Patents by Inventor Shingo Teragawa
Shingo Teragawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149343Abstract: Provided are a silver powder and a method of producing the same. The method of producing the silver powder includes a first surface smoothing step of causing fine silver particles having internal voids to mechanically collide with one another; a fine powder removal step of dispersing fine silver particles present after the first surface smoothing step using high-pressure airflow while removing fine powder; and a second surface smoothing step of causing fine silver particles present after the fine powder removal step to mechanically collide with one another.Type: ApplicationFiled: March 16, 2022Publication date: May 9, 2024Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Yuma HIGASHI, Shingo TERAGAWA
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Patent number: 11450447Abstract: This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.Type: GrantFiled: October 4, 2017Date of Patent: September 20, 2022Assignee: SOLAR PASTE, LLCInventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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Patent number: 11441010Abstract: This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.Type: GrantFiled: October 4, 2017Date of Patent: September 13, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo Teragawa, Takashi Hinotsu, Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang
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Patent number: 11227702Abstract: This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.Type: GrantFiled: April 4, 2019Date of Patent: January 18, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo Teragawa, Takashi Hinotsu, Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang
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Patent number: 11180672Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution being 30 to 95% by weight), which have an average primary particle diameter of greater than 100 nm and not greater than 300 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70% by weight) having a boiling point of 150 to 300° C.; and an acrylic dispersing agent (5% by weight or less with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.Type: GrantFiled: April 22, 2016Date of Patent: November 23, 2021Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo Teragawa, Takashi Hinotsu, Taro Torigoe, Shinichi Konno
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Patent number: 11072715Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.Type: GrantFiled: April 4, 2019Date of Patent: July 27, 2021Assignee: E I DU PONT DE NEMOURS AND COMPANYInventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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Publication number: 20200317935Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000 ° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.Type: ApplicationFiled: April 4, 2019Publication date: October 8, 2020Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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Publication number: 20200321139Abstract: This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.Type: ApplicationFiled: April 4, 2019Publication date: October 8, 2020Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo TERAGAWA, Takashi HINOTSU, Dave HUI, Michael Stephen WOLFE, Howard David GLICKSMAN, Haixin YANG
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Publication number: 20190103200Abstract: This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.Type: ApplicationFiled: October 4, 2017Publication date: April 4, 2019Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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Publication number: 20190100641Abstract: This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.Type: ApplicationFiled: October 4, 2017Publication date: April 4, 2019Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo TERAGAWA, Takashi HINOTSU, Dave HUI, Michael Stephen WOLFE, Howard David GLICKSMAN, Haixin YANG
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Publication number: 20180179409Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution being 30 to 95% by weight), which have an average primary particle diameter of greater than 100 nm and not greater than 300 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70% by weight) having a boiling point of 150 to 300° C.; and an acrylic dispersing agent (5% by weight or less with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.Type: ApplicationFiled: April 22, 2016Publication date: June 28, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shingo Teragawa, Takashi Hinotsu, Taro Torigoe, Shinichi Konno