Patents by Inventor Shinichi Aya

Shinichi Aya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10023343
    Abstract: An automatic taking-out device is configured by providing a package holding unit that holds the package; a cutting unit that cuts the two packaging sheet materials of the package in a held state in two cutting spots that are respectively present between the joining portions and the contents and that face each other with the contents therebetween; a pair of suction units that respectively suction and hold the two packaging sheet materials inside the two cutting spots; a driving unit that moves at least one of the suction units in a direction separated from the contents; and an inclining unit that inclines the two packaging sheet materials inside the two cutting spots and the contents in a state where a positional deviation in an up-down direction occurs with respect to the two cutting spots, and drops the contents out of the two packaging sheet materials.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 17, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Shinichi Aya, Junichi Kinoshita
  • Publication number: 20180118399
    Abstract: An automatic taking-out device is configured by providing a package holding unit that holds the package; a cutting unit that cuts the two packaging sheet materials of the package in a held state in two cutting spots that are respectively present between the joining portions and the contents and that face each other with the contents therebetween; a pair of suction units that respectively suction and hold the two packaging sheet materials inside the two cutting spots; a driving unit that moves at least one of the suction units in a direction separated from the contents; and an inclining unit that inclines the two packaging sheet materials inside the two cutting spots and the contents in a state where a positional deviation in an up-down direction occurs with respect to the two cutting spots, and drops the contents out of the two packaging sheet materials.
    Type: Application
    Filed: December 27, 2017
    Publication date: May 3, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Shinichi AYA, Junichi KINOSHITA
  • Patent number: 9902520
    Abstract: An automatic taking-out device is configured by providing a package holding unit that holds the package; a cutting unit that cuts the two packaging sheet materials of the package in a held state in two cutting spots that are respectively present between the joining portions and the contents and that face each other with the contents therebetween; a pair of suction units that respectively suction and hold the two packaging sheet materials inside the two cutting spots; a driving unit that moves at least one of the suction units in a direction separated from the contents; and an inclining unit that inclines the two packaging sheet materials inside the two cutting spots and the contents in a state where a positional deviation in an up-down direction occurs with respect to the two cutting spots, and drops the contents out of the two packaging sheet materials.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: February 27, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Shinichi Aya, Junichi Kinoshita
  • Patent number: 9567121
    Abstract: A bundled object is obtained in which a plurality of overlapped articles is sufficiently strongly bundled and it is also easy to release the bundling. A bundled object 1 is configured to include a body-to-be-bundled 3 which is made by overlapping a plurality of articles 2 and has four marginal portions 3a each extending a direction orthogonal to an overlapping direction, and a strip-shaped plastic tape 4 which bundles the body-to-be-bundled 3 by winding around the body-to-be-bundled 3 once so as to pass over the four marginal portions 3a. Then, both end portions 4a and 4b other than a winding portion of the plastic tape 4 are overlapped on each other at a position away from the body-to-be-bundled 3 and close to one marginal portion 3a, and the overlapped tape both end portions 4a and 4b are welded to each other at a plurality of welded portions H.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: February 14, 2017
    Assignee: FUJIFILM Corporation
    Inventor: Shinichi Aya
  • Publication number: 20150314903
    Abstract: An automatic taking-out device is configured by providing a package holding unit that holds the package; a cutting unit that cuts the two packaging sheet materials of the package in a held state in two cutting spots that are respectively present between the joining portions and the contents and that face each other with the contents therebetween; a pair of suction units that respectively suction and hold the two packaging sheet materials inside the two cutting spots; a driving unit that moves at least one of the suction units in a direction separated from the contents; and an inclining unit that inclines the two packaging sheet materials inside the two cutting spots and the contents in a state where a positional deviation in an up-down direction occurs with respect to the two cutting spots, and drops the contents out of the two packaging sheet materials.
    Type: Application
    Filed: May 1, 2015
    Publication date: November 5, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Shinichi AYA, Junichi KINOSHITA
  • Publication number: 20140360904
    Abstract: A bundled object is obtained in which a plurality of overlapped articles is sufficiently strongly bundled and it is also easy to release the bundling. A bundled object 1 is configured to include a body-to-be-bundled 3 which is made by overlapping a plurality of articles 2 and has four marginal portions 3a each extending a direction orthogonal to an overlapping direction, and a strip-shaped plastic tape 4 which bundles the body-to-be-bundled 3 by winding around the body-to-be-bundled 3 once so as to pass over the four marginal portions 3a. Then, both end portions 4a and 4b other than a winding portion of the plastic tape 4 are overlapped on each other at a position away from the body-to-be-bundled 3 and close to one marginal portion 3a, and the overlapped tape both end portions 4a and 4b are welded to each other at a plurality of welded portions H.
    Type: Application
    Filed: June 10, 2014
    Publication date: December 11, 2014
    Inventor: Shinichi AYA
  • Patent number: 7115012
    Abstract: In a discharge tube manufacture line, electrode clamps are attached to both sides of an electrode lead except on a predetermined adhesion area to fix a glass bead. Then, a power section is driven to energize the area between the electrode clamps. The surface of the predetermined adhesion area is heated and oxidized. The glass bead is welded to the oxidized surface of the predetermined adhesion area.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: October 3, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Shinichi Aya, Yasuhiro Yamashina, Tsutomu Tobita
  • Publication number: 20040033753
    Abstract: In a discharge tube manufacture line, electrode clamps are attached to both sides of an electrode lead except on a predetermined adhesion area to fix a glass bead. Then, a power section is driven to energize the area between the electrode clamps. The surface of the predetermined adhesion area is heated and oxidized. The glass bead is welded to the oxidized surface of the predetermined adhesion area.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Shinichi Aya, Yasuhiro Yamashina, Tsutomu Tobita