Patents by Inventor Shinichiro Itoh

Shinichiro Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing electronic part and electronic part obtained by the method
    Patent number: 7331502
    Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: February 19, 2008
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Ryoichi Okada, Hitoshi Aoki, Yoshitaka Okugawa, Kensuke Nakamura, Shinichiro Itoh