Patents by Inventor Shinsuke Asada
Shinsuke Asada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240083184Abstract: The present invention is a position adjustment method for head units arrayed in a predetermined width direction attachably to and detachably from a base member. A position of a second head unit in the width direction and a rotation direction are respectively adjusted while the second head unit is engaging a tip part of a reference pin. More particularly, a width direction adjuster moves the second head unit in the width direction with a first head unit kept fixed to the base member. In this way, the gap between the first head unit and the second head unit is adjusted. Further, a rotation direction adjuster moves the second head unit in the orthogonal direction at a separation position distant from the reference pin. In this way, a rotation direction position of the second head unit with respect to the tip part of the reference pin is adjusted.Type: ApplicationFiled: August 29, 2023Publication date: March 14, 2024Inventors: Kazuhiko ASADA, Shinsuke Yamashita
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Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device
Patent number: 11901326Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.Type: GrantFiled: December 9, 2021Date of Patent: February 13, 2024Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Satoru Ishikawa, Yuki Yano, Shohei Ogawa, Kiyoshi Arai -
Publication number: 20220254749Abstract: An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.Type: ApplicationFiled: December 9, 2021Publication date: August 11, 2022Applicant: Mitsubishi Electric CorporationInventors: Shinsuke ASADA, Satoru ISHIKAWA, Yuki YANO, Shohei OGAWA, Kiyoshi ARAI
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Patent number: 10573570Abstract: The object of the present invention is to provide a semiconductor device capable of reducing the influence of gas generated from a resin to which a fire retardant is not added, and a power conversion device including the semiconductor device. The semiconductor device according to the present invention includes: a semiconductor element disposed on an insulating substrate; a case disposed around an outer edge of the insulating substrate, the case including an opening facing the semiconductor element; a sealing resin sealing the semiconductor element in the case; and a lid closing the opening of the case, wherein the sealing resin does not contain a fire retardant, the lid contains the fire retardant, and a space is provided between the sealing resin and the lid.Type: GrantFiled: September 14, 2018Date of Patent: February 25, 2020Assignee: Mitsubishi Electric CorporationInventors: Daisuke Murata, Hiroshi Yoshida, Satoshi Kondo, Shinsuke Asada, Yusuke Kaji
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Patent number: 10388581Abstract: A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.Type: GrantFiled: April 23, 2018Date of Patent: August 20, 2019Assignee: Mitsubishi Electric CorporationInventors: Hidetoshi Ishibashi, Shinsuke Asada, Yoshitaka Kimura, Minoru Egusa
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Publication number: 20190164857Abstract: The object of the present invention is to provide a semiconductor device capable of reducing the influence of gas generated from a resin to which a fire retardant is not added, and a power conversion device including the semiconductor device. The semiconductor device according to the present invention includes: a semiconductor element disposed on an insulating substrate; a case disposed around an outer edge of the insulating substrate, the case including an opening facing the semiconductor element; a sealing resin sealing the semiconductor element in the case; and a lid closing the opening of the case, wherein the sealing resin does not contain a fire retardant, the lid contains the fire retardant, and a space is provided between the sealing resin and the lid.Type: ApplicationFiled: September 14, 2018Publication date: May 30, 2019Applicant: Mitsubishi Electric CorporationInventors: Daisuke MURATA, Hiroshi YOSHIDA, Satoshi KONDO, Shinsuke ASADA, Yusuke KAJI
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Publication number: 20190103330Abstract: A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.Type: ApplicationFiled: April 23, 2018Publication date: April 4, 2019Applicant: Mitsubishi Electric CorporationInventors: Hidetoshi ISHIBASHI, Shinsuke ASADA, Yoshitaka KIMURA, Minoru EGUSA
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Patent number: 9917064Abstract: A semiconductor device includes a semiconductor element having a lower surface bonded to an insulating substrate side, and a plate-shaped lead terminal bonded to an upper surface of the semiconductor element, and having a horizontally extending portion. The horizontally extending portion in the lead terminal is bonded to the semiconductor element and includes a linearly extending portion in a planar view. The semiconductor device further includes a sealing resin that seals the semiconductor element together with the linearly extending portion in the lead terminal. A linear expansion coefficient of the sealing resin shows a value intermediate between a linear expansion coefficient of the lead terminal and a linear expansion coefficient of the semiconductor element, and the lead terminal includes a recess or a projection to horizontally and partially separate the linearly extending portion into parts.Type: GrantFiled: July 2, 2015Date of Patent: March 13, 2018Assignee: Mitsubishi Electric CorporationInventors: Yusuke Ishiyama, Yuji Imoto, Junji Fujino, Shinsuke Asada, Mikio Ishihara
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Patent number: 9698091Abstract: A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a bottom surface defined by a surface of the insulating substrate, to which said semiconductor element is bonded. The wiring member has a bonding portion positioned above an upper surface electrode of the semiconductor element. The bonding portion of the wiring member is provided with a projection portion projecting toward the upper surface electrode of the semiconductor element and bonded to the upper surface electrode with a solder, and a through hole passing through the bonding portion in a thickness direction through the projection portion.Type: GrantFiled: June 29, 2015Date of Patent: July 4, 2017Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Naoki Yoshimatsu, Yuji Imoto, Yusuke Ishiyama, Junji Fujino
