Abstract: The present disclosure relates to methods, apparatuses, and computer programs for processing computed tomography images. Precise segmentation of the left atrium (LA) in computed tomography (CT) images constitutes a crucial preparatory step for catheter ablation in atrial fibrillation (AF). We aim to apply deep convolutional neural networks (DCNNs) to automate the LA detection/segmentation procedure and create a three-dimensional (3D) geometries. The deep learning provides an efficient and accurate way for automatic contouring and LA volume calculation based on the construction of the 3D LA geometry. Non-pulmonary vein (NPV) trigger has been reported as an important predictor of recurrence post atrial fibrillation (AF) ablation. Elimination of NPV triggers can reduce the post-ablation AF recurrence. The deep learning was applied in pre-ablation pulmonary vein computed tomography (PVCT) geometric slices to create a prediction model for NPV triggers in patients with paroxysmal atrial fibrillation (PAF).

Abstract: The present disclosure relates to methods, apparatuses, and computer programs for processing computed tomography images. Precise segmentation of the left atrium (LA) in computed tomography (CT) images constitutes a crucial preparatory step for catheter ablation in atrial fibrillation (AF). We aim to apply deep convolutional neural networks (DCNNs) to automate the LA detection/segmentation procedure and create a three-dimensional (3D) geometries. The deep learning provides an efficient and accurate way for automatic contouring and LA volume calculation based on the construction of the 3D LA geometry. Non-pulmonary vein (NPV) trigger has been reported as an important predictor of recurrence post atrial fibrillation (AF) ablation. Elimination of NPV triggers can reduce the post-ablation AF recurrence. The deep learning was applied in pre-ablation pulmonary vein computed tomography (PVCT) geometric slices to create a prediction model for NPV triggers in patients with paroxysmal atrial fibrillation (PAF).

Abstract: A method for estimating stress of an electronic component. An electronic component including first and second elements and conductive bumps is provided. Each conductive bump has two surfaces connected to the first and second elements respectively. Two adjacent conductive bumps have a pitch therebetween. The conductive bumps includes a first conductive bump and second conductive bumps. A stress value of the first conductive bump related to a testing parameter is calculated. A stress value of each second conductive bump related to the testing parameter is calculated according to a first calculating formula. The first calculating formula is ? 2 = L D - 2 ? r ? ? 1 , ?2 is the stress of each second conductive bump, L is a beeline distance between each second conductive bump and the first conductive bump, D is an average value of the pitches of the conductive bumps, r is a radius of each surface, and ?1 is the stress value of the first conductive bump.

Abstract: A method for estimating stress of an electronic component. An electronic component including first and second elements and conductive bumps is provided. Each conductive bump has two surfaces connected to the first and second elements respectively. Two adjacent conductive bumps have a pitch therebetween. The conductive bumps includes a first conductive bump and second conductive bumps. A stress value of the first conductive bump related to a testing parameter is calculated. A stress value of each second conductive bump related to the testing parameter is calculated according to a first calculating formula. The first calculating formula is ? 2 = L D - 2 ? r ? ? 1 , ?2 is the stress of each second conductive bump, L is a beeline distance between each second conductive bump and the first conductive bump, D is an average value of the pitches of the conductive bumps, r is a radius of each surface, and ?1 is the stress value of the first conductive bump.

Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.

Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.

Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract: A polyamic acid resin composition, and a polyimide film and laminate prepared therefrom are provided. The polyamic acid resin composition includes a polyamic acid resin, a solvent, and a polar aprotic solution containing nanoscale silica, with surface hydroxyl groups, modified by a surface modification agent. Particularly, the surface modification agent has a structure represented by formula (I): R1—Si—(OR2)3??formula (I) wherein, R1 is an aliphatic group or an aryl group, and R2 is a C1-8 alkyl group.

Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention.

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

Abstract: An apparatus, system and method which use a portable sensor to monitor the physical and mental reactions of a person in motion. The physical and mental reactions in motion will be transformed into the related physical and mental characteristic vectors, which are used to build up a personalized physical and mental database. The database executes a self-learning algorithm to output a set of physical and mental weighting factors. After executing the set of physical and mental weighting factors and physical and mental characteristic vectors, an embedded calculator incorporated in the portable sensor gives a warning signal if an abnormal situation is detected.

Abstract: The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C?C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

Abstract: A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.

Abstract: The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C?C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

Abstract: A coating composition of positive photosensitive polyimide is disclosed, which includes an organic solvent and the following components dissolved in the organic solvent: (a) a polyimide having a phenolic hydroxyl group or carboxyl group at the end of a principal chain of the polymer; (b) a compound having a phenolic hydroxyl group; and (c) a quinonediazide sulfonate as a photosensitive agent. The amount of the components (b) and (c) are 1-50 parts by weight per 100 parts by weight the component (a) in the coating composition. A film of the coating composition can be developed with an alkaline aqueous solution, which has a high photosensitivity, excellent resolution, low post-cure temperature, high film residual rate in thickness, and a pattern having a tapered-angle at the cross section. The coating solution can be used for forming an insulating layer in displays or in other suitable applications.

Abstract: A MOSFET structure utilizing strained silicon carbon alloy and fabrication method thereof. The MOSFET structure includes a substrate, a graded SiGe layer, a relaxed buffer layer, a strained silicon carbon alloy channel layer, a gate dielectric layer, a polysilicon gate electrode (or metal gate electrode) and a source/drain region.

Abstract: The present invention relates to ink jet recording materials and method for making the same. The material has a gel layer formed on a base material to improve the optical density of the material and improve the printing quality of ink of pigment type. The method for forming the gel layer is to coat a first ink-receptive layer composed of high valance metallic halide, such as calcium chloride (CaCl2) or magnesium chloride (MgCl2), on the base layer, then a second ink-receptive layer composed of alginate, such as sodium alginate, potassium alginate or other compounds of alginic acid, on the first ink-receptive layer. The second and the first ink-receptive layers will react to form a gel layer during coating for absorbing ink dots and improving print quality.