Patents by Inventor Shin Utsunomiya

Shin Utsunomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160272746
    Abstract: It is an object to conveniently, rapidly, and precisely provide a thick molded article without the need for large equipment at high temperature and high pressure and a heat and pressure resistant mold. This object is realized by providing a photocurable composition for molding, the composition including a polymer compound (A), a reactive diluent (B), and a photopolymerization initiator (C), wherein the polymer compound (A) includes a constitutional unit consisting of a compound of Formula (1) below and/or a constitutional unit consisting of a compound of Formula (2) below as a constituent monomeric unit, and the total weight of the compound of Formula (1) and/or the compound of Formula (2) is 60% by weight or more of the overall weight of the polymer compound (A), and wherein the reactive diluent (B) includes the compound of Formula (1) and/or the compound of Formula (2).
    Type: Application
    Filed: February 12, 2014
    Publication date: September 22, 2016
    Inventor: Shin Utsunomiya
  • Patent number: 7408002
    Abstract: The photosensitive resin composition is composed of a poly((meth)acrylic acid)-based water-soluble photo-sensitive resin (A) having an acid value of 150 mgKOH/g or more on a solid basis; the resin (A) being formed of a ((meth)acrylic acid)-based polymer in which a compound represented by formula (1): (wherein R1 represents H or Me; and R2 represents a liner or branched C2-C10 alkylene group) has been added to portions of the carboxylic groups, a photopolymerization initiator (B); and water (C).
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: August 5, 2008
    Assignee: Toyo Gosei Co., Ltd
    Inventors: Shin Utsunomiya, Seigo Yamada, Masahiro Takano, Mitsuharu Miyazaki
  • Patent number: 7348128
    Abstract: A photosensitive resin which exhibits excellent storage stability, affinity, miscibility, or solubility with respect to a variety of compounds, and high sensitivity can be solidified even under hydrous conditions as well as exhibiting high cure-related sensitivity and high flexibility and being uniformly solidified even under highly hydrous conditions, a photosensitive resin composition containing the resin, and a novel compound. The photosensitive resin is a saponified poly(vinyl acetate)-based photosensitive resin having a structural unit represented by formula (1): (wherein R1 represents H or Me; R2 represents a linear or branched C2-C10 alkylene group; n is an integer of 1 to 3; X represents m is an integer of 0 to 6; and Y represents an aromatic ring or a single bond).
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: March 25, 2008
    Assignee: Toyo Gosei Co., Ltd.
    Inventors: Seigo Yamada, Masahiro Takano, Mitsuharu Miyazaki, Shin Utsunomiya
  • Publication number: 20060148925
    Abstract: A photosensitive resin which exhibits excellent storage stability, affinity, miscibility, or solubility with respect to a variety of compounds, and high sensitivity can be solidified even under hydrous conditions as well as exhibiting high cure-related sensitivity and high flexibility and being uniformly solidified even under highly hydrous conditions, a photosensitive resin composition containing the resin, and a novel compound. The photosensitive resin is a saponified poly(vinyl acetate)-based photosensitive resin having a structural unit represented by formula (1): (wherein R1 represents H or Me; R2 represents a linear or branched C2-C10 alkylene group; n is an integer of 1 to 3; X represents m is an integer of 0 to 6; and Y represents an aromatic ring or a single bond).
    Type: Application
    Filed: November 13, 2003
    Publication date: July 6, 2006
    Applicant: TOYO GOSEI CO., LTD.
    Inventors: Seigo Yamada, Masahiro Takano, Mitsuharu Miyazaki, Shin Utsunomiya
  • Publication number: 20060084736
    Abstract: Disclosed herein is a thermosetting one-solution type composition for a protective film of a color filter. Specifically, a thermosetting one-solution type composition for a protective film of a color filter, which includes a self-curing copolymer obtained by copolymerizing one or two kinds of (meth)acrylate having an epoxy ring structure at a side chain thereof with (meth)acrylate having a terminal hydroxide group, and an organic solvent, is provided, and also, a color filter including the protective film manufactured using the above composition and a liquid crystal display including the color filter are provided. The thermosetting one-solution type composition for a protective film of a color filter of the current invention has good adhesive strength, transparency, film strength, heat resistance, acid resistance, and alkali resistance, and as well, can be stored for a long time.
    Type: Application
    Filed: July 29, 2005
    Publication date: April 20, 2006
    Inventors: Won Jang, Shin Utsunomiya, Sun Lee
  • Publication number: 20060041052
    Abstract: The photosensitive resin composition is composed of a poly((meth)acrylic acid)-based water-soluble photo-sensitive resin (A) having an acid value of 150 mgKOH/g or more on a solid basis; the resin (A) being formed of a ((meth)acrylic acid)-based polymer in which a compound represented by formula (1): (wherein R1 represents H or Me; and R2 represents a liner or branched C2-C10 alkylene group) has been added to portions of the carboxylic groups, a photopolymerization initiator (B); and water (C).
