dielectric layer, and a first direct via extending through the dielectric layer. A conductive feature of the third redistribution layer is coupled to a conductive feature of the first redistribution layer through the first direct via.

Abstract: A printed board fabricating method comprises a first stop in which a blueprint of the printed board is analyzed by an electronic color analyzer so as to enable a computer to process an image composition. The images are then arranged by an image arranging device which is connected with the computer. A PS board is fed into the image arranging device such that the surface of the PS board is provided with a coating of a photoresist agent. The coating is patterned according to the image composition. The coated PS board is then exposed in an exposure device. Finally, the exposed PS board is developed to become the printed board.