Patents by Inventor Shingo TAKAKI

Shingo TAKAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 9337129
    Abstract: A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: May 10, 2016
    Assignee: Rohm Co., Ltd.
    Inventors: Koji Yasunaga, Shingo Takaki
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140291828
    Abstract: A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material
    Type: Application
    Filed: March 26, 2014
    Publication date: October 2, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Koji YASUNAGA, Shingo TAKAKI