Abstract: An optical module is formed with a semiconductor optical element sealed inside a transparent resin part and a lens unit affixed to its upper surface. The-lens unit has a lens part that is disposed facing opposite the semiconductor optical element through the transparent resin part. A planar part extends from the lens part along the upper surface of the transparent resin part. A photoelectric sensor may include such an optical module as a light projector and another such optical module as a light receiver.

Abstract: A coated electric wire is wound around a detection circuit in a planar manner for the purpose of electrostatic shield. This winding is performed, for example, spirally in a single layer. In the case where there are further provided a detection circuit board including a detection circuit and a cylindrical case, the coated electric wire is wound around the detection circuit board in a planar manner, wherein the direction of the axis of the cylindrical surface accords with the direction of the axis of the case. Consequently, there can be provided a sensor device in which the detection circuit can be electrostatically shielded with ease.

Abstract: A coated electric wire is wound around a detection circuit in a planar manner for the purpose of electrostatic shield. This winding is performed, for example, spirally in a single layer. In the case where there are further provided a detection circuit board including a detection circuit and a cylindrical case, the coated electric wire is wound around the detection circuit board in a planar manner, wherein the direction of the axis of the cylindrical surface accords with the direction of the axis of the case. Consequently, there can be provided a sensor device in which the detection circuit can be electrostatically shielded with ease.