Abstract: A bending portion of an endoscope according to the disclosure includes: a plurality of bending pieces rotatably coupled to each other by a coupling fastener; a wire configured to transmit a traction operating force to a first bending piece included in the plurality of bending pieces; and a pin located in a first hole in the first bending piece, the pin connecting the wire to the first bending piece, a first end portion of the pin protruding from an outer circumference of the first bending piece, a second end portion of the pin protruding from an inner circumference of the first bending piece, a third portion of the pin contacts a surface of the first hole. A first width dimension of the first end portion is larger than an opening dimension of the first hole, the wire is attached to the second end portion.

Abstract: Provided is a pipe joining body in which a wire rod and a tubular member are joined. The wire rod includes a concave portion formed by plastically deforming a part of an outer periphery of the wire rod. The tubular member includes a deformed portion that is formed so as to enter the concave portion by inserting the wire rod into the tubular member and by pressing a portion of the tubular member covering the concave portion toward the concave portion to plastically deform the portion. A maximum displacement amount of the tubular member when the deformed portion is formed is not larger than a maximum displacement amount of the wire rod by the plastic deformation when the concave portion is formed. The concave portion is formed by bringing a mold having a convex surface into contact with the part of the outer periphery of the wire rod to press.

Abstract: Provided is a pipe joining body in which a wire rod and a tubular member are joined. The wire rod includes a concave portion formed by plastically deforming a part of an outer periphery of the wire rod. The tubular member includes a deformed portion that is formed so as to enter the concave portion by inserting the wire rod into the tubular member and by pressing a portion of the tubular member covering the concave portion toward the concave portion to plastically deform the portion. A maximum displacement amount of the tubular member when the deformed portion is formed is not larger than a maximum displacement amount of the wire rod by the plastic deformation when the concave portion is formed. The concave portion is formed by bringing a mold having a convex surface into contact with the part of the outer periphery of the wire rod to press.

Abstract: A method for manufacturing a treatment tool is provided. The treatment tool includes: a function body having an elastic wire formed of a wire material made of a super-elastic material and having a predetermined shape, and a fixing portion having an insertion hole into which the elastic wire is insertable to house a proximal end portion of the elastic wire in the insertion hole; a tube portion configured to house the function body; and an operation unit configured to insert and remove the function body into and from the tube portion. The method includes: inserting the proximal end portion of the elastic wire into the insertion hole of the fixing portion; forming, at the proximal end portion of the elastic wire, an engagement portion for engaging with the insertion hole of the fixing portion; and fixing the proximal end portion of the elastic wire to the fixing portion.

Abstract: A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern.

Abstract: A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern.

Abstract: A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern.