Patents by Inventor Shingo FUKASAWA

Shingo FUKASAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9099524
    Abstract: A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on ?Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: August 4, 2015
    Assignee: FASFORD TECHNOLOGY CO., LTD.
    Inventors: Yoshiaki Makita, Shingo Fukasawa
  • Patent number: 8460491
    Abstract: The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained. In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: June 11, 2013
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Shingo Fukasawa, Tatsuyuki Okubo, Yoshihiro Kurihara
  • Publication number: 20130014881
    Abstract: A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source.
    Type: Application
    Filed: September 6, 2011
    Publication date: January 17, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Shingo FUKASAWA, Koji Hosaka
  • Publication number: 20130016205
    Abstract: A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on ?Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.
    Type: Application
    Filed: September 2, 2011
    Publication date: January 17, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yoshiaki MAKITA, Shingo Fukasawa
  • Publication number: 20130014904
    Abstract: A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
    Type: Application
    Filed: September 6, 2011
    Publication date: January 17, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Koji HOSAKA, Shingo Fukasawa