Patents by Inventor Shingo IKARASHI

Shingo IKARASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959709
    Abstract: A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that in the cross-section A, the holes of second flow passages are separated by meandering partition plates and are disposed in a layered manner. Two adjacent partition plates are a partition plate B and a partition plate C, and when comparing a point ?, which is the top point of a mountain in the partition plate B closest to the partition plate C, and a point ?, which is the bottom point of a valley in the partition plate C closest to the partition plate B, the point ? is closer to the partition plate C side than the point ?. Requirement 3 is that the first flow passages are present inside the partition plates.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: April 16, 2024
    Assignee: WELCON INC.
    Inventors: Yutaka Suzuki, Takashi Saito, Shingo Ikarashi
  • Patent number: 11948860
    Abstract: A multilayer heat sink including a heat-receiving layer, a channel layer including cooling micropaths extending and directing a fluid in a direction orthogonal to a stacking direction, an orifice layer including jet orifices configured to jet the fluid into the cooling micropaths, and drain orifices configured to drain the fluid from the cooling micropaths, a header layer including a peripheral wall and a baffle, and a bottom layer, wherein the baffle includes parallel plates disposed parallel to each other, and end plates configured to alternately close an opening at an end and an opening at an opposite end of the parallel plates, and the orifice layer, the bottom layer, the baffle, and the peripheral wall define a supply channel to guide the fluid from a fluid inlet to the jet orifices and a drain channel to guide the fluid from the drain orifices to a fluid outlet.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: April 2, 2024
    Assignee: WELCON Inc.
    Inventors: Yutaka Suzuki, Takashi Saito, Shingo Ikarashi
  • Patent number: 11384992
    Abstract: A heat exchanger includes a first flow channel and a second flow channel that are alternately stacked in a stacking direction, each of the first flow channel and the second flow channel including: upstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; downstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; and branching/merging parts configured to branch the flow channels immediately upstream of the branching/merging parts into two divergent channels and merge the divergent channels adjacent to one another to form next flow channels, between the upstream parts and the downstream parts, wherein the branching/merging parts are provided in a plurality of stages between the upstream parts and the downstream parts.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: July 12, 2022
    Assignee: WELCON Inc.
    Inventors: Yutaka Suzuki, Takashi Saito, Hiroaki Kimura, Shingo Ikarashi
  • Publication number: 20210270536
    Abstract: A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that the holes of the second flow passages are disposed so as to be aligned in the left-right direction and to form layers in the up-down direction; and when comparing layers with holes adjacent in the up-down direction, the holes of the second flow passages are not disposed at the same position in the left-right direction. Requirement 3 is that the first flow passages exist between the layers with holes adjacent in the up-down direction, and the first flow passages meander in the up-down direction so as to avoid the holes of the second flow passages in the layers with holes that are sandwiched in the up-down direction.
    Type: Application
    Filed: June 27, 2018
    Publication date: September 2, 2021
    Applicant: WELCON INC.
    Inventors: Yutaka SUZUKI, Takashi SAITO, Shingo IKARASHI
  • Publication number: 20210270545
    Abstract: A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that in the cross-section A, the holes of second flow passages are separated by meandering partition plates and are disposed in a layered manner. Two adjacent partition plates are a partition plate B and a partition plate C, and when comparing a point ?, which is the top point of a mountain in the partition plate B closest to the partition plate C, and a point ?, which is the bottom point of a valley in the partition plate C closest to the partition plate B, the point ? is closer to the partition plate C side than the point ?. Requirement 3 is that the first flow passages are present inside the partition plates.
    Type: Application
    Filed: June 27, 2018
    Publication date: September 2, 2021
    Inventors: Yutaka SUZUKI, Takashi SAITO, Shingo IKARASHI
  • Publication number: 20200258815
    Abstract: A multilayer heat sink including a heat-receiving layer, a channel layer including cooling micropaths extending and directing a fluid in a direction orthogonal to a stacking direction, an orifice layer including jet orifices configured to jet the fluid into the cooling micropaths, and drain orifices configured to drain the fluid from the cooling micropaths, a header layer including a peripheral wall and a baffle, and a bottom layer, wherein the baffle includes parallel plates disposed parallel to each other, and end plates configured to alternately close an opening at an end and an opening at an opposite end of the parallel plates, and the orifice layer, the bottom layer, the baffle, and the peripheral wall define a supply channel to guide the fluid from a fluid inlet to the jet orifices and a drain channel to guide the fluid from the drain orifices to a fluid outlet.
    Type: Application
    Filed: August 29, 2017
    Publication date: August 13, 2020
    Applicant: WELCON Inc.
    Inventors: Yutaka SUZUKI, Takashi SAITO, Shingo IKARASHI
  • Publication number: 20200182551
    Abstract: A heat exchanger includes a first flow channel and a second flow channel that are alternately stacked in a stacking direction, each of the first flow channel and the second flow channel including: upstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; downstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; and branching/merging parts configured to branch the flow channels immediately upstream of the branching/merging parts into two divergent channels and merge the divergent channels adjacent to one another to form next flow channels, between the upstream parts and the downstream parts, wherein the branching/merging parts are provided in a plurality of stages between the upstream parts and the downstream parts.
    Type: Application
    Filed: August 29, 2017
    Publication date: June 11, 2020
    Applicant: WELCON Inc.
    Inventors: Yutaka SUZUKI, Takashi SAITO, Hiroaki KIMURA, Shingo IKARASHI