Abstract: This inrush current suppression circuit, which suppresses inrush current during pre-charging of a capacitor connected in parallel to the DC-output side of a converter that converts AC power supply voltage to DC voltage, includes: a resistor that is provided between the DC-output side of the converter and the capacitor, or that is provided on the AC-input side of the converter; a switch that is selectively switched between an open state, in which an electric circuit is formed with the resistor interposed, and a closed state, in which a short circuit is formed without the resistor interposed; an AC power supply voltage detection unit that detects whether the AC power supply voltage is inputted to the converter; and a switch control unit that switches the switch from the open state to the closed state after a prescribed time has elapsed from when the AC power supply voltage detection unit detects inputting of the AC power supply voltage to the converter.

Abstract: In a blockchain, contents of communication of electronic data are basically made public, and a malicious person can find system vulnerability of the blockchain. Leak of secret information or the like to an unintended third party through unauthorized access or the like by exploiting the vulnerability and cause is actually possible. Thus, it cannot be said that sufficient security measures are taken. In the present invention, a colony server stores partial data containing data of a predetermined size from a beginning of data to be managed received from a terminal, and a center server stores body data containing data of the predetermined size +1 and thereafter. Thus, the data to be managed is managed in a divided manner. Also, even if the body data is leaked from the colony server through unauthorized access or the like, the body data is merely part of the data to be managed, and has no value on its own.

Abstract: In a blockchain, contents of a transaction are basically made public, and a malicious person can find system vulnerability of the blockchain. The person is likely to exploit the vulnerability and cause leak of cryptocurrency to an unintended third party through unauthorized access or the like. Thus, it cannot be said that sufficient security measures are taken. In the present invention, a colony server stores partial data containing data of a predetermined size from a beginning of valuables data received from a terminal, and a center server stores body data containing data of the predetermined size +1 and thereafter. Thus, the valuables data is managed in a divided manner. Also, even if the body data is leaked from the colony server through unauthorized access or the like, the body data is merely part of the valuables data, and has no value on its own. Thus, the present invention provides a system and the like for achieving robust security against unauthorized access.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: An electric control device includes: a cam having a variable distance between an outer periphery and a center; a control shaft having one end, which contacts the outer periphery of the cam, and displaceable according to a rotation of the cam to adjust a valve lift amount; a motor rotating the cam; an angle detector detecting a rotation angle of the cam; and a controller. The cam includes multiple steps arranged on the outer periphery. The controller controls the rotation of the cam through the motor to match a detection angle of the angle detector with a target angle corresponding to a target valve lift amount. The controller stops rotating the cam through the motor when a difference between the detection angle and the target angle exceeds a first threshold, and the target angle corresponds to one of the steps.

Abstract: An electric control device includes: a cam having a variable distance between an outer periphery and a center; a control shaft having one end, which contacts the outer periphery of the cam, and displaceable according to a rotation of the cam to adjust a valve lift amount; a motor rotating the cam; an angle detector detecting a rotation angle of the cam; and a controller. The cam includes multiple steps arranged on the outer periphery. The controller controls the rotation of the cam through the motor to match a detection angle of the angle detector with a target angle corresponding to a target valve lift amount. The controller stops rotating the cam through the motor when a difference between the detection angle and the target angle exceeds a first threshold, and the target angle corresponds to one of the steps.

Abstract: A driving device has a driving cam driven by a motor around a cam shaft, a roller which is in contact with the driving cam, a supporting frame, and a control shaft. The driving cam has a pocket portion. At the pocket portion, a profile distance from a center increases or decreases when the driving cam rotates in a normal direction or a reverse direction. When the pocket portion is in contact with the roller and the motor is stopped, the rotational force of the driving cam becomes zero. The rotational position of the driving cam and the axial position of the control shaft are held at a constant position. Thereby, the rotary place of the driving cam and the axial position of the control shaft component can be held in a fixed position.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: A semiconductor chip is provided with a high-frequency circuit. A multi-layer wiring section is comprised of organic material and formed on the semiconductor chip, an outermost layer of the multi-layer wiring section formed with a bump forming portion. A bump is formed on the bump forming portion. The multi-layer wiring section is provided with a reinforcing means for suppressing a deformation of a bonding portion between the bump and the bump forming portion when the high-frequency circuit device is bonded to a substrate with an ultrasonic vibration applied thereto.

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Abstract: A compact automatic motion control photographing device includes a table supported rotatably to at least a single direction; a servo motor for producing a driving force for rotating the table; and a driving force transmitting mechanism for transmitting the driving force produced by the servo motor to the table, wherein the table is rotated towards a single direction and is stopped every time the table has rotated by a predetermined quantity of rotation, so as to perform photographing using a digital camera fastened to the table. Such a compact automatic motion control photographing device has superior portability, by which panoramic photographing can be easily performed by mounting a camera.

Abstract: An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: A substrate 10 includes multiple layers mounted with a mounted part 20 at its surface. A part pad 40 is provided to the substrate 10 to correspond to an electrode of the mounted part 20. A circuit pattern is provided at a layer at an inner portion of the substrate and an electrically conductive portion 60 for electrically connecting the part pad 40 and the circuit pattern right under the part pad 40.

Abstract: An automatic motion-controlled photographing apparatus, according to the present invention, a rotatable turntable is located above an upper surface of a box of a controller fixedly supported on a tripod, and a camera is set onto the turntable. The turntable, on which the camera is set, is rotated at a given angle of rotation responsive to a signal from a turntable drive circuit disposed in the controller, and a shutter of the camera is turned on via a non-contact signal relay in response to a signal from a shutter drive circuit for photographing the same photograph images, each in one frame, at an angle of 360 degrees as those of an on-site field.

Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: An automatic motion-controlled photographing apparatus, according to the present invention, a rotatable turntable is located above an upper surface of a box of a controller fixedly supported on a tripod, and a camera is set onto the turntable. The turntable, on which the camera is set, is rotated at a given angle of rotation responsive to a signal from a turntable drive circuit disposed in the controller, and a shutter of the camera is turned on via a non-contact signal relay in response to a signal from a shutter drive circuit for photographing the same photograph images, each in one frame, at an angle of 360 degrees as those of an on-site field.

Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr; 1, so that it is possible to suppress the occurrence of bubbles in the solder.