Abstract: One aspect of the present disclosure relates to a method of setting up a test apparatus that is a method of setting up the test apparatus to test a substrate by bringing a probe into contact with an electrode pad formed on a chip on the substrate that is mounted on a stage. The method includes acquiring a first image including the probe in a probe card that is attached to the test apparatus. The method includes calculating first information including a center of gravity, and an angle, for the probe card, based on probe information including a position of the probe that is calculated based on the first image; and probe information or pad information that is pre-provisioned and corresponds to the probe card. The method includes acquiring a second image including the electrode pad on the substrate mounted on the stage.

Abstract: A testing device includes photographing, segmenting, position determining, and position adjusting units. The photographing unit is configured to photograph a needle tip of a probe needle provided in a probe card used for testing of a test object. The segmenting unit is configured to recognize a needle region and a needle tip region of a validation image photographed by the photographing unit, by inputting the validation image to a segmentation model that is trained as described in the specification. The position determining unit is configured to determine a position of the needle tip based on a positional relationship between the needle region and the needle tip region. The position adjusting unit is configured to adjust a relative position between the test object and the needle tip of the probe needle based on the position of the needle tip determined by the position determining unit.

Abstract: An inspection apparatus for electrical inspection of a substrate is provided. The inspection apparatus includes: a probe card including a plurality of probes; a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes; and a controller configured to control a movement of the stage. The controller calculates, using a first displacement amount based on a vertical load of the probe card and a second displacement amount based on an unbalanced load of the probe card that is inclined with respect to the vertical load, a three-dimensional correction amount for the unbalanced load of the probe card, and the controller moves the stage based on the three-dimensional correction amount.

Abstract: A substrate misalignment detection method includes: acquiring first image information or first position information of a substrate held to a stage by suction at a first height position; delivering the substrate from the stage to a holder in a state in which the suction of the substrate is released and causing the holder to hold the substrate at the first height position; acquiring second image information or second position information of the substrate held at the first height position; and detecting misalignment of the substrate by comparing the first image information with the second image information or by comparing the first position information with the second position information.

Abstract: There is provided an alignment method of a probe card including a plurality of probe groups provided corresponding to a plurality of chips, comprising: a first mode for calculating a gradient and a center of a probe group based on position information of two or more probes included in the probe group for each of the plurality of chips and calculating a gradient and a center of the probe card based on the calculated grandients and the calculated centers of the plurality of probe groups.

Abstract: An inspection system includes a plurality of inspection apparatuses, and a data processing apparatus capable of communicating with the plurality of inspection apparatuses. The data processing apparatus includes a storage part storing a model that determines a causal relationship between an apparatus parameter related to setting of the plurality of inspection apparatuses and index data obtained when the plurality of inspection apparatuses are operated, a collection part collecting the apparatus parameter and the index data, a determination part determining whether or not the index data is included in a predetermined allowable range, and a calculation part calculating an adjustment amount for adjusting the apparatus parameter, based on the apparatus parameter and the index data, and the model, when it is determined that the index data is not included in the predetermined allowable range.

Abstract: A probe card management system includes inspection apparatuses that inspect an inspection object and a management apparatus that manages a state of a probe card. Each inspection apparatus includes a camera that captures an image of a tip of each needle provided on the probe card, an inspection part that measures a state of the tip from the image, and inspects the inspection object by bringing the tip into contact with each test pad based on the measurement result, and supplying an electrical signal to the inspection object through the tip; and a transmission part that transmits the measurement result and a number of executions of the inspection to the management apparatus. The management apparatus includes a threshold specification part that specifies a first threshold value, and a notification part that notifies an outside of the number of executions and the first threshold value.

Abstract: A substrate misalignment detection method includes: acquiring first image information or first position information of a substrate held to a stage by suction at a first height position; delivering the substrate from the stage to a holder in a state in which the suction of the substrate is released and causing the holder to hold the substrate at the first height position; acquiring second image information or second position information of the substrate held at the first height position; and detecting misalignment of the substrate by comparing the first image information with the second image information or by comparing the first position information with the second position information.

Abstract: An image recognition system includes: an image data collector configured to collect image data including a recognition target from a plurality of test apparatuses; a learning processor configured to perform additional machine learning based on the image data collected in the image data collector for a first model configured to recognize a characteristic portion of the recognition target; a model updater configured to update a model from the first model to a second model based on a result of the additional machine learning; a first transmitter configured to transmit the second model to a specific test apparatus; a recognition result determiner configured to receive and determine a recognition result using the second model in the specific test apparatus; and a second transmitter configured to transmit the second model to at least one of the plurality of test apparatuses in accordance with a determination result by the recognition result determiner.

Abstract: A probe card management system includes inspection apparatuses that inspect an inspection object and a management apparatus that manages a state of a probe card. Each inspection apparatus includes a camera that captures an image of a tip of each needle provided on the probe card, an inspection part that measures a state of the tip from the image, and inspects the inspection object by bringing the tip into contact with each test pad based on the measurement result, and supplying an electrical signal to the inspection object through the tip; and a transmission part that transmits the measurement result and a number of executions of the inspection to the management apparatus. The management apparatus includes a threshold specification part that specifies a first threshold value, and a notification part that notifies an outside of the number of executions and the first threshold value.

Abstract: An inspection system includes a plurality of inspection apparatuses, and a data processing apparatus capable of communicating with the plurality of inspection apparatuses. The data processing apparatus includes a storage part storing a model that determines a causal relationship between an apparatus parameter related to setting of the plurality of inspection apparatuses and index data obtained when the plurality of inspection apparatuses are operated, a collection part collecting the apparatus parameter and the index data, a determination part determining whether or not the index data is included in a predetermined allowable range, and a calculation part calculating an adjustment amount for adjusting the apparatus parameter, based on the apparatus parameter and the index data, and the model, when it is determined that the index data is not included in the predetermined allowable range.

Abstract: A prober for performing inspection comprises a probe position detection camera configured to detect a position of a leading end of the probe for performing a relative position alignment of the electrode of the wafer and the probe, a probe height detector configured to detect a height of the leading end of the probe from a reference surface serving as a reference of a height of the probe position detection camera, an adjustment mechanism configured to adjust a distance between the leading end of the probe and the probe position detection camera based on a detection result of the probe height detector, and a correction mechanism configured to correct the distance between the leading end of the probe and the probe position detection camera based on image data of the probe captured by the probe position detection camera after the distance is adjusted by the adjustment mechanism.

Abstract: A coating film forming apparatus includes: a coating nozzle; a horizontal moving mechanism that relatively moves a substrate and the coating nozzle; a pressure regulating mechanism that regulates a pressure inside the coating nozzle; and a controller that changes an amount of the coating solution to be supplied from the coating nozzle, wherein the coating nozzle includes: a discharge port that is formed long in a direction perpendicular to a direction of the relative movement with respect to the substrate; and a storage chamber that communicates with the discharge port and stores the coating solution therein, and wherein while the coating solution is applied to the substrate, the pressure regulating mechanism is controlled according to a change in width of the substrate, to regulate the pressure inside the storage chamber to thereby change a discharge amount per unit time of the coating solution to be discharged.

Abstract: A coating film forming apparatus includes: a coating nozzle; a horizontal moving mechanism that relatively moves a substrate and the coating nozzle; a pressure regulating mechanism that regulates a pressure inside the coating nozzle; and a controller that changes an amount of the coating solution to be supplied from the coating nozzle, wherein the coating nozzle includes: a discharge port that is formed long in a direction perpendicular to a direction of the relative movement with respect to the substrate; and a storage chamber that communicates with the discharge port and stores the coating solution therein, and wherein while the coating solution is applied to the substrate, the pressure regulating mechanism is controlled according to a change in width of the substrate, to regulate the pressure inside the storage chamber to thereby change a discharge amount per unit time of the coating solution to be discharged.

Abstract: In a method for forming a sintered silver coating film, for use as a heat spreader, on a semiconductor substrate or a semiconductor package, a coating film of an ink or paste containing silver nanoparticles is formed on one surface of the semiconductor substrate or the substrate package. Further, the coating film is sintered by heating the coating film under an atmosphere of a humidity of 30% to 50% RH (30° C.) by a ventilation oven.

Abstract: The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.

Abstract: The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.

Abstract: The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.

Abstract: The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.

Abstract: In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stage in at least the Z direction. The recessed chamber has a bottom portion and side portion. A lower camera, an upper camera, and the stage are operated to obtain data for alignment. When the upper end of the side portion of the recessed chamber comes into tight contact with the lower surface of the sealing member and a vacuum mechanism evacuates the recessed chamber, a vacuum chamber is formed. As the chamber has a small capacity, the time required for evacuation can be shortened.