Patents by Inventor Shingo Ishida

Shingo Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240189215
    Abstract: Provided is a composition having an excellent ultraviolet protection effect and being unlikely to cause uneven suntan even if the application is uneven. A film-forming composition contains components (a) and (b): (a) a nonvolatile oil containing an ultraviolet absorber; and (b) a fiber having an average fiber diameter of 0.1 ?m or more and 7 ?m or less in an amount of 0.5 mass % or more and 10 mass % or less in the film-forming composition, and the (average fiber diameter)2/(fiber content) (?m2/mass %) is 0.005 or more and 7 or less.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 13, 2024
    Applicant: KAO CORPORATION
    Inventors: Tatsuya FUJIMOTO, Shingo HIRONO, Kaori ISHIDA, Hideo KOBAYASHI
  • Publication number: 20240168389
    Abstract: The present invention provides a determination method of determining a recipe for arranging a composition as a plurality of droplets on a substrate in a forming process of forming the composition on the substrate using a mold, comprising: setting a grid for defining a first pitch as a pitch in a first direction between the droplets and a second pitch as a pitch in a second direction between the droplets, the second direction intersecting the first direction; and determining the recipe based on the grid, wherein the grid is set, based on information representing a relationship between a pitch ratio as a ratio of the first pitch and the second pitch and the number of defects occurring in the composition in the forming process, so that the number of defects is smaller than a predetermined value.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 23, 2024
    Inventor: SHINGO ISHIDA
  • Patent number: 11970004
    Abstract: A liquid discharge head includes a liquid discharge substrate that has a discharge-orifice row, pressure generating elements, and pressure chambers. The liquid discharge head discharges a liquid in a block-by-block manner using sequential driving. The discharge-orifice row is disposed so as to incline at an angle ?=Arctan (d1/d2) relative to a direction extending orthogonal to the conveyance direction of the medium, in which d1 (?m) is a disposition spacing of the discharge orifices in the discharge-orifice row in the conveyance direction and d2 (?m) is a disposition spacing of the discharge orifices in the discharge-orifice row in the direction orthogonal to the conveyance direction. A partition wall is formed between adjacent pressure chambers so as to separate the adjacent pressure chambers from each other. The partition wall has a communicating portion that communicates the adjacent pressure chambers with each other.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: April 30, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Sato, Shuzo Iwanaga, Takatsugu Moriya, Koichi Ishida, Shingo Okushima, Shintaro Kasai, Yoshiyuki Nakagawa, Akiko Hammura
  • Publication number: 20240112850
    Abstract: To suppress deformation of a mounting portion, a coil component includes a drum core including a winding core portion, a first flange portion, and a second flange portion. The coil component includes a first metal terminal. The first metal terminal includes a joining portion, a mounting portion, and an extending portion. A first wire end of the first wire is connected to a surface of the joining portion facing a first positive direction. The mounting portion is located closest to the first positive direction in the first metal terminal. The extending portion connects the mounting portion and the joining portion. The extending portion includes a second portion having a thickness dimension smaller than the thickness dimension of the mounting portion.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 4, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hiroyuki HONDA, Takuya ISHIDA, Masayuki ISHIDA, Shingo NAKAMOTO
  • Patent number: 11890791
    Abstract: A method of controlling a control apparatus for controlling a forming apparatus operable to form a layer of a formable material on a substrate is provided. The method includes acquiring data that specifies a drop amount and a drop position on the substrate of each of droplets, calculating a spread of each of the droplets assuming that a spread shape of each of the droplets is a polygon, and calculating a surface area of an overlapping region in which a region of a droplet that spreads into the polygon and a region of a recessed portion in the mold to be filled with the formable material overlap, and correcting, based on a result of the calculation, the data so that the recessed portion is filled with the formable material.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 6, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shingo Ishida
  • Publication number: 20210370558
    Abstract: A method of controlling a control apparatus for controlling a forming apparatus operable to form a layer of a formable material on a substrate is provided. The method includes acquiring data that specifies a drop amount and a drop position on the substrate of each of droplets, calculating a spread of each of the droplets assuming that a spread shape of each of the droplets is a polygon, and calculating a surface area of an overlapping region in which a region of a droplet that spreads into the polygon and a region of a recessed portion in the mold to be filled with the formable material overlap, and correcting, based on a result of the calculation, the data so that the recessed portion is filled with the formable material.
