Patents by Inventor Shinichi Arakawa
Shinichi Arakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160254308Abstract: Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.Type: ApplicationFiled: May 13, 2016Publication date: September 1, 2016Inventor: SHINICHI ARAKAWA
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Patent number: 9077186Abstract: A power supply device includes a plurality of power supply units connected in parallel, and includes a positive electrode-side junction formed by the joining of positive electrode-side terminals of the plurality of power supply units and a negative electrode-side junction formed by the joining of negative electrode-side terminals of the plurality of power supply units. Each of the plurality of power supply units includes a battery unit, and a first relay that is provided between one of the positive and negative electrode-side junctions and the battery unit and is electrically disconnectably connected in series to the battery unit. Each of the plurality of power supply units includes a resistive element of which one end is connected between the first relay, which is connected to one of a positive electrode terminal and a negative electrode terminal of the battery unit, and the battery unit.Type: GrantFiled: April 25, 2012Date of Patent: July 7, 2015Assignee: Honda Motor Co., Ltd.Inventors: Shinichi Arakawa, Yasumichi Ohnuki
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Patent number: 9006852Abstract: Disclosed herein is a solid-state imaging element including: a transfer section configured to transfer charge generated simultaneously by a photoelectric conversion section in all pixels to a memory section and have a metal gate; and a light-shielding section formed by filling a metal into a groove portion formed by digging an interlayer insulating film around the transfer section.Type: GrantFiled: October 26, 2012Date of Patent: April 14, 2015Assignee: Sony CorporationInventor: Shinichi Arakawa
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Patent number: 8835991Abstract: There is provided a solid-state image pickup device including a semiconductor substrate, and a plurality of pixel portions that are provided on the semiconductor substrate. Each of the pixel portions includes a photoelectric converting unit that generates a charge on the basis of incident light, a memory unit that accumulates the charge generated by the photoelectric converting unit, a light shielding portion that shields at least the memory unit from light, a digging portion that digs into the semiconductor substrate between the photoelectric converting unit and the memory unit and is formed of a light shielding material, and a transmitting unit that transmits the charge from the photoelectric converting unit to the memory unit, by forming a channel for transmission in the digging portion.Type: GrantFiled: June 26, 2013Date of Patent: September 16, 2014Assignee: Sony CorporationInventor: Shinichi Arakawa
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Patent number: 8829636Abstract: A solid-state image pickup device has photodiodes, each of which includes an N-type region formed in a semiconductor substrate, a first silicon carbide layer formed above the N-type region, and a P-type region including a first silicon layer formed above the first silicon carbide layer and doped with boron. A fabrication process of such a solid-state image pickup device is also disclosed.Type: GrantFiled: August 20, 2010Date of Patent: September 9, 2014Assignee: Sony CorporationInventors: Tomokazu Ohchi, Yuki Miyanami, Shinichi Arakawa
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Patent number: 8787203Abstract: A virtual network control method, for adaptively controlling a topology of a virtual network formed on a physical network in response to environmental changes in the virtual network, is provided with: a step of storing the Langevin equation, as a fluctuation equation, which models the dynamics of the topology of the virtual network as a variable for controlling the number of wavelength paths on the physical network; a step of designing control parameters included in the fluctuation equation; and a step of controlling the topology of the virtual network by applying the control parameters to the fluctuation equation to change an order parameter included in the fluctuation equation when environmental changes occur in the virtual network, and by transitioning the solution of the fluctuation equation between attractors determined by the deterministic term of the fluctuation equation due to the fluctuation term of the fluctuation equation.Type: GrantFiled: January 27, 2011Date of Patent: July 22, 2014Assignees: Nippon Telegraph and Telephone Corporation, Osaka UniversityInventors: Takashi Miyamura, Kohei Shiomoto, Yuki Koizumi, Masayuki Murata, Shinichi Arakawa
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Publication number: 20140151754Abstract: A solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.Type: ApplicationFiled: February 10, 2014Publication date: June 5, 2014Applicant: Sony CorporationInventor: Shinichi Arakawa
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Patent number: 8691637Abstract: Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.Type: GrantFiled: December 22, 2011Date of Patent: April 8, 2014Assignee: Sony CorporationInventor: Shinichi Arakawa
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Patent number: 8643335Abstract: A power supply apparatus includes: a plurality of power supply units; a positive polarity coupling portion; and a negative polarity coupling portion; each of the power supply units is provided with: battery units; first relays connected in series to the battery units, capable of disconnecting electrical connection between the battery units and any one of the positive polarity coupling portion and the negative polarity coupling portion; resistor elements having one ends which are connected to the battery units between the battery units and the first relay; a resistor coupling portion; and a second relay connected to the resistor coupling portion, capable of disconnecting electrical connection between the resistor coupling portion and any one of the positive polarity coupling portion and the negative polarity coupling portion which is connected to the first relays, the second relay having fewer in number than the number of the power supply units.Type: GrantFiled: December 20, 2011Date of Patent: February 4, 2014Assignee: Honda Motor Co., Ltd.Inventors: Shinichi Arakawa, Yasumichi Ohnuki
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Publication number: 20140015013Abstract: There is provided a solid-state image pickup device including a semiconductor substrate, and a plurality of pixel portions that are provided on the semiconductor substrate. Each of the pixel portions includes a photoelectric converting unit that generates a charge on the basis of incident light, a memory unit that accumulates the charge generated by the photoelectric converting unit, a light shielding portion that shields at least the memory unit from light, a digging portion that digs into the semiconductor substrate between the photoelectric converting unit and the memory unit and is formed of a light shielding material, and a transmitting unit that transmits the charge from the photoelectric converting unit to the memory unit, by forming a channel for transmission in the digging portion.Type: ApplicationFiled: June 26, 2013Publication date: January 16, 2014Inventor: Shinichi Arakawa
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Publication number: 20130285611Abstract: A power supply apparatus includes: a plurality of power supply units; a positive polarity coupling portion; and a negative polarity coupling portion; each of the power supply units is provided with: battery units; first relays connected in series to the battery units, capable of disconnecting electrical connection between the battery units and any one of the positive polarity coupling portion and the negative polarity coupling portion; resistor elements having one ends which are connected to the battery units between the battery units and the first relay; a resistor coupling portion; and a second relay connected to the resistor coupling portion, capable of disconnecting electrical connection between the resistor coupling portion and any one of the positive polarity coupling portion and the negative polarity coupling portion which is connected to the first relays, the second relay having fewer in number than the number of the power supply units.Type: ApplicationFiled: December 20, 2011Publication date: October 31, 2013Applicant: HONDA MOTOR CO., LTD.Inventors: Shinichi Arakawa, Yasumichi Ohnuki
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Publication number: 20120294617Abstract: A virtual network control method, for adaptively controlling a topology of a virtual network formed on a physical network in response to environmental changes in the virtual network, is provided with: a step of storing the Langevin equation, as a fluctuation equation, which models the dynamics of the topology of the virtual network as a variable for controlling the number of wavelength paths on the physical network; a step of designing control parameters included in the fluctuation equation; and a step of controlling the topology of the virtual network by applying the control parameters to the fluctuation equation to change an order parameter included in the fluctuation equation when environmental changes occur in the virtual network, and by transitioning the solution of the fluctuation equation between attractors determined by the deterministic term of the fluctuation equation due to the fluctuation term of the fluctuation equation.Type: ApplicationFiled: January 27, 2011Publication date: November 22, 2012Inventors: Takashi Miyamura, Kohei Shiomoto, Yuki Koizumi, Masayuki Murata, Shinichi Arakawa
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Publication number: 20120274143Abstract: A power supply device includes a plurality of power supply units connected in parallel, and includes a positive electrode-side junction formed by the joining of positive electrode-side terminals of the plurality of power supply units and a negative electrode-side junction formed by the joining of negative electrode-side terminals of the plurality of power supply units. Each of the plurality of power supply units includes a battery unit, and a first relay that is provided between one of the positive and negative electrode-side junctions and the battery unit and is electrically disconnectably connected in series to the battery unit. Each of the plurality of power supply units includes a resistive element of which one end is connected between the first relay, which is connected to one of a positive electrode terminal and a negative electrode terminal of the battery unit, and the battery unit.Type: ApplicationFiled: April 25, 2012Publication date: November 1, 2012Applicant: HONDA MOTOR CO., LTD.Inventors: Shinichi ARAKAWA, Yasumichi OHNUKI
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Publication number: 20120115270Abstract: Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.Type: ApplicationFiled: December 22, 2011Publication date: May 10, 2012Applicant: SONY CORPORATIONInventor: Shinichi Arakawa
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Patent number: 8120684Abstract: Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.Type: GrantFiled: February 18, 2009Date of Patent: February 21, 2012Assignee: Sony CorporationInventor: Shinichi Arakawa
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Patent number: 8035230Abstract: This invention discloses a semiconductor device including an insulating film having a recess therein; an electric conductor formed inside the recess; a manganese silicate film formed on an upper surface of the conductor, the manganese silicate film being formed of a reaction product of a manganese with a silicon oxide insulating film. A method for manufacturing such a semiconductor device is also described.Type: GrantFiled: November 20, 2006Date of Patent: October 11, 2011Assignee: Sony CorporationInventor: Shinichi Arakawa
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Publication number: 20110204467Abstract: A solid-state image pickup device has photodiodes, each of which includes an N-type region formed in a semiconductor substrate, a first silicon carbide layer formed above the N-type region, and a P-type region including a first silicon layer formed above the first silicon carbide layer and doped with boron. A fabrication process of such a solid-state image pickup device is also disclosed.Type: ApplicationFiled: August 20, 2010Publication date: August 25, 2011Applicant: SONY CORPORATIONInventors: Tomokazu OHCHI, Yuki MIYANAMI, Shinichi ARAKAWA
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Patent number: 7851924Abstract: A semiconductor device including a substrate, a metal wiring on the substrate, an insulation film on the substrate covering the metal wiring, a connection hole in the insulation film which extends to a portion of the metal wiring, a via in the connection hole, and an alloy layer. The metal wiring includes a first metallic material, the alloy layer comprises a portion of the metal wiring and a second metallic material which is different than the first metallic material, and the via extends to the alloy layer.Type: GrantFiled: June 27, 2008Date of Patent: December 14, 2010Assignee: Sony CorporationInventor: Shinichi Arakawa
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Publication number: 20100151043Abstract: The present invention relates to a preparation for sterilizing or disinfecting a tissue which has an excellent tissue sterilizing or disinfecting ability and is suitable for therapeutic or prophylactic treatment of various diseases caused by a microorganism such as a bacterium or a virus and a method for sterilizing or disinfecting a tissue. The present invention relates to a preparation for sterilizing or disinfecting a tissue and an agent for therapeutic or prophylactic treatment of a periodontal disease, characterized by containing a gas in a nanobubble state. Furthermore, the present invention relates to the above-mentioned preparation for sterilizing or disinfecting a tissue, characterized in that the above-mentioned gas in a nanobubble state is ozone. Furthermore, the present invention relates to a liquid preparation for sterilizing or disinfecting a tissue, characterized by comprising ozone-nanobubble water.Type: ApplicationFiled: December 10, 2007Publication date: June 17, 2010Applicant: REO LABORATORY CO., LTD.Inventors: Yoshihiro Mano, Shinichi Arakawa, Kaneo Chiba
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Patent number: 7648920Abstract: A method of manufacturing a semiconductor device includes the steps of: forming recesses (a via hole and wiring grooves) in a insulation film; forming a seal layer on inside surfaces of the recesses by using a gas based on a silane having an alkyl group as a precursor; applying EB-cure or UV-cure to the seal layer; and filling up the recesses with a conductor.Type: GrantFiled: September 20, 2007Date of Patent: January 19, 2010Assignee: Sony CorporationInventor: Shinichi Arakawa