Patents by Inventor Shinobu Kourakata
Shinobu Kourakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190043778Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.Type: ApplicationFiled: December 26, 2015Publication date: February 7, 2019Inventors: Zhizhong TANG, Shinobu KOURAKATA, Kazuo OGATA, Paul R. START, Syadwad JIAN, William Nicholas LABANOK, Wei HU, Peng LI, Douglas R. YOUNG, Gregory S. CONSTABLE, John J. Beatty, Pardeep K. BHATTI, Luke J. GARNER, Aravindha R. ANTONISWAMY
-
Publication number: 20160372398Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.Type: ApplicationFiled: September 1, 2016Publication date: December 22, 2016Applicant: INTEL CORPORATIONInventors: Shinobu Kourakata, Kazuo Ogata
-
Patent number: 9460982Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.Type: GrantFiled: December 6, 2015Date of Patent: October 4, 2016Assignee: Intel CorporationInventors: Shinobu Kourakata, Kazuo Ogata
-
Publication number: 20160086871Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.Type: ApplicationFiled: December 6, 2015Publication date: March 24, 2016Applicant: Intel CorporationInventors: Shinobu Kourakata, Kazuo Ogata
-
Patent number: 9236323Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.Type: GrantFiled: February 26, 2013Date of Patent: January 12, 2016Assignee: Intel CorporationInventors: Shinobu Kourakata, Kazuo Ogata
-
Publication number: 20140239482Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.Type: ApplicationFiled: February 26, 2013Publication date: August 28, 2014Inventors: Shinobu Kourakata, Kazuo Ogata
-
Patent number: 7335973Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.Type: GrantFiled: February 21, 2006Date of Patent: February 26, 2008Assignee: Intel CorporationInventors: Rahul N. Manepalli, Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda
-
Patent number: 7224075Abstract: A system and a method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.Type: GrantFiled: August 13, 2004Date of Patent: May 29, 2007Assignee: Intel CorporationInventors: Rahul N. Manepalli, Shinobu Kourakata, Nina Ricci P. Buenaseda
-
Publication number: 20060141749Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.Type: ApplicationFiled: February 21, 2006Publication date: June 29, 2006Inventors: Rahul Manepalli, Karen Paghasian, Shinobu Kourakata, Ruel Aranda
-
Patent number: 7033911Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.Type: GrantFiled: March 31, 2004Date of Patent: April 25, 2006Assignee: Intel CorporationInventors: Rahul N. Manepalli, Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda
-
Publication number: 20060038276Abstract: A method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.Type: ApplicationFiled: October 19, 2005Publication date: February 23, 2006Inventors: Rahul Manepalli, Shinobu Kourakata, Nina Ricci Buenaseda
-
Publication number: 20060033192Abstract: A method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.Type: ApplicationFiled: August 13, 2004Publication date: February 16, 2006Inventors: Rahul Manepalli, Shinobu Kourakata, Nina Ricci Buenaseda
-
Publication number: 20050224993Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.Type: ApplicationFiled: March 31, 2004Publication date: October 13, 2005Inventors: Rahul Manepalli, Karen Paghasian, Shinobu Kourakata, Ruel Aranda