Patents by Inventor Shinishi Suzuki

Shinishi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged semiconductor device having bent leads
    Patent number: 6486543
    Abstract: A semiconductor device (X1) including a semiconductor chip (3), a first lead (1) connected to an electrode of the semiconductor chip (3), a second lead (2) connected to another electrode of the semiconductor chip (3), and a resin package (4) sealing the semiconductor chip (3), an inner terminal (10) of the first lead (1), and an inner terminal (20) of the second lead (2). The resin package (4) includes a first to a fourth side surfaces (41-44), an upper surface (47) and a bottom surface (45). Each of the first and the second leads (1, 2) includes at least one outer terminal (11, 21) extending along the first side surface (41) and the bottom surface (45) of the resin package (4).
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: November 26, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Masashi Sano, Nobuaki Suzuki, Shinishi Suzuki