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Patent number: 9691730Abstract: A semiconductor device according to the present invention includes an insulating substrate having a circuit pattern, semiconductor elements bonded on the circuit pattern with a brazing material, and a wiring terminal bonded with a brazing material on an electrode provided on each of the semiconductor elements on an opposite side of the circuit pattern, in which a part of the wiring terminal is in contact with the insulating substrate, and insulated from the circuit pattern.Type: GrantFiled: June 29, 2015Date of Patent: June 27, 2017Assignee: Mitsubishi Electric CorporationInventors: Naoki Yoshimatsu, Yusuke Ishiyama, Taketoshi Shikano, Yuji Imoto, Junji Fujino, Shinsuke Asada
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Publication number: 20160111379Abstract: A semiconductor device includes a semiconductor element having a lower surface bonded to an insulating substrate side, and a plate-shaped lead terminal bonded to an upper surface of the semiconductor element, and having a horizontally extending portion. The horizontally extending portion in the lead terminal is bonded to the semiconductor element and includes a linearly extending portion in a planar view. The semiconductor device further includes a sealing resin that seals the semiconductor element together with the linearly extending portion in the lead terminal. A linear expansion coefficient of the sealing resin shows a value intermediate between a linear expansion coefficient of the lead terminal and a linear expansion coefficient of the semiconductor element, and the lead terminal includes a recess or a projection to horizontally and partially separate the linearly extending portion into parts.Type: ApplicationFiled: July 2, 2015Publication date: April 21, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yusuke ISHIYAMA, Yuji IMOTO, Junji FUJINO, Shinsuke ASADA, Mikio ISHIHARA
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Publication number: 20160104651Abstract: A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a bottom surface defined by a surface of the insulating substrate, to which said semiconductor element is bonded. The wiring member has a bonding portion positioned above an upper surface electrode of the semiconductor element. The bonding portion of the wiring member is provided with a projection portion projecting toward the upper surface electrode of the semiconductor element and bonded to the upper surface electrode with a solder, and a through hole passing through the bonding portion in a thickness direction through the projection portion.Type: ApplicationFiled: June 29, 2015Publication date: April 14, 2016Applicant: Mitsubishi Electric CorporationInventors: Shinsuke ASADA, Naoki YOSHIMATSU, Yuji IMOTO, Yusuke ISHIYAMA, Junji FUJINO
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Publication number: 20160099224Abstract: A semiconductor device according to the present invention includes an insulating substrate having a circuit pattern, semiconductor elements bonded on the circuit pattern with a brazing material, and a wiring terminal bonded with a brazing material on an electrode provided on each of the semiconductor elements on an opposite side of the circuit pattern, in which a part of the wiring terminal is in contact with the insulating substrate, and insulated from the circuit pattern.Type: ApplicationFiled: June 29, 2015Publication date: April 7, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Naoki YOSHIMATSU, Yusuke ISHIYAMA, Taketoshi SHIKANO, Yuji IMOTO, Junji FUJINO, Shinsuke ASADA
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Patent number: 9129949Abstract: A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.Type: GrantFiled: February 9, 2011Date of Patent: September 8, 2015Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Kenjiro Nagao, Dai Nakajima, Yuetsu Watanabe, Yoshihito Asao, Takuya Oga, Masaki Kato
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Patent number: 8749977Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.Type: GrantFiled: August 5, 2011Date of Patent: June 10, 2014Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Yuetsu Watanabe, Yoshihito Asao, Kenjiro Nagao
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Patent number: 8597755Abstract: A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.Type: GrantFiled: August 20, 2007Date of Patent: December 3, 2013Assignee: Mitsubishi Electric CorporationInventors: Seizo Fujimoto, Takafumi Hara, Shinsuke Asada, Hiroshi Kobayashi, Masaaki Taruya
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Publication number: 20130221516Abstract: A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.Type: ApplicationFiled: February 9, 2011Publication date: August 29, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinsuke Asada, Kenjiro Nagao, Dai Nakajima, Yuetsu Watanabe, Yoshihito Asao, Takuya Oga, Masaki Kato
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Publication number: 20120236503Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.Type: ApplicationFiled: August 5, 2011Publication date: September 20, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinsuke ASADA, Yuetsu WATANABE, Yoshihito ASAO, Kenjiro NAGAO
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Patent number: 8110062Abstract: A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.Type: GrantFiled: April 9, 2008Date of Patent: February 7, 2012Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
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Patent number: 7862874Abstract: A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.Type: GrantFiled: October 5, 2007Date of Patent: January 4, 2011Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya