Patents by Inventor Shingo Ishiguri

Shingo Ishiguri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11382209
    Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: July 5, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
  • Patent number: 11342259
    Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: May 24, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
  • Patent number: 10980160
    Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: April 13, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
  • Publication number: 20210074626
    Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.
    Type: Application
    Filed: November 2, 2020
    Publication date: March 11, 2021
    Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
  • Patent number: 10861785
    Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 8, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
  • Publication number: 20200100408
    Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 26, 2020
    Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
  • Publication number: 20190385940
    Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 19, 2019
    Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
  • Publication number: 20190342991
    Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 7, 2019
    Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
  • Patent number: 10302895
    Abstract: A composite plastic lens including: a lens having a convex surface, a lens back surface, and a protrusion formed on at least part of an periphery; and a holder, the lens and the holder being molded integrally, wherein the cross-sectional shape of at least part of the lens including an optical axis on the convex surface side is such that a profile line on the convex surface side is curved in a direction getting closer to the lens back side as it goes from the optical axis side toward a turning point out of an optical effective area, and the cross sectional shape of the protrusion is inverted from the turning point out of the optical effective area toward the periphery in a direction away from the lens back surface, and the holder is fitted to the protrusion so as to include the turning point and is molded integrally on the peripheral side of the resin lens.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: May 28, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Ishiguri, Shusuke Tobita
  • Publication number: 20170131512
    Abstract: A composite plastic lens including: a lens having a convex surface, a lens back surface, and a protrusion formed on at least part of an periphery; and a holder, the lens and the holder being molded integrally, wherein the cross-sectional shape of at least part of the lens including an optical axis on the convex surface side is such that a profile line on the convex surface side is curved in a direction getting closer to the lens back side as it goes from the optical axis side toward a turning point out of an optical effective area, and the cross sectional shape of the protrusion is inverted from the turning point out of the optical effective area toward the periphery in a direction away from the lens back surface, and the holder is fitted to the protrusion so as to include the turning point and is molded integrally on the peripheral side of the resin lens.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Inventors: Shingo Ishiguri, Shusuke Tobita
  • Patent number: 9581784
    Abstract: A composite plastic lens including: a lens having a convex surface, a lens back surface, and a protrusion formed on at least part of an periphery; and a holder, the lens and the holder being molded integrally, wherein the cross-sectional shape of at least part of the lens including an optical axis on the convex surface side is such that a profile line on the convex surface side is curved in a direction getting closer to the lens back side as it goes from the optical axis side toward a turning point out of an optical effective area, and the cross sectional shape of the protrusion is inverted from the turning point out of the optical effective area toward the periphery in a direction away from the lens back surface, and the holder is fitted to the protrusion so as to include the turning point and is molded integrally on the peripheral side of the resin lens.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: February 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Ishiguri, Shusuke Tobita
  • Publication number: 20140334019
    Abstract: A composite plastic lens including: a lens having a convex surface, a lens back surface, and a protrusion formed on at least part of an periphery; and a holder, the lens and the holder being molded integrally, wherein the cross-sectional shape of at least part of the lens including an optical axis on the convex surface side is such that a profile line on the convex surface side is curved in a direction getting closer to the lens back side as it goes from the optical axis side toward a turning point out of an optical effective area, and the cross sectional shape of the protrusion is inverted from the turning point out of the optical effective area toward the periphery in a direction away from the lens back surface, and the holder is fitted to the protrusion so as to include the turning point and is molded integrally on the peripheral side of the resin lens.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 13, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Shingo Ishiguri, Shusuke Tobita