    Type: Application
    Filed: November 13, 2003
    Publication date: February 23, 2006
    Inventor: Shin Utsunomiya
  • Patent number: 6797452
    Abstract: A photosensitive resin composition which includes a photosensitive saponified PVA having a pendant group derived from a quaternary styrylpyridinium or styrylquinolinium, or a derivative thereof. The composition comprises a photosensitive saponified PVA which has structural units represented by formulas (1) to (4): which product is dissolved in at least one organic solvent selected from the group consisting of compounds represented by formulas (5), (6), and (7). The resin composition can be dissolved in a comparatively safe high-boiling-point solvent, such as propylene glycol, and can be developed with water.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: September 28, 2004
    Assignee: Toyo Gosei Kogyo Co., Ltd.
    Inventors: Masahiro Takano, Shin Utsunomiya, Nobuji Sakai, Noriaki Tochizawa
  • Publication number: 20030022104
    Abstract: A photosensitive resin composition which includes a photosensitive saponified PVA having a pendant group derived from a quaternary styrylpyridinium or styrylquinolinium, or a derivative thereof.
    Type: Application
    Filed: July 12, 2002
    Publication date: January 30, 2003
    Inventors: Masahiro Takano, Shin Utsunomiya, Nobuji Sakai, Noriaki Tochizawa
  • Publication number: 20010021750
    Abstract: The present invention provides a cross-linkable polymer compound which can be developed with an aqueous developer and exhibits excellent patterning properties; a photosensitive composition containing the same; and a pattern formation method employing the composition.
    Type: Application
    Filed: January 16, 2001
    Publication date: September 13, 2001
    Inventors: Shin Utsunomiya, Seigo Yamada
  • Patent number: 5413981
    Abstract: A method for manufacturing the oxide superconductor according to the present invention comprises the steps of: mixing a starting material including Bi, Sr, Ca and Cu such that a mole ratio of Bi, Sr, Ca and Cu is 2:2+a:1+b:2+c, wherein a.gtoreq.0, b.gtoreq.0, c.gtoreq.0, and 0<a+b+c<3; melting the mixed material at a temperature of 900.degree. C.-1500.degree. C.; quenching rapidly the molten material; and annealing the quenched material at a partial molten temperature of 800.degree. C.-1000.degree. C. This method gives product wherein a precipitate of at least one compound in the group SrO, CuO and (Ca.sub.1-x Sr.sub.x).sub.2 CuO.sub.3 (wherein 0.gtoreq.x<1) is finely dispersed in the superconducting crystal of Bi.sub.2 Sr.sub.2 Ca.sub.1 Cu.sub.2 O.sub.y (wherein y is about 8). The precipitates act as flux pinning centers.
    Type: Grant
    Filed: July 19, 1993
    Date of Patent: May 9, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kunihiko Egawa, Toshio Umemura, Shinichi Kinouchi, Mitsunobu Wakata, Shin Utsunomiya, Ayumi Nozaki
  • Patent number: 4886108
    Abstract: A method for forming a fiber-reinforced metal sheet including the steps of preparing a wire preform in which fibers and a matrix are combined together; arranging regularly a plurality of wire preforms in a predetermined direction in a side-by-side relation; irradiating simultaneously using a CO.sub.2 laser beam, and a YAG laser beam the regularly arranged wire preforms to elevate the temperature of the wire preforms; and pressing the wire preforms by rollers while the wire preforms are at the elevated temperature.
    Type: Grant
    Filed: September 28, 1988
    Date of Patent: December 12, 1989
    Assignees: Agency of Industrial Science and Technology, Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shin Utsunomiya, Mitsuhiro Okumura, Takeshi Morita
  • Patent number: 4228944
    Abstract: Substrates made of a metal or an alloy are bonded by coating a brazing flux incorporating a metallic powder or a metal compound powder on the surface of the substrate having a melting point of higher than 700.degree. C.; and heating them at a temperature higher than a melting point of the flux but lower than a melting point of the metal of the metallic powder or the metal compound powder whereby a molten crystallization and a mutual diffusion are caused between the substrates and the metal activated by the molten flux.
    Type: Grant
    Filed: October 24, 1978
    Date of Patent: October 21, 1980
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Minoru Inamura, Noboru Takeuchi, Kazuhiro Inukai, Kentaro Taninouchi, Shin Utsunomiya