Abstract: A crystal layered structure includes a Ga2O3 substrate and a nitride semiconductor layer and is capable of providing a light emitting element having high light output and a light emitting element includes this crystal layered structure. The crystal layered structure includes a Ga2O3 substrate a dielectric layer which is formed on the Ga2O3 substrate so as to partially cover the upper surface of the Ga2O3 substrate, and which has a refractive index difference of 0.15 or less relative to the Ga2O3 substrate and a nitride semiconductor layer which is formed on the Ga2O3 substrate with the dielectric layer interposed therebetween, and which is in contact with the dielectric layer and a portion not covered by the dielectric layer on the upper surface of the Ga2O3 substrate.

Abstract: A method for manufacturing a semiconductor stacked body, and a semiconductor element including the semiconductor stacked body includes a semiconductor stacked body, including a Ga2O3 substrate having, as a principal plane, a plane on which oxygen atoms are arranged in a hexagonal lattice, an AlN buffer layer formed on the Ga2O3 substrate, and a nitride semiconductor layer formed on the AlN buffer layer.

Abstract: A semiconductor multilayer structure includes a ?-Ga2O3-based single crystal substrate including a dislocation density on a main surface of not more than 1×103/cm2; and a nitride semiconductor layer including an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal epitaxially grown on the ?-Ga2O3-based single crystal substrate.

Abstract: A semiconductor multilayer structure includes a ?-Ga2O3-based single crystal substrate including a main surface including a (?201), (101), (310) or (3-10) plane, the ?-Ga2O3-based single crystal substrate being free from any twinning plane or further including a region free from any twinning plane, the region including a maximum width of not less than 2 inches in a direction perpendicular to an intersection line between a twinning plane and the main surface, and a nitride semiconductor layer including an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal epitaxially grown on the ?-Ga2O3-based single crystal substrate.

Abstract: Provided is a crystal layered structure having a low dislocation density on the upper surface of a nitride semiconductor layer on a Ga2O3 substrate, and a method for manufacturing the same. In one embodiment, there is provided a crystal layered structure including: a Ga2O3 substrate; a buffer layer comprising an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal on the Ga2O3 substrate; and a nitride semiconductor layer comprising an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y +z=1) crystal including oxygen as an impurity on the buffer layer. The oxygen concentration in a region having a thickness of no less than 200 nm on the nitride semiconductor layer on the side towards the Ga2O3 substrate is no less than 1.0×1018/cm3.

Abstract: Provided is a semiconductor laminate structure including a Ga2O3 substrate and a nitride semiconductor layer with high crystal quality on the Ga2O3 substrate, and also provided is a semiconductor element including this semiconductor laminate structure. In one embodiment, this semiconductor laminate structure includes a ?-Ga2O3 substrate including ?-Ga2O3 crystal and a principal surface inclined from a (?201) surface to a [102] direction nd a nitride semiconductor layer including AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal formed by epitaxial crystal growth on the principal surface of the ?-Ga2O3 substrate.

Abstract: Provided is a crystal layered structure having a low dislocation density on the upper surface of a nitride semiconductor layer on a Ga2O3 substrate, and a method for manufacturing the same. In one embodiment, there is provided a crystal layered structure including: a Ga2O3 substrate; a buffer layer comprising an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal on the Ga2O3 substrate; and a nitride semiconductor layer comprising an AlxGayInzN (0?x?1, 0?y?1, 0?z?1, x+y+z=1) crystal including oxygen as an impurity on the buffer layer. The oxygen concentration in a region having a thickness of no less than 200 nm on the nitride semiconductor layer on the side towards the Ga2O3 substrate is no less than 1.0×1018/cm3.

Abstract: A method for manufacturing a semiconductor stacked body, and a semiconductor element including the semiconductor stacked body includes a semiconductor stacked body, including a Ga203 substrate having, as a principal plane, a plane on which oxygen atoms are arranged in a hexagonal lattice, an AIN buffer layer formed on the Ga203 substrate, and a nitride semiconductor layer formed on the AIN buffer layer.

Abstract: A semiconductor laminate having small electric resistivity in the thickness direction; a process for producing the semiconductor laminate; and a semiconductor element equipped with the semiconductor laminate. include a semiconductor laminate including a Ga203 substrate; an AlGalnN buffer layer which is formed on the Ga203 substrate; a nitride semiconductor layer which is formed on the AlGalnN buffer layer and contains Si; and an Si-rich region which is formed in an area located on the AlGalnN buffer layer side in the nitride semiconductor layer and has an Si concentration of 5×1018/cm3 or more.