Abstract: The present invention provides uracil-requiring Moorella bacteria obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase; and transforming-gene-introduced Moorella bacteria obtained by introducing a gene coding for orotidine-5-phosphate decarboxylase and a transforming-gene to a chromosome of the uracil-requiring Moorella bacteria. The present invention was accomplished by uracil-requiring Moorella bacteria, comprising an MTA-D-pF strain that is obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase on a chromosome of Moorella bacteria.

Abstract: The present invention provides uracil-requiring Moorella bacteria obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase; and transforming-gene-introduced Moorella bacteria obtained by introducing a gene coding for orotidine-5-phosphate decarboxylase and a transforming-gene to a chromosome of the uracil-requiring Moorella bacteria. The present invention was accomplished by uracil-requiring Moorella bacteria, comprising an MTA-D-pF strain that is obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase on a chromosome of Moorella bacteria.

Abstract: The present invention provides a primer set used for transformation that imparts a uracil requiring property by deleting or destroying a gene coding for orotidine-5-phosphate decarboxylase in Moorella bacteria. The present invention is accomplished by a primer set that is used for creating a uracil requiring strain obtained by deleting or destroying a gene coding for orotidine-5-phosphate decarboxylase in Moorella bacteria by homologous recombination and is represented by SEQ ID No. 1 and 2 that amplify an upstream region adjacent to said gene coding for orotidine-5-phosphate decarboxylase.

Abstract: A damage probability calculating apparatus for calculating a damage probability of a specific estimation target includes: a storage unit 1 that stores a damage rate function representing a relationship between a damage rate and time; a damage rate function correcting unit 3 that corrects the damage rate function on the basis of examination data acquired at the time of general examination of the estimation target; and a damage probability calculating unit 4 that calculates the damage probability on the basis of the damage rate function corrected by the damage rate function correcting unit 3.

Abstract: A method and apparatus adapted to bunch together a predetermined number of inverted PTPs and uninverted PTPs into a bundle, and then transfer each PTP bundle to a bucket conveyor which moves intermittently in parallel with a conveying passage. A multitude of PTPs, a portion of which are inverted with respect to the conveying direction and the rest of which are not inverted, are conveyed along a first conveying passage while maintaining the blistered surfaces of the inverted and uninverted PTPs in parallel with each other. A selected portion of the PTPs being conveyed in the first conveying passage is pinched and separated from the same passage. The separated PTPs are bunched together while the spacing between the separated PTPs is narrowed in the conveying direction. The bunched PTPs are transferred onto a second conveying passage across the first conveying passage. The bunched PTPs are loaded into a bucket provided on a bucket conveyor which intermittently travels along the second conveying passage.

Abstract: The invention relates to a process of production of a semiconductor substrate by binding etc. involving the direct polishing of an oxide film with step differences. A silicon oxide film (3) having step differences is formed on at least one surface of an active layer substrate (A). This silicon oxide film (3) is polished by a rigid platen using a polishing agent comprised primarily of cerium oxide. A support substrate (B) is laminated to the bonding face (3a) this obtained to obtain a wafer of a SOI structure. This enables elimination of the polycrystalline silicon layer on the silicon oxide film which had been formed only for bonding purposes.

Abstract: In breaking a syntagm, such as a phrase, a clause, a sentence, or sentences, into a succession of analyzed morphemes, use is made of at least one group of morphemes included in the syntagm which includes two or more morphemes in a customary order. These two or more morphemes of each group are stored in a dictionary together with a descriptor, such as TIME or ANGLE, descriptive of the group, and an identifier or number indicative of the customary order. Selected by a separating unit, candidate morphemes for the analyzed morphemes are stored, together with, if any, the descriptor and at least one of the identifier or a mark, in a memory as memorized morphemes. An output unit selects those memorized morphemes which are accompanied by a common descriptor descriptive of a single group and either the identifier or the mark indicative of the customary order of morphemes in the group, and outputs these as the analyzed morphemes.

Abstract: The present invention relates to a