Patents by Inventor Shinsuke Hagiwara
Shinsuke Hagiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8232355Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.Type: GrantFiled: November 24, 2006Date of Patent: July 31, 2012Assignee: Hitachi Chemical Co., Ltd.Inventors: Hisato Takahashi, Hisashi Tsukahara, Kyouichi Tomita, Shinsuke Hagiwara
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Patent number: 7981977Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.Type: GrantFiled: December 8, 2006Date of Patent: July 19, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Kazuyoshi Tendou, Satoru Tsuchida, Shinsuke Hagiwara
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Patent number: 7982322Abstract: The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 ?m, and (D) an inorganic filler having an average particle diameter of less than 2 ?m.Type: GrantFiled: September 28, 2007Date of Patent: July 19, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Satoru Tsuchida, Shinsuke Hagiwara, Kazuyoshi Tendou
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Publication number: 20100014263Abstract: The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 ?m, and (D) an inorganic filler having an average particle diameter of less than 2 ?m.Type: ApplicationFiled: September 28, 2007Publication date: January 21, 2010Inventors: Satoru Tsuchida, Shinsuke Hagiwara, Kazuyoshi Tendou
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Patent number: 7637571Abstract: Disclosed is a vehicle seat assembly having a feature in a seat cushion angle adjustment mechanism of a seat cushion in a simple configuration. A vehicle seat assembly according to an embodiment of the present invention comprises a seat back, a seat cushion coupled to the seat back, and a seat cushion angle adjustment mechanism for adjusting the seat angle of the seat cushion. The seat cushion angle adjustment mechanism comprises a seat cushion frame, a pivotal coupling member to pivotably couple the seat cushion frame to a slider of the seat rail, a guided part provided at a position away from a coupled position of the seat cushion frame to the pivotal coupling member, and a guide member having a guide groove which engages the guided part and guides the movement of the guided part and disposed with an angle between the guide groove and the slide surface of the seat rail set to a specific angle ?.Type: GrantFiled: January 16, 2008Date of Patent: December 29, 2009Assignee: NHK Spring Co., Ltd.Inventors: Ritsuro Okano, Shinsuke Hagiwara, Jun Aoki
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Publication number: 20090286930Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.Type: ApplicationFiled: November 24, 2006Publication date: November 19, 2009Inventors: Hisato Takahashi, Hisashi Tsukahara, Kyouichi Tomita, Shinsuke Hagiwara
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Publication number: 20090273070Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.Type: ApplicationFiled: December 8, 2006Publication date: November 5, 2009Inventors: Kazuyoshi Tendou, Satoru Tsuchida, Shinsuke Hagiwara
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Patent number: 7544727Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.Type: GrantFiled: October 28, 2005Date of Patent: June 9, 2009Assignee: Hitachi Chemical Co., Ltd.Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
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Publication number: 20080211283Abstract: Disclosed is a vehicle seat assembly having a feature in a seat cushion angle adjustment mechanism of a seat cushion in a simple configuration. A vehicle seat assembly according to an embodiment of the present invention comprises a seat back, a seat cushion coupled to the seat back, and a seat cushion angle adjustment mechanism for adjusting the seat angle of the seat cushion. The seat cushion angle adjustment mechanism comprises a seat cushion frame, a pivotal coupling member to pivotably couple the seat cushion frame to a slider of the seat rail, a guided part provided at a position away from a coupled position of the seat cushion frame to the pivotal coupling member, and a guide member having a guide groove which engages the guided part and guides the movement of the guided part and disposed with an angle between the guide groove and the slide surface of the seat rail set to a specific angle ?.Type: ApplicationFiled: January 16, 2008Publication date: September 4, 2008Inventors: Ritsuro Okano, Shinsuke Hagiwara, Jun Aoki
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Patent number: 7397139Abstract: An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.Type: GrantFiled: April 7, 2004Date of Patent: July 8, 2008Assignee: Hitachi Chemical Co., Ltd.Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
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Patent number: 7187072Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: GrantFiled: November 10, 2003Date of Patent: March 6, 2007Assignee: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Publication number: 20060214153Abstract: 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.Type: ApplicationFiled: April 7, 2004Publication date: September 28, 2006Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
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Publication number: 20060074150Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.Type: ApplicationFiled: October 28, 2005Publication date: April 6, 2006Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
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Publication number: 20040110319Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: ApplicationFiled: November 10, 2003Publication date: June 10, 2004Applicant: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Patent number: 6746897Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: GrantFiled: October 23, 2001Date of Patent: June 8, 2004Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Patent number: 6713589Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.Type: GrantFiled: November 9, 2001Date of Patent: March 30, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama
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Publication number: 20030201548Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.Type: ApplicationFiled: March 25, 2003Publication date: October 30, 2003Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
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Publication number: 20020094606Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: ApplicationFiled: January 8, 2002Publication date: July 18, 2002Applicant: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Publication number: 20020065386Abstract: This invention provides, as a novel compound suited as an encapsulating material for electronic devices, having a high Tg, being low moisture-absorptive, having a high adhesion and being rich in fluidity, a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.Type: ApplicationFiled: November 9, 2001Publication date: May 30, 2002Applicant: Hitachi Chemical Company, Ltd.Inventors: Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama
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Publication number: 20020039808Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: ApplicationFiled: October 23, 2001Publication date: April 4, 2002Applicant: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura