Abstract: The invention provides a wound magnetic core which is configured by winding an Fe-based amorphous alloy ribbon, the wound magnetic core containing a recess row including plural recesses formed by laser irradiation in a central part of the Fe-based amorphous alloy ribbon in a width direction, in which a ratio of a length of the central part to a total width is from 0.2 to 0.8.

Abstract: A soft-magnetic, amorphous alloy ribbon produced by a rapid quenching method, having transverse lines of recesses formed on its surface by laser beams with predetermined longitudinal intervals, with a doughnut-shaped projection formed around each recess; doughnut-shaped projections having smooth surfaces substantially free from splashes of the alloy melted by the irradiation of laser beams, and a height t2 of 2 ?m or less; and a ratio t1/T of the depth t1 of the recesses to the thickness T of the ribbon being in a range of 0.025-0.18, thereby having low iron loss and low apparent power.

Abstract: The invention provides a wound magnetic core which is configured by winding an Fe-based amorphous alloy ribbon, the wound magnetic core containing a recess row including plural recesses formed by laser irradiation in a central part of the Fe-based amorphous alloy ribbon in a width direction, in which a ratio of a length of the central part to a total width is from 0.2 to 0.8.

Abstract: A ceramic assembled board is formed by cutting continuous dividing grooves on one or both of the surfaces of a sintered ceramic board by way of laser machining to produce a large number of circuit substrates and at least one of the continuous grooves has a largest depth section and a smallest depth section with a depth difference ?d of 10 ?m??d?50 ?m. A ceramic substrate is produced by dividing the ceramic assembled board and at least one of its lateral surfaces is a surface formed by dividing the ceramic assembled board along the continuous grooves, the arithmetic mean roughness Ra2 of the machined surfaces of the continuous grooves being smaller than the arithmetic mean roughness Ra1 of the surfaces of broken sections with regard to the arithmetic mean roughness Ra of the lateral surfaces.

Abstract: A soft-magnetic, amorphous alloy ribbon produced by a rapid quenching method, having transverse lines of recesses formed on its surface by laser beams with predetermined longitudinal intervals, with a doughnut-shaped projection formed around each recess; doughnut-shaped projections having smooth surfaces substantially free from splashes of the alloy melted by the irradiation of laser beams, and a height t2 of 2 ?m or less; and a ratio t1/T of the depth t1 of the recesses to the thickness T of the ribbon being in a range of 0.025-0.18, thereby having low iron loss and low apparent power.

Abstract: A ceramic assembled board shows an advantageous dividablility of allowing the board to be divided when intended and not allowing it to be divided with ease when unintended. A ceramic substrate shows an excellent degree of dimensional precision and bending strength. A ceramic circuit substrate shows a high dielectric strength. A ceramic assembled board is formed by cutting continuous dividing grooves on one or both of the surfaces of a sintered ceramic board by way of laser machining to produce a large number of circuit substrates and at least one of the continuous grooves has a largest depth section and a smallest depth section with a depth difference ?d of 10 ?m ??d?50 ?m.

Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.

Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.

Abstract: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

Abstract: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings. The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: A plurality of green sheets are prepared, and at least one board pattern is formed on each of the sheets. The sheets are laminated and bonded with each other to form a multi-layer board. The unsintered multi-layer board is cut by irradiating the periphery of at least one board pattern on the surface of the multi-layer board with laser light. When the multi-layer board is cut, the width of the cut portion of the multi-layer board is measured. The cutting width is held constant by controlling the velocity at which the multi-layer board is cut, according to the measured width. Thus a section in the multi-layer board where at least one board pattern is formed is cut away from the other section of the multi-layer board. The cut away multi-layer board is then sintered. As a result, a multi-layer board is produced.

Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N1. The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N2, wherein a value of N2/N1 is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.

Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.