Abstract: A wire bonding method in which first and second bonding points are connected by a wire comprising the steps of: connecting the wire that passes through a capillary to a first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising and moving the capillary toward the second bonding point and then lowering the capillary slightly, raising the capillary and performing at least once another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point and connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.

Abstract: A semiconductor device in which a plurality of semiconductor chips are stacked and fastened to a lead frame. First bonding points on the semiconductor chips and second bonding points on the leads of the lead frame are connected by trapezoidal loop shape wires which differ from each other in height, each of the wires comprising a neck portion which rises from the first bonding point, a trapezoidal portion which is continuous from the neck portion, and an inclined portion which is continuous from the trapezoidal portion, inclined toward the second bonding point and bonded to the second bonding point; and a bent portion is formed in at least a lowermost wire.

Abstract: A wire bonding method for connecting first and second points with a wire, comprising the steps of: connecting the wire to the first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising the capillary obliquely upward toward the second bonding point (and then raising the capillary further), then raising the capillary and performing another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point, thus connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Abstract: An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. Byway of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

Abstract: In a wire bonding method for connecting first and second bonding points, after bonding a primary ball to a first bonding point and then the wire to the second bonding point, a secondary ball is formed by electrical charge on a tail end of a wire that extends out of the tip end of a capillary, this secondary ball is ball-bonded to an arbitrary point near the second bonding point, and then the wire is cut so as to leave a tail of wire out of the tip end of the capillary. A primary ball is formed at the end of the tail by electrical discharge and is bonded to a next first bonding point.

Abstract: A method, which is for forming accurate low wire loop shapes or short wire loop shapes which are stable and which have a high shape retention force in devices in which height differences between first and second bonding points are small and the wiring distance is short, including the steps of bonding a ball formed at the end of the wire extending out of the capillary to the first bonding point, raising the capillary while delivering the wire, moving the capillary toward the second bonding point, and then raising the capillary diagonally upward.

Abstract: A semiconductor device with wires mounted thereon, each one of the wires, which connects a first bonding point and a second bonding point which are positioned substantially in a lateral relationship, including: a neck height part which extends more or less vertically upward from the first bonding point, a first lateral wire part which extends laterally while dipping downward from the neck height part, a second lateral wire part which extends more or less horizontally from the first lateral wire part, a third lateral wire part which extends while rising from the second lateral wire part, and an inclined part which extends from the third lateral wire part to the second bonding point.

Abstract: A semiconductor device with wires mounted thereon, each one of the wires, which connects a first bonding point and a second bonding point which are positioned substantially in a lateral relationship, including: a neck height part which extends more or less vertically upward from the first bonding point, a first lateral wire part which extends laterally while dipping downward from the neck height part, a second lateral wire part which extends more or less horizontally from the first lateral wire part, a third lateral wire part which extends while rising from the second lateral wire part, and an inclined part which extends from the third lateral wire part to the second bonding point.

Abstract: A method for connecting first and second bonding points with a bonding wire that passes through a capillary comprising the steps of: bonding a ball formed at the end of the wire protruding from the capillary to the first bonding point; raising the capillary; moving the capillary toward the second bonding point so that the capillary is first lowered to a point that is slightly on the first bonding point side of the second bonding point, and a portion of the wire suspended from the capillary is pressed against a horizontal surface located between the first and second bonding points; raising and moving the capillary to a point above the second bonding point, and lowering the capillary so as to bond the wire to the second bonding point.

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Abstract: A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an upward inclination in the direction of a second bonding point, further moving the capillary to a position located at an upward inclination in the opposite direction from the second bonding point, then moving the capillary to a position located at an upward inclination in the direction of the second bonding point, and then lowering the capillary so that the wire is bonded to the second bonding point by the capillary, thus producing a stable low-height M-shaped wire loop between the first and second bonding point.

Abstract: A semiconductor device including a bonded wire that connects a first bonding point and a second bonding point and has a linear portion in the top area thereof, the linear portion being bent or depressed down, thus having a high shape-retaining strength.

Abstract: A method for moving a capillary so as to connect wire to a first bonding point and then to a second bonding point in manufacturing, for instance, semiconductor devices, including the steps of moving the capillary in a opposite direction from the second bonding point after moving the capillary away from the first bonding point, and then moving the capillary slightly towards the first bonding point so as to form a firm kink in the wire, and after which the capillary is further moved away from the first bonding point delivering the wire, and then the capillary is moved towards the second bonding point to connect the wire to the second bonding point.

Abstract: A method for connecting a first bonding point and a second bonding point with a wire comprising the steps of: raising a capillary through which the wire passes slightly after the second reverse operation that involves the movement of the capillary in the opposite direction from a second bonding point, moving the capillary to a position which is more or less above the first bonding pint, and then raising the capillary while delivering the wire; resulting in the formation of a kink in the inclined portion of a trapezoidal wire loop employed in the wire connection in semiconductor devices.