Abstract: An actuator comprises a support body including a coil having a winding part and a lead part, a coil holder and a board supported by the coil holder, a movable body having a magnet, and a magnetic drive mechanism structured to relatively move the support body and the movable body. The coil holder has a coil holding part holding the winding part and a board support part supporting the board. A board surface of the board is provided with a land with which the lead part is connected. The board support part has a recessed part at a position overlapping with the board when viewed in a direction along the board surface, and the lead part is extended from the winding part to the land via the recessed part and is provided with a resiliently bent portion which is resiliently bent in an inside of the recessed part.

Abstract: A radial flux synchronous machine includes a stator in a cylindrical shape provided with a plurality of magnetic poles, an inner rotor disposed radially inward of the stator and having an inner armature opposing the magnetic pole from radially inward, and an outer rotor disposed radially outward of the stator and having an outer armature opposing the magnetic pole (from radially outward.

Abstract: A first game in which at least a use character that can be used regardless of whether the use character is owned or not owned by a user is used is executed. In addition, a second game in which an owned character that is owned by the user is used is executed. In the first game, when a game is advanced on the basis of a user operation and a progress status of the game satisfies a first condition associated with a skill of the use character, the skill is exercised. Meanwhile, in the second game, when a game is advanced on the basis of a user operation and a progress status of the game satisfies a condition that is associated with a skill of the owned character and different from the first condition associated with the skill in the first game, the skill is exercised.

Abstract: A first game in which at least a use character that can be used regardless of whether the use character is owned or not owned by a user is used is executed. In addition, a second game in which an owned character that is owned by the user is used is executed. In the first game, when a game is advanced on the basis of a user operation and a progress status of the game satisfies a first condition associated with a skill of the use character, the skill is exercised. Meanwhile, in the second game, when a game is advanced on the basis of a user operation and a progress status of the game satisfies a condition that is associated with a skill of the owned character and different from the first condition associated with the skill in the first game, the skill is exercised.

Abstract: A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.

Abstract: Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.

Abstract: Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.

Abstract: A plastic-sealed IC device comprises an IC lead frame having a chip mounting area, an IC chip fixedly mounted on the IC lead frame in the chip mounting frame area, and a plastic package molded so as to seal the IC lead frame therein.The plastic package has an opening formed so as to allow the backside of the chip mounting area to communicate with the atomonphere to discharge the moisture accumulating in the vicinity of the IC chip.

Abstract: A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed on a second surface of the island, external leads, bonding wires for connection of the contacts on the IC chip and inner ends of the external leads, a package of mold resin for encapsulating the IC chip, the low-adhesion layer, the bonding wires and inner parts of the external leads, the mold resin being provided with a vent hole which extends to the vicinity of the low-adhesion layer. The low-adhesion layer has a low or no adhesive power to the mold resin.