Patents by Inventor Shinji Kanayama
Shinji Kanayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160053309Abstract: By establishing a simple method for extracting a nucleic acid from a human specimen, and using the LAMP method, which is an isothermal gene amplification method showing superior quickness and convenience, with a concept of measurement different from the conventional ones, there is established a test method including steps up to detection with a measurement apparatus.Type: ApplicationFiled: March 26, 2014Publication date: February 25, 2016Applicant: NIPPON GENE CO., LTD.Inventors: Masakazu Kitani, Fuminori Maki, Masaki Izawa, Shinji Kanayama, Yuko Yoneda
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Patent number: 7861908Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.Type: GrantFiled: March 30, 2007Date of Patent: January 4, 2011Assignee: Panasonic CorporationInventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Patent number: 7827677Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.Type: GrantFiled: September 1, 2005Date of Patent: November 9, 2010Assignee: Panasonic CorporationInventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Takashi Shimizu, Satoshi Shida, Shunji Onobori
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Patent number: 7797820Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: GrantFiled: March 6, 2008Date of Patent: September 21, 2010Assignee: Panasonic CorporationInventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
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Patent number: 7549567Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.Type: GrantFiled: January 30, 2007Date of Patent: June 23, 2009Assignee: Panasonic CorporationInventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 7516878Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: December 27, 2005Date of Patent: April 14, 2009Assignee: Panasonic CorporationInventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Publication number: 20080179378Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: October 31, 2007Publication date: July 31, 2008Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Publication number: 20080163481Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: ApplicationFiled: March 6, 2008Publication date: July 10, 2008Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
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Patent number: 7387229Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: January 22, 2004Date of Patent: June 17, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Patent number: 7353596Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: GrantFiled: March 18, 2004Date of Patent: April 8, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
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Patent number: 7350684Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: April 26, 2005Date of Patent: April 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Publication number: 20070187457Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.Type: ApplicationFiled: March 30, 2007Publication date: August 16, 2007Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Patent number: 7229854Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.Type: GrantFiled: March 27, 2003Date of Patent: June 12, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Publication number: 20070119905Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.Type: ApplicationFiled: January 30, 2007Publication date: May 31, 2007Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 7220922Abstract: Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.Type: GrantFiled: October 23, 2001Date of Patent: May 22, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kenichi Nishino, Shinji Kanayama, Shinjiro Tsuji, Masayuki Ida, Tomotaka Nishimoto
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Patent number: 7219419Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.Type: GrantFiled: February 28, 2003Date of Patent: May 22, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Publication number: 20060185157Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: ApplicationFiled: March 18, 2004Publication date: August 24, 2006Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
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Patent number: 7052984Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: November 16, 2001Date of Patent: May 30, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Publication number: 20060102701Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: ApplicationFiled: December 27, 2005Publication date: May 18, 2006Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Patent number: 7031509Abstract: There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.Type: GrantFiled: November 20, 2001Date of Patent: April 18, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama