Patents by Inventor Shinji Isokawa
Shinji Isokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11145799Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: July 14, 2020Date of Patent: October 12, 2021Assignee: ROHM CO., LTD.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20200343428Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: July 14, 2020Publication date: October 29, 2020Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 10756247Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: July 12, 2018Date of Patent: August 25, 2020Assignee: Rohm Co., LTD.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20180331266Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: July 12, 2018Publication date: November 15, 2018Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 10038130Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: December 6, 2016Date of Patent: July 31, 2018Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20170084811Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: December 6, 2016Publication date: March 23, 2017Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 9548287Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: December 1, 2014Date of Patent: January 17, 2017Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20150129908Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: December 1, 2014Publication date: May 14, 2015Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 8901578Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: May 10, 2012Date of Patent: December 2, 2014Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20120286301Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: May 10, 2012Publication date: November 15, 2012Applicant: ROHM CO., LTD.Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 7429759Abstract: An optical semiconductor device (A1) includes a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.Type: GrantFiled: June 7, 2004Date of Patent: September 30, 2008Assignee: Rohm Co., Ltd.Inventor: Shinji Isokawa
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Publication number: 20070246731Abstract: A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.Type: ApplicationFiled: June 7, 2007Publication date: October 25, 2007Applicant: ROHM CO., LTD.Inventors: Shinji Isokawa, Tomoji Yamaguchi
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Patent number: 7242033Abstract: A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.Type: GrantFiled: February 24, 2003Date of Patent: July 10, 2007Assignee: Rohm Co., Ltd.Inventors: Shinji Isokawa, Tomoji Yamaguchi
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Patent number: 7202507Abstract: An optical semiconductor device includes an optical semiconductor chip and a light permeable member covering the optical semiconductor chip. The light permeable member has a light emitting surface for emitting light coming out from the optical semiconductor chip to the outside. The light emitting surface includes a plurality of standing surfaces standing in a second direction which intersects a first direction in which the light emitting surface spreads.Type: GrantFiled: June 23, 2004Date of Patent: April 10, 2007Assignee: Rohm Co., Ltd.Inventor: Shinji Isokawa
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Patent number: 7128444Abstract: A light emitting diode lamp includes a lead terminal 2 formed with a cup 8 having a conical inner circumferential surface serving as a light reflective surface 8a, an LED chip 4 bonded to a bottom surface 8b of the cup with a die bonding material H, a molded portion 6 made of a transparent synthetic resin for packaging the cup of the lead terminal. The bottom surface 8b of the cup is formed with a recess 9 or a protrusion 19 to which the LED chip 4 is bonded with the die bonding material H, whereby the light conversion efficiency of the conical light reflective surface 8a is enhanced.Type: GrantFiled: February 24, 2003Date of Patent: October 31, 2006Assignee: Rohm Co., Ltd.Inventors: Shinji Isokawa, Tomoji Yamaguchi
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Publication number: 20060163602Abstract: An optical semiconductor device (A1) comprises a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.Type: ApplicationFiled: June 7, 2004Publication date: July 27, 2006Applicant: Rohn Co., LTD.Inventor: Shinji Isokawa
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Publication number: 20060151809Abstract: An optical semiconductor device includes an optical semiconductor chip, a light permeable member covering the chip, and a reflector formed with an accommodation space for accommodating the light permeable member. The light permeable member includes a convex lens for converging light emitted from the optical semiconductor chip. The reflector includes a reflecting surface for reflecting light emitted from the optical semiconductor chip. At least part of the convex lens is located within the accommodation space of the reflector. The light permeable member includes an extension engaging and extending along the reflecting surface. The extension includes a light emitting surface surrounding the convex lens.Type: ApplicationFiled: May 28, 2004Publication date: July 13, 2006Applicant: ROHM CO., LTDInventor: Shinji Isokawa
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Patent number: 7002185Abstract: A semiconductor chip 1 is provided with a first electrode 2 formed at a first corner of a crystal substrate 1a generally quadrangular as viewed in plan, and with a second electrode 3 formed to extend along two sides of the crystal substrate 1a, these sides including between them a second corner located diagonally away from the first corner. The first electrode 2 and the second electrode 3 are connected to a first lead 15 and second leads 16a, 16b formed on the circuit substrate 10 via solder paste 20. The narrow first lead 15 extends transversely to a side of the crystal substrate 1a, and the second leads 16a, 16b extends in the opposite direction to that of the first lead 15. The first lead 15 and the second lead 16b are offset from each other by an appropriate distance. With such arrangements, the surface tension of melted solder prevents the semiconductor chip 1 from being fixed to the circuit substrate 10 with a slanting posture.Type: GrantFiled: April 16, 2003Date of Patent: February 21, 2006Assignee: Rohm Co., Ltd.Inventor: Shinji Isokawa
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Publication number: 20050242424Abstract: A semiconductor chip 1 is provided with a first electrode 2 formed at a first corner of a crystal substrate 1a generally quadrangular as viewed in plan, and with a second electrode 3 formed to extend along two sides of the crystal substrate 1a, these sides including between them a second corner located diagonally away from the first corner. The first electrode 2 and the second electrode 3 are connected to a first lead 15 and second leads 16a, 16b formed on the circuit substrate 10 via solder paste 20. The narrow first lead 15 extends transversely to a side of the crystal substrate 1a, and the second leads 16a, 16b extends in the opposite direction to that of the first lead 15. The first lead 15 and the second lead 16b are offset from each other by an appropriate distance. With such arrangements, the surface tension of melted solder prevents the semiconductor chip 1 from being fixed to the circuit substrate 10 with a slanting posture.Type: ApplicationFiled: April 16, 2003Publication date: November 3, 2005Applicant: ROHM CO., LTD.Inventor: Shinji Isokawa
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Publication number: 20050156187Abstract: A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.Type: ApplicationFiled: February 24, 2003Publication date: July 21, 2005Inventors: Shinji Isokawa, Tomoji Yamaguchi