Abstract: A unidirectional relay device includes a first port that receives communication data from one network, a first physical layer circuit that performs a protocol process of a physical layer, a first MAC layer circuit that performs a protocol process of a MAC layer, a second MAC layer circuit that is connected to the first MAC layer circuit through a signal line to perform a protocol process of a MAC layer, a second physical layer circuit that performs a protocol process of a physical layer, and a second port that transmits communication data to the other network. The signal line is a signal line that transmits data unidirectionally to the second MAC layer circuit from the first MAC layer circuit, and a signal line for transmitting data from the second MAC layer circuit to the first MAC layer circuit is opened or is connected to a ground.

Abstract: A mold structure used to form a molded object having an undercut portion includes a fixed mold as a first mold having a first molding surface for molding an obverse surface of the molded object; a slide core having an undercut molding surface used to mold the undercut portion as part of the obverse surface of the molded object; and a movable mold as a second mold having a second molding surface used to mold the reverse surface of the molded object. The first molding surface and the undercut molding surface form a cavity surface. A step is formed between the first molding surface and the second molding surface at a parting position between the fixed mold and the slide core on the cavity surface.

Abstract: A mold structure used to form a molded object having an undercut portion includes a fixed mold as a first mold having a first molding surface for molding an obverse surface of the molded object; a slide core having an undercut molding surface used to mold the undercut portion as part of the obverse surface of the molded object; and a movable mold as a second mold having a second molding surface used to mold the reverse surface of the molded object. The first molding surface and the undercut molding surface form a cavity surface. A step is formed between the first molding surface and the second molding surface at a parting position between the fixed mold and the slide core on the cavity surface.

Abstract: Occurrence of significant difference of transmission rate between communication zones can be prevented to maintain the transmission rate of overall network uniform. The radio network system includes a plurality of radio communication control units are connected with each other via radio main line, and each radio communication control unit has a communication function with at least one radio communication terminal arranged within own communication area.

Abstract: Occurrence of significant difference of transmission rate between communication zones can be prevented to maintain the transmission rate of overall network uniform. The radio network system includes a plurality of radio communication control units are connected with each other via radio main line, and each radio communication control unit has a communication function with at least one radio communication terminal arranged within own communication area.

Abstract: Occurrence of significant difference of transmission rate between communication zones can be prevented to maintain the transmission rate of overall network uniform. The radio network system includes a plurality of radio communication control units are connected with each other via radio main line, and each radio communication control unit has a communication function with at least one radio communication terminal arranged within own communication area.

Abstract: The present invention provides a production method of thrombin which can convert prothrombin into thrombin highly efficiently even in the absence of thromboplastin and blood plasma, easily obtain a starting material for use in the conversion of prothrombin into thrombin, and prepare and purify thrombin in an industrial scale. It is characterized in treating a prothrombin-containing aqueous solution with a Ca salt at 0 to 15.degree. C.

Abstract: According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent reverse deformation involving severe bonding and deformation of a ball neck portion and formation of a loop. The bonding gold wire essentially consists of 0.0001-0.005 wt % of Pt, 0.0001-0.005 wt % of Ag, 0.0005-0.005 wt % of Mg and 0.00005-0.005 wt % of Eu; with the balance being Au, said Au having less than 0.001% by weight of incidental impurity.