Patents by Inventor Shinichiro Takami

Shinichiro Takami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition and polising method using the same
    Publication number: 20070256368
    Abstract: A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.
    Type: Application
    Filed: June 28, 2007
    Publication date: November 8, 2007
    Inventor: Shinichiro Takami
  • Polishing composition and polishing method using the same
    Patent number: 7052522
    Abstract: A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, a water-soluble polymer, and water. The average primary particle diameter DSA of the silicon dioxide is at least 40 nm. The ratio D95/D5 of the silicon dioxide is no more than 3.8. The value D95/D5/DSA of the silicon dioxide is no more than 0.07.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: May 30, 2006
    Assignee: Fujimi Incorporated
    Inventor: Shinichiro Takami
  • Polishing composition and polishing method using the same
    Publication number: 20060080896
    Abstract: A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.
    Type: Application
    Filed: October 13, 2005
    Publication date: April 20, 2006
    Inventor: Shinichiro Takami
  • Polishing composition and polishing method using the same
    Publication number: 20040127046
    Abstract: A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, a water-soluble polymer, and water. The average primary particle diameter DSA of the silicon dioxide is at least 40 nm. The ratio D95/D5 of the silicon dioxide is no more than 3.8. The value D95/D5/DSA of the silicon dioxide is no more than 0.07.
    Type: Application
    Filed: September 29, 2003
    Publication date: July 1, 2004
    Inventor: Shinichiro Takami
  • Polishing composition and polishing method employing it
    Patent number: 6626967
    Abstract: A polishing composition comprising the following components (a) to (c): (a) colloidal silica; (b) at least one bicarbonate selected from the group consisting of ammonium bicarbonate, lithium bicarbonate, potassium bicarbonate, sodium bicarbonate and a mixture thereof; and (c) water; wherein the concentration of each of the elements included in Groups 2A, 3A, 4A, 5A, 6A, 7A, 8A, 1B and 2B, lanthanoid and actinoid, and the concentration of each element of aluminum, gallium, indium, thallium, tin, lead, bismuth, fluorine and chlorine, are at most 100 ppb in the polishing composition, respectively.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: September 30, 2003
    Assignee: Fujimi Incorporated
    Inventors: Shinichiro Takami, Katsuyoshi Ina
  • Polishing composition and polishing method employing it
    Publication number: 20030115806
    Abstract: A polishing composition comprising the following components (a) to (c):
    Type: Application
    Filed: October 30, 2002
    Publication date: June 26, 2003
    Applicant: FUJIMI INCORPORATED
    Inventors: Shinichiro Takami, Katsuyoshi Ina