Abstract: A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 ?m from the interface.

Abstract: A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.

Abstract: A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.

Abstract: A bonded diamond body having a high bonded strength is provided. The bonded diamond body includes a sintered polycrystalline diamond body, a hard substrate, and a hard layer provided between the sintered polycrystalline diamond body and the hard substrate, the sintered polycrystalline diamond body containing a diamond grain and a sintering aid, the hard substrate containing tungsten carbide and cobalt, and the hard layer containing cobalt and a hard grain made of a carbide, a nitride, or a carbonitride having a Vickers hardness of 1100 Hv or more.

Abstract: A bonded diamond body having a high bonded strength is provided. The bonded diamond body includes a sintered polycrystalline diamond body, a hard substrate, and a hard layer provided between the sintered polycrystalline diamond body and the hard substrate, the sintered polycrystalline diamond body containing a diamond grain and a sintering aid, the hard substrate containing tungsten carbide and cobalt, and the hard layer containing cobalt and a hard grain made of a carbide, a nitride, or a carbonitride having a Vickers hardness of 1100 Hv or more.

Abstract: A joined product has a cemented carbide sintered compact serving as a first material to be joined and a cBN sintered compact serving as a second material to be joined, wherein: the first material to be joined and the second material to be joined are joined together via a joining material disposed therebetween and containing titanium (Ti); and a titanium nitride (TiN) compound layer having a thickness of 10-300 nm is produced at an interface between the second material to be joined and the joining material.

Abstract: The present joined product is a joined product with a cemented carbide sintered compact serving as a first material to be joined and a cBN sintered compact serving as a second material to be joined, wherein: the first material to be joined and the second material to be joined are joined together via a joining material disposed therebetween and containing titanium (Ti); and a titanium nitride (TiN) compound layer having a thickness of 10-300 nm is produced at an interface between the second material to be joined and the joining material.