Abstract: A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T.

Abstract: A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T.

Abstract: To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

Abstract: Display device includes: a first terminal part configured by arranging a plurality of connectors on a substrate; and a second terminal part configured by arranging a plurality of connectors on the substrate. The first terminal part includes a first support tool. The first support tool is provided with openings through which connection cables can be attached respectively to the connectors, and also provided with a first and a second mounting piece to be mounted on a mounting part. The second terminal part includes a second support tool. The second support tool is provided with openings through which connection cables can be attached respectively to the connectors, and also provided with a first mounting piece to be mounted on the mounting part on which the first mounting piece of the first support tool is mounted, and with a second mounting piece to be mounted on another mounting part.

Abstract: Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.

Abstract: Display device includes: a first terminal part configured by arranging a plurality of connectors on a substrate; and a second terminal part configured by arranging a plurality of connectors on the substrate. The first terminal part includes a first support tool. The first support tool is provided with openings through which connection cables can be attached respectively to the connectors, and also provided with a first and a second mounting piece to be mounted on a mounting part. The second terminal part includes a second support tool. The second support tool is provided with openings through which connection cables can be attached respectively to the connectors, and also provided with a first mounting piece to be mounted on the mounting part on which the first mounting piece of the first support tool is mounted, and with a second mounting piece to be mounted on another mounting part.

Abstract: Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

Abstract: The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.

Abstract: An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Abstract: A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

Abstract: A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90° C., to thereby spin the mold disc plate.

Abstract: A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

Abstract: Herein disclosed are a switching apparatus and a vehicle-mounted electronic apparatus having the switching apparatus assembled therein.

Abstract: A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

Abstract: Herein disclosed are a switching apparatus and a vehicle-mounted electronic apparatus having the switching apparatus assembled therein.

Abstract: A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90° C., to thereby spin the mold disc plate.

Abstract: In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.

Abstract: Adhering apparatus for plate shaped matter includes absorbing-and-holding means 10, 20 serving also as electrodes for absorbing and holding respectively first optical disc substrate 1 and second optical disc substrate 2, optical disc substrate moving means 40 for moving second optical disc substrate 2 to be approached to first optical disc substrate, distance detecting means 50 for detecting the distance between optical disc substrates, velocity controlling means 60 for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means 71 for a