    Type: Application
    Filed: May 21, 2021
    Publication date: December 2, 2021
    Inventor: Shingo Ishida
  • Patent number: 11188058
    Abstract: An adjusting method for adjusting an imprint apparatus includes a preparation step of preparing a sample for evaluating a state in which a contact region of a test mold is in contact with an imprint material supplied on a substrate; an evaluation step of evaluating the sample; and an adjustment step of adjusting the imprint apparatus based on a result of evaluation obtained in the evaluation step. The contact region includes a flat region which does not include a pattern, the evaluation in the evaluation step includes a first evaluation, which is an evaluation of a state of the imprint material in the flat region, and the imprint apparatus is adjusted based on a result of the first evaluation in the adjustment step.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: November 30, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kunihiko Asada, Shingo Ishida, Kenta Sasa
  • Patent number: 11119122
    Abstract: There is provided a method for correcting a relative position between a probe card having a plurality of cantilever-type probes and an object to be inspected having a plurality of electrode pads, including: arranging a first group of cantilever-type probes among the plurality of cantilever-type probes in a first region and a second region; arranging a second group of cantilever-type probes among the plurality of cantilever-type probes in a third region and a fourth region; obtaining needle traces formed on the plurality of electrode pads, which are generated when the first group of cantilever-type probes and the second group of cantilever-type probes that are arranged in the first region, the second region, the third region, and the fourth region, are brought into contact with the plurality of electrode pads; and correcting the relative position between the probe card and the object to be inspected based on the obtained needle traces.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: September 14, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kunihiro Furuya, Shingo Ishida
  • Patent number: 10935884
    Abstract: The pattern forming method, which is a photo-nanoimprint technology, includes in this order: laying a layer formed of a curable composition (A1) containing at least a polymerizable compound on a surface of a substrate; dispensing liquid droplets of a curable composition (A2) containing at least a polymerizable compound dropwise discretely onto the layer of (A1) to lay the liquid droplets; sandwiching a layer obtained by partially mixing (A1) and (A2) between a mold and the substrate; of irradiating the layer obtained by partially mixing (A1) and (A2) with light from a side of the mold to cure the layer in one stroke; and releasing the mold from the layer formed of the curable compositions after the curing, in which a value Vr/Vc obtained by dividing a volume of (A2) per shot area (Vr) by a volume of (A1) (Vc) is 4 or more and 15 or less.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: March 2, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiko Chiba, Shingo Ishida, Toshiaki Ando, Toshiki Ito, Timothy Brian Stachowiak, Weijun Liu
  • Patent number: 10915032
    Abstract: To provide a cleaning apparatus advantageous for cleaning, for example, an original plate used to transfer a pattern to a substrate. Provided is a cleaning apparatus that cleans an original plate used when a pattern is transferred to a substrate, the cleaning apparatus including a region dividing unit which divides the original plate into a plurality of regions on the basis of information of the original plate, a conditions generator which generates cleaning conditions for each of the separate regions, and a cleaner which cleans the original plate on the basis of the cleaning conditions.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: February 9, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shingo Ishida
  • Patent number: 10607876
    Abstract: A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: March 31, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasushi Fujii, Akihiko Nakamura, Yasumasa Iwata, Shingo Ishida
  • Publication number: 20200026204
    Abstract: To provide a cleaning apparatus advantageous for cleaning, for example, an original plate used to transfer a pattern to a substrate. Provided is a cleaning apparatus that cleans an original plate used when a pattern is transferred to a substrate, the cleaning apparatus including a region dividing unit which divides the original plate into a plurality of regions on the basis of information of the original plate, a conditions generator which generates cleaning conditions for each of the separate regions, and a cleaner which cleans the original plate on the basis of the cleaning conditions.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 23, 2020
    Inventor: Shingo Ishida
  • Publication number: 20190391484
    Abstract: The pattern forming method, which is a photo-nanoimprint technology, includes in this order: laying a layer formed of a curable composition (A1) containing at least a polymerizable compound on a surface of a substrate; dispensing liquid droplets of a curable composition (A2) containing at least a polymerizable compound dropwise discretely onto the layer of (A1) to lay the liquid droplets; sandwiching a layer obtained by partially mixing (A1) and (A2) between a mold and the substrate; of irradiating the layer obtained by partially mixing (A1) and (A2) with light from a side of the mold to cure the layer in one stroke; and releasing the mold from the layer formed of the curable compositions after the curing, in which a value Vr/Vc obtained by dividing a volume of (A2) per shot area (Vr) by a volume of (A1) (Vc) is 4 or more and 15 or less.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 26, 2019
    Inventors: Keiko Chiba, Shingo Ishida, Toshiaki Ando, Toshiki Ito, Timothy Brian Stachowiak, Weijun Liu
  • Publication number: 20190277884
    Abstract: There is provided a method for correcting a relative position between a probe card having a plurality of cantilever-type probes and an object to be inspected having a plurality of electrode pads, including: arranging a first group of cantilever-type probes among the plurality of cantilever-type probes in a first region and a second region; arranging a second group of cantilever-type probes among the plurality of cantilever-type probes in a third region and a fourth region; obtaining needle traces formed on the plurality of electrode pads, which are generated when the first group of cantilever-type probes and the second group of cantilever-type probes that are arranged in the first region, the second region, the third region, and the fourth region, are brought into contact with the plurality of electrode pads; and correcting the relative position between the probe card and the object to be inspected based on the obtained needle traces.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 12, 2019
    Inventors: Kunihiro FURUYA, Shingo ISHIDA
  • Patent number: 10081172
    Abstract: A method of preparing a laminate, in which the laminate has a substrate and a support plate, and is provided with a release layer capable of being altered by irradiation with infrared ray, the method including forming the release layer on only a periphery of one of the substrate and the support plate; and laminating the substrate and the support plate through the release layer and a first adhesive layer.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: September 25, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Shingo Ishida, Takahiro Yoshioka
  • Patent number: 9962915
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: May 8, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Takahiro Setaka, Shingo Ishida
  • Patent number: 9881829
    Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: January 30, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takahiro Yoshioka, Koki Tamura, Hirofumi Imai, Atsushi Kubo, Yasumasa Iwata, Shingo Ishida
  • Publication number: 20170185074
    Abstract: An adjusting method for adjusting an imprint apparatus includes a preparation step of preparing a sample for evaluating a state in which a contact region of a test mold is in contact with an imprint material supplied on a substrate; an evaluation step of evaluating the sample; and an adjustment step of adjusting the imprint apparatus based on a result of evaluation obtained in the evaluation step. The contact region includes a flat region which does not include a pattern, the evaluation in the evaluation step includes a first evaluation, which is an evaluation of a state of the imprint material in the flat region, and the imprint apparatus is adjusted based on a result of the first evaluation in the adjustment step.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 29, 2017
    Inventors: Kunihiko Asada, Shingo Ishida, Kenta Sasa
  • Publication number: 20170148659
    Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.
    Type: Application
    Filed: February 6, 2017
    Publication date: May 25, 2017
    Inventors: Takahiro YOSHIOKA, Koki TAMURA, Hirofumi IMAI, Atsushi KUBO, Yasumasa IWATA, Shingo ISHIDA
  • Patent number: 9607875
    Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: March 28, 2017
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takahiro Yoshioka, Koki Tamura, Hirofumi Imai, Atsushi Kubo, Yasumasa Iwata, Shingo Ishida