Patents by Inventor Shingo Iwasa

Shingo Iwasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method
    Patent number: 6757946
    Abstract: A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: July 6, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Norihiko Takada, Hisamitsu Kamenaga, Shingo Iwasa
  • Surface acoustic wave device and method for manufacturing the same
    Patent number: 6414415
    Abstract: A surface acoustic wave device includes a package having an element mounting surface, a surface acoustic wave element provided in the package and having at least one bonding electrode, an adhesive arranged such that the surface acoustic wave element is fixed to the element mounting surface of the package, and at least one bonding wire connected to the at least one bonding electrode. The at least one bonding electrode has at least one line-shaped through hole extending therethrough at a region where the at least one bonding wire is connected to the at least one bonding electrode.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: July 2, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Shibutani, Toshiyuki Fuyutsume, Shingo Iwasa
  • Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus
    Publication number: 20010022484
    Abstract: A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.
    Type: Application
    Filed: March 8, 2001
    Publication date: September 20, 2001
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Norihiko Takada, Hisamitsu Kamenaga, Shingo Iwasa
  • Display screen with graphical user interface
    Patent number: D987671
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 30, 2023
    Assignee: FUJITSU GENERAL LIMITED
    Inventors: Shingo Iwasa, Koji Fukuda
  • Remote controller for air conditioner
    Patent number: D1007342
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: December 12, 2023
    Assignee: FUJITSU GENERAL LIMITED
    Inventor: Shingo Iwasa