Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An inductor component comprising a first magnetic layer, a spiral wiring disposed on the first magnetic layer, and a second magnetic layer covering the spiral wiring. The first magnetic layer and the second magnetic layer contain a magnetic powder and a resin containing the magnetic powder, and the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An inductor component comprising an element body including a first and second magnetic layers that contain a metal magnetic powder and that are laminated along a first direction, a spiral wiring disposed between the first and second magnetic layers, a vertical wiring connected to the spiral wiring and extending in the first direction to penetrate the element body and an external terminal connected to the vertical wiring and exposed on a first principal surface of the element body orthogonal to the first direction. The spiral wiring is disposed on a first plane orthogonal to the first direction and includes a pad part to which the vertical wiring is connected, a spiral part extending from the pad part on the first plane, and a lead-out part extending from the pad part on the first plane and exposed from a side surface of the element body parallel to the first direction.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: An inductor component comprising a first magnetic layer, a spiral wiring disposed on the first magnetic layer, and a second magnetic layer covering the spiral wiring. The first magnetic layer and the second magnetic layer contain a magnetic powder and a resin containing the magnetic powder, and the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer.

Abstract: A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the dummy metal layer in the opening part of the base insulating resin; enlarging the sacrificial conductor by plating by energizing the dummy metal layer; covering the spiral wiring and the sacrificial conductor with an insulating resin; exposing the sacrificial conductor by disposing an opening part in the insulating resin; forming a hole part by removing the sacrificial conductor by etching from the opening part of the insulating resin; and constructing the inner magnetic path of a magnetic resin by filling the hole part with the magnetic resin.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the dummy metal layer in the opening part of the base insulating resin; enlarging the sacrificial conductor by plating by energizing the dummy metal layer; covering the spiral wiring and the sacrificial conductor with an insulating resin; exposing the sacrificial conductor by disposing an opening part in the insulating resin; forming a hole part by removing the sacrificial conductor by etching from the opening part of the insulating resin; and constructing the inner magnetic path of a magnetic resin by filling the hole part with the magnetic resin.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: An object of the present invention is to provide an industrially advantageous process for preparing a benzaldehyde compound from a benzyl alcohol compound with high yield. The present invention relates to a process for preparing an aromatic aldehyde compound represented by the formula (2); which comprises reacting an aromatic methyl alcohol compound represented by the formula (1); and a peroxide under a pH value of a reaction solution being pH 0.01 or higher and less than 10 in the presence of at least one metallic compound selected from a molybdenum compound and a tungsten compound, a quaternary ammonium salt and an organic phosphonium salt.

Abstract: An object of the present invention is to provide a high-purity aromatic methyl alcohol compound having reduced a bis(arylmethyl)ether compound as a side product mixed thereinto and a high-purity aromatic methyl alcohol composition having excellent preservation stability and methods for producing them. The object of the present invention is achieved by a method for producing a high-purity aromatic methyl alcohol compound, which comprises obtaining a high-purity aromatic methyl alcohol compound in high yield from an aromatic methyl alcohol-containing crude product by subjecting the crude product to distillation in the presence of an anti-decomposition agent. Further, the object for the preservation stability is achieved by producing a high-purity aromatic methyl alcohol composition using the obtained high-purity aromatic methyl alcohol compound.

Abstract: An object of the present invention is to provide an industrially advantageous process for preparing a benzaldehyde compound from a benzyl alcohol compound with high yield. The present invention relates to a process for preparing an aromatic aldehyde compound represented by the formula (2); which comprises reacting an aromatic methyl alcohol compound represented by the formula (1); and a peroxide under a pH value of a reaction solution being pH 0.01 or higher and less than 10 in the presence of at least one metallic compound selected from a molybdenum compound and a tungsten compound, a quaternary ammonium salt and an organic phosphonium salt.

Abstract: Provided is a mold clamping apparatus of a mold having a side wall portion of cantilever shape, by which deformation of the mold side wall portion can be efficiently suppressed. An injection molding machine and injection molding method both using the mold clamping apparatus are also provided. Thereby, molded articles with high quality having no flash generation can be obtained. The mold clamping apparatus comprises a side pusher comprising a pair of supports respectively arranged between adjacent two tie bars out of a plurality of tie bars at positions symmetrical to each other and slidably supported to the tie bars, a moving and positioning means linking the supports to a fixed platen or movable platen and moving the supports to be positioned at a predetermined position and a lateral clamping means provided on each of the pair of supports to push a side face of a fixed mold or movable mold.

Abstract: Provided is a mold clamping apparatus of a mold having a side wall portion of cantilever shape, by which deformation of the mold side wall portion can be efficiently suppressed. An injection molding machine and injection molding method both using the mold clamping apparatus are also provided. Thereby, molded articles with high quality having no flash generation can be obtained. The mold clamping apparatus comprises a side pusher comprising a pair of supports respectively arranged between adjacent two tie bars out of a plurality of tie bars at positions symmetrical to each other and slidably supported to the tie bars, a moving and positioning means linking the supports to a fixed platen or movable platen and moving the supports to be positioned at a predetermined position and a lateral clamping means provided on each of the pair of supports to push a side face of a fixed mold or movable mold.

Abstract: 2,3,3?,4?-Biphenyltetracarboxylic acid tetraester is predominantly produced by a process in which a phthalic acid diester is subjected to oxidative-coupling reaction in the presence of molecular oxygen and a catalyst comprising a rhodium-containing compound.

Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.