Patents by Inventor Shinobu Otao

Shinobu Otao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting module comprising an exposed plate surface
    Patent number: 9484515
    Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: November 1, 2016
    Assignees: S.E.I Inc., Shimane Prefectural Government
    Inventors: Satoshi Komatsubara, Kenichi Fukuda, Shinobu Otao, Toru Furuta
  • Semiconductor light emitting device comprising cut-and-bent portions
    Patent number: 9022613
    Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: May 5, 2015
    Assignees: Shimane Prefectural Government, Shimane Electronic Imafuku Works Co., Ltd.
    Inventors: Satoshi Komatsubara, Kenichi Fukuda, Shinobu Otao, Toru Furuta
  • SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140319552
    Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
    Type: Application
    Filed: July 10, 2014
    Publication date: October 30, 2014
    Inventors: Satoshi Komatsubara, Kenichi Fukuda, Shinobu Otao, Toru Furuta
  • SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110095310
    Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
    Type: Application
    Filed: March 19, 2009
    Publication date: April 28, 2011
    Applicant: SHIMANE PREFECTURAL GOVERNMENT
    Inventors: Satoshi Komatsubara, Kenichi Fukuda, Shinobu Otao, Toru Furuta