Abstract: An image processing device according to an embodiment includes: a depth estimation unit that, when a size of a differential region between a first frame and a second frame at a timing later than a timing of the first frame in chronological order in a moving image satisfies a predetermined condition and is large, estimates a depth of at least a region corresponding to the differential region in the second frame; and a depth estimation result update unit that updates an estimation result of the depth of the first frame by using the region corresponding to the differential region to output the updated estimation result as a new estimation result of the depth of the second frame.

Abstract: A blood pressure measurement device includes an outer case; a base; a pump provided on a surface of the base such that the pump is shifted from a center of the outer case and located on one side as viewed in a circumferential direction of a living body; a first pressure sensor and a second pressure sensor that are provided such that the first pressure sensor and the second pressure sensor are arranged side by side in the circumferential direction and located on one side as viewed in a direction orthogonal to the circumferential direction; and a first on-off valve and a second on-off valve that are provided such that the first on-off valve and the second on-off valve are arranged side by side in the circumferential direction with reference to the first pressure sensor and the second pressure sensor.

Abstract: An image processing apparatus processes image data generated by a reading unit configured to read a document, using at least one of a plurality of types of reading elements that have different spectral sensitivity characteristics and are cyclically arrayed in a first direction, by scanning the document in a second direction vertical to the first direction. The image processing apparatus includes a processing unit configured to perform, on the image data, filter processing for averaging pixel values of pixels at least equal in number to the types of the reading elements in the first direction, wherein the processing unit is implemented by at least one processor or at least one circuit.

Abstract: A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.

Abstract: In the case where both thickening processing and UCR processing are performed for an object, appropriate effects are obtained for both pieces of the processing. An image processing apparatus including an image processing unit configured to perform thickening processing for an object included in an input image and to perform saturation suppression processing for an edge portion of the object in the input image for which the thickening processing has been performed.

Abstract: An image processing apparatus processes image data generated by a reading unit configured to read a document, using at least one of a plurality of types of reading elements that have different spectral sensitivity characteristics and are cyclically arrayed in a first direction, by scanning the document in a second direction vertical to the first direction. The image processing apparatus includes a processing unit configured to perform, on the image data, filter processing for averaging pixel values of pixels at least equal in number to the types of the reading elements in the first direction, wherein the processing unit is implemented by at least one processor or at least one circuit.

Abstract: The manufacturing method for a rotor includes steps of: applying an adhesive to a first surface of a magnet material member that becomes a permanent magnet after magnetization, the adhesive being applied such that a total thickness of the magnet material member and the adhesive is less than a radial width of a magnet insertion aperture; disposing a rotor core such that an axial direction thereof is horizontal, and inserting the magnet material member into a magnet insertion aperture that is positioned vertically uppermost among the magnet insertion apertures so as to orient the adhesive vertically upward; positioning each of the magnet material members by pressing the magnet material member against an inner wall surface on an outer circumferential side of the magnet insertion aperture after inserting the magnet material member into each of the magnet insertion apertures; and curing the adhesive after the magnet material member is positioned.

Abstract: In an embedded magnet rotor for a rotary electric machine, permanent magnets are respectively accommodated in magnet housing apertures that pass axially through a rotor core that is held by a shaft, an adhesive is injected into and cured in gaps between the permanent magnets and the rotor core in the magnet housing apertures, and fixes the permanent magnets to the rotor core, a first end plate is held by the shaft so as to contact a first axial end of the rotor core, and blocks first axial end openings of the plurality of magnet housing apertures, and a fill rate of the adhesive that is injected into the gaps is increased gradually from a first axial end toward a second axial end of the magnet housing apertures.

Abstract: A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.

Abstract: There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.

Abstract: In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn—Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %?(M×C+B)×100/(M+B)?4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder.

Abstract: In the case where both thickening processing and UCR processing are performed for an object, appropriate effects are obtained for both pieces of the processing. An image processing apparatus including an image processing unit configured to perform thickening processing for an object included in an input image and to perform saturation suppression processing for an edge portion of the object in the input image for which the thickening processing has been performed.

Abstract: The manufacturing method for a rotor includes steps of: applying an adhesive to a first surface of a magnet material member that becomes a permanent magnet after magnetization, the adhesive being applied such that a total thickness of the magnet material member and the adhesive is less than a radial width of a magnet insertion aperture; disposing a rotor core such that an axial direction thereof is horizontal, and inserting the magnet material member into a magnet insertion aperture that is positioned vertically uppermost among the magnet insertion apertures so as to orient the adhesive vertically upward; positioning each of the magnet material members by pressing the magnet material member against an inner wall surface on an outer circumferential side of the magnet insertion aperture after inserting the magnet material member into each of the magnet insertion apertures; and curing the adhesive after the magnet material member is positioned.

Abstract: There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.

Abstract: In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn—Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %?(M×C+B)×100/(M+B)?4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder.

Abstract: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weight having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.

Abstract: An image processing apparatus processes image data configured of pixels disposed in grid form. The apparatus includes an obtaining unit that obtains distortion characteristics indicating characteristics of distortion in a target contained in original image data obtained by capturing an image of the target, and a correction unit that, using a sampling function, interpolates a pixel of interest in the original image data, based on pixels of the original image data present in a reference region in the periphery of the location of the pixel of interest. The correction unit changes the range of the reference region, the frequency characteristics of the sampling function, or both in accordance with the distortion characteristics.

Abstract: In an embedded magnet rotor for a rotary electric machine, permanent magnets are respectively accommodated in magnet housing apertures that pass axially through a rotor core that is held by a shaft, an adhesive is injected into and cured in gaps between the permanent magnets and the rotor core in the magnet housing apertures, and fixes the permanent magnets to the rotor core, a first end plate is held by the shaft so as to contact a first axial end of the rotor core, and blocks first axial end openings of the plurality of magnet housing apertures, and a fill rate of the adhesive that is injected into the gaps is increased gradually from a first axial end toward a second axial end of the magnet housing apertures.

Abstract: An interpolation process using a convolution operation is carried out on a non-planar document, a captured image having distortion caused by an optical system, or the like having changed a breadth of a reference region used in a convolution operation or frequency characteristics of a sampling function that is used, in accordance with distortion characteristics in an input image.

Abstract: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weigh having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.