Patents by Inventor Shinichiro Ikeda

Shinichiro Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010010651
    Abstract: The first switching circuit selects data of a predetermined bit from the input/output data in accordance with each of a plurality of testing modes and outputs the selected data as testing data. The second switching circuits receive the testing data and each bit of the input/output data, and select one of the input/output data and the testing data in accordance with the operation mode. In detail, each bit of the input/output data is respectively outputted to the memory cells during normal operation mode, and during testing mode the testing data is selected to be outputted to the memory cells as the common input/output data. Thus, write control for multiple kinds of data compressing test can be performed by using the simple first and second switching circuits. As a result, the control circuit for the data compressing test can be reduced in layout size.
    Type: Application
    Filed: December 29, 2000
    Publication date: August 2, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Yoshichika Nakaya, Shinichiro Ikeda, Yoshiharu Kato, Satoru Kawamoto
  • Patent number: 4904535
    Abstract: An adhesive having superior adhesive properties between metal/metal, metal/plastic or plastic/plastic and a bonding process therebetween are provided, which adhesive is composed mainly of a copolymer comprising the respective units of 50 to 95% by weight of vinyl chloride, 5 to 50% by weight of a vinyl carboxylate ester and 0.01 to 5% by weight of a phosphoric acid ester having a C--C double bond and copolymerizable with the foregoing vinyl monomers, and having an average degree of polymerization of 100 to 900, and which bonding process comprises dissolving the adhesive in an organic solvent, coating the solution onto substrates, drying the coated substrate and bonding the substrates onto each other on heating under pressure.
    Type: Grant
    Filed: March 11, 1988
    Date of Patent: February 27, 1990
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Rentaro Suzuki, Shinichiro Ikeda