Abstract: A rotation sensor including: a main rotor that integrally rotates with a rotor to be measured; a sub-rotor that rotates in accordance with rotation of the main rotor with a different number of revolutions from that of the main rotor; a first detector detecting rotation of the main rotor; and a second detector detecting rotation of the sub-rotor. The rotation sensor detects an absolute rotation angle of the rotor to be measured from detection signals from the first detector and the second detector. Respective detection signals obtained from the first detector and the second detector are cyclically output in accordance with rotation of each rotor, and the following relationship is satisfied: (Tm?Tc×i)×n=Tm (i and n are positive integers), wherein Tc is a cycle of the detection signal from the first detector, and Tm is a cycle of the detection signal from the second detector.

Abstract: A rotation angle detection device comprises a magnet (110) that can be attached to a measurable rotation body (Sh) so as to rotate as integral with a rotation of the measurable rotation body (Sh), by which a magnetic flux density around the measurable rotation body (Sh) changes in response to a rotation of the measurable rotation body (Sh), and a detection element ((150) (151 to 154)) that detects a change in magnetic flux density around the magnet (110), wherein the detection element (150) comprises detection elements as one pair having a same characteristics, and the detection elements (150) as the one pair are arranged at different positions in a circumferential direction relative to a rotation center of the measurable rotation body (Sh) so as to be equidistant from the rotation center. Thus, a rotation angle detection device is to be provided, wherein any detection characteristics are not to be affected even if it is used under an environment with a severe change in temperature.

Abstract: A rotation angle detection device comprises a rotor (120) attached to a measurable rotation body (Sh) for rotating with the measurable rotation body to be measured a rotation angle, and comprising a magnet (110) that a magnetic flux density around the measurable rotation body is changed thereby in response to the rotation angle of the measurable rotation body; a stator (130) to be attached as independent of the rotation of the measurable rotation body; a detection element ((150) (151-154)) fixed on the stator for detecting a change in magnetic flux density due to the magnet in response to the rotation of the measurable rotation body; and a case for packing the rotor, the stator and the detection element.

Abstract: A rotation sensor including: a main rotor that integrally rotates with a rotor to be measured; a sub-rotor that rotates in accordance with rotation of the main rotor with a different number of revolutions from that of the main rotor; a first detector detecting rotation of the main rotor; and a second detector detecting rotation of the sub-rotor. The rotation sensor detects an absolute rotation angle of the rotor to be measured from detection signals from the first detector and the second detector. Respective detection signals obtained from the first detector and the second detector are cyclically output in accordance with rotation of each rotor, and the following relationship is satisfied: (Tm?Tc×i)×n=Tm (i and n are positive integers), wherein Tc is a cycle of the detection signal from the first detector, and Tm is a cycle of the detection signal from the second detector.

Abstract: A method, system and computer program product for assembling an optical module incorporates a far field pattern (FFP) optical measurement system and optionally a near field pattern (NFP) optical measurement system to obtain information about the axis and/or the divergent angle of light output from the optical elements to be assembled as part of the optical module. The optical elements include a light-emitting element, such as a laser diode, and at least one optical component, such as a collimating lens or a focusing lens. The system for assembling the optical module further includes a stage having the light-emitting element mounted thereon, a holding mechanism configured to hold and position the optical components to desired positions based on the measurements from the FFP and/or NFP optical measurement systems. A controller can control the stage, the holding mechanism and a fixing device configured to fix the positions of the optical elements once the optical elements are positioned in the desired positions.

Abstract: A bottom plate (4a) of a box-shaped package (4) is made of a metal. Portions of the package (4) (peripheral wall (4b) and cover plate (4c)) other than the bottom plate (4a) are made of a resin or a ceramic that is more economical than the metal. The material cost of the package (4) can thus be reduced in comparison with the case where the package (4) is made of the metal as a whole. A Peltier module (5) is fixed to the bottom plate (4a). A base (6) is fixed over the Peltier module (5), and a semiconductor laser chip (2) is disposed on this base (6). Heat from the semiconductor laser chip (2) and from the Peltier module (5) can be efficiently radiated through the bottom plate (4a) made of the metal, and deterioration of heat radiation performance can be prevented.

Abstract: One viewpoint of the invention intends to improve the working efficiency of fabricating a semiconductor laser module. For example, each of conductive connectors is fixed to both ends of insulation coated conductors to form conductors equipped with the conductive connectors. Pins of an inner module (case) are inserted and fixed to the conductive connectors on one end side of the insulation coated conductors. Pins of a package are inserted and fixed to the conductive connectors on the other end side. A semiconductor laser device housed inside the inner module can be conducted and connected to outside the package through the pins, the insulation coated conductors and the pins. Simple work only to insert and fix the pins to the conductive connectors can conduct and connect the pins to the pins and the working efficiency of fabricating the semiconductor laser module can be enhanced.

Abstract: The invention provides a semiconductor laser module of high output in which the radiating property of heat generated from a semiconductor laser element is high, and power consumption is small. In this semiconductor laser module, a base is arranged on a Peltier module, and has a basic portion having a face fixed to the Peltier module and a stem supporting portion rising on the basic portion. The base is formed by a material having a preferable coefficient of thermal conductivity. An internal module has the semiconductor laser element attached to a stem, an optical fiber for receiving a laser beam, and a member such as a lens for coupling the laser beam to the optical fiber. When this internal module is fixed to the base, the stem comes in contact with a stem supporting face of the stem supporting portion, and is fixed to the stem supporting face. The heat generated from the semiconductor laser element is directly transmitted from the stem to the base without passing a cap attached to the stem.

Abstract: A ferrule fixed module of the invention has the high aligning fixing accuracy of a ferrule to a coupling counter part and is low costs. Additionally, the ferrule fixed module of the invention can shorten the fabrication time thereof. The coupling end surface side of a lensed fiber (8) inserted and fixed to a first ferrule (4a) is faced to a laser diode chip (3) in the aligned state and the ferrule (4a) is fixed to a base (1) through a ferrule fixing component (10). The ferrule fixing component (10) is formed of clamping parts (6) having paired arm parts (12) for clamping and fixing the ferrule (4a) at the parts near the laser diode chip (3) from both sides of side parts and clamping parts (7) having paired arm parts (13) for clamping and fixing the ferrule (4a) at the parts far from the laser diode chip (3) from both sides of the side parts.

Abstract: A method, system and computer program product for assembling an optical module incorporates a far field pattern (FFP) optical measurement system and optionally a near field pattern (NFP) optical measurement system to obtain information about the axis and/or the divergent angle of light output from the optical elements to be assembled as part of the optical module. The optical elements include a light-emitting element, such as a laser diode, and at least one optical component, such as a collimating lens or a focusing lens. The system for assembling the optical module further includes a stage having the light-emitting element mounted thereon, a holding mechanism configured to hold and position the optical components to desired positions based on the measurements from the FFP and/or NFP optical measurement systems. A controller can control the stage, the holding mechanism and a fixing device configured to fix the positions of the optical elements once the optical elements are positioned in the desired positions.

Abstract: A bottom plate (4a) of a box-shaped package (4) is made of a metal. Portions of the package (4) (peripheral wall (4b) and cover plate (4c)) other than the bottom plate (4a) are made of a resin or a ceramic that is more economical than the metal. The material cost of the package (4) can thus be reduced in comparison with the case where the package (4) is made of the metal as a whole. A Peltier module (5) is fixed to the bottom plate (4a). A base (6) is fixed over the Peltier module (5), and a semiconductor laser chip (2) is disposed on this base (6). Heat from the semiconductor laser chip (2) and from the Peltier module (5) can be efficiently radiated through the bottom plate (4a) made of the metal, and deterioration of heat radiation performance can be prevented.

Abstract: The invention relates to a method for polishing optical connector end faces and a small-sized, light and easily transportable machine for doing the same, which are able to polish optical fiber end faces to desired shapes. A tape support member (18) is disposed at the connection end face (3) side of a multiple-core optical connector (4) attached on a machine, The tape support member(18) is linked to a supporting rod (21) which is able to freely advance and retreat along side plates (23a) and (23b), a tape travelling plane (9) shaped so as to correspond to a desired end face shape of bare optical fibers of a multiple-core optical connector (4) is formed at the tip end of the tape support member (18). The leading end of a polishing tape (32) wound on the pay-out roller (30) is advanced along the tape travelling plane (9) and is taken up on the winding roller (31).

Abstract: A solder bump forming method includes a step of causing one end surface of a punch inserted into a through hole provided in a die to be retracted by a desired distance from an end surface of the die to thereby provide a recess of a desired volume in the end surface of the die, a step of embedding solder in the recess of the die, a step of moving the punch toward the end surface of the die to thereby extrude the solder, and a step of fusing the solder extruded by the movement of the punch.