Abstract: A wiring board (10) includes a transparent substrate (20) and a conductor pattern (30) provided on the transparent substrate (20), the conductor pattern (30) includes at least one detection electrode (31) having a mesh shape configured by first fine wires (311) and (312) intersecting each other, and the detection electrode (31) includes first disconnection portions (314) provided in parts except intersection points (315) in the first fine wires (311) and (312).

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

Abstract: A stretchable circuit board includes: a stretchable base; a stretchable wiring formed on the stretchable base; an electronic component mounted on the stretchable base; and a connecting section that electrically connects between the electronic component and the stretchable wiring, and is stretchable and formed such that its Young's modulus is greater than or equal to that of the stretchable wiring. In addition, the stretchable circuit board includes a stretchable insulating film formed on the stretchable base and the stretchable wiring excluding a place where the connecting section is formed.

Abstract: A wiring body includes a first conductor layer, a second conductor layer, and a first insulation layer interposed between the first and second conductor layers. The first conductor layer includes a first electrode, a first lead wire electrically connected to the first electrode, and a first shield layer electrically insulated from the first electrode and the first lead wire. The second conductor layer includes a second electrode that faces the first electrode and a second lead wire electrically connected to the second electrode. The first electrode, the first lead wire, and the first shield layer are formed on substantially same plane. The second electrode and the second lead wire are formed on substantially same plane. A part of the second lead wire overlaps the first shield layer in a plan view. The first conductor layer includes a noncontact surface that is not in contact with the first insulation layer.

Abstract: A wiring body for a touch sensor includes a first resin layer, a first conductor layer provided on the first resin layer and including a first conductor line, a second resin layer covering the first conductor layer, and a second conductor layer provided above the first conductor layer via the second resin layer and including a second conductor line. The first and second conductor layers are electrically insulated by the second resin layer, a following Expression is satisfied: D1<D2. D1 is a thickness of the first resin layer in a first region corresponding to the first conductor line in a first predetermined cross-section that crosses the wiring body along the second conductor line, and D2 is a thickness of the second resin layer in the first region of the first predetermined cross-section.

Abstract: A wiring body includes an resin layer, a reticular electrode layer that includes first conductor wires arranged into the shape of a reticulation disposed on the resin layer, and a lead-out wiring layer connected to the reticular electrode layer disposed on the resin layer. The lead-out wiring layer includes a reticulation portion configured by gathering unit reticulations formed by being surrounded by second conductor wires. The second conductor wires are inclined with respect to an extending direction of the lead-out wiring layer. The unit reticulation includes an end portion that is an intersection point between the second conductor wires. The lead-out wiring layer includes a lateral end portion formed by arranging the unit reticulations side by side along the extending direction of the lead-out wiring layer. The lateral end portion of the lead-out wiring layer is closed by the second conductor wires.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring board (10) includes a transparent substrate (20) and a conductor pattern (30) provided on the transparent substrate (20), the conductor pattern (30) includes at least one detection electrode (31) having a mesh shape configured by first fine wires (311) and (312) intersecting each other, and the detection electrode (31) includes first disconnection portions (314) provided in parts except intersection points (315) in the first fine wires (311) and (312).

Abstract: Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.

Abstract: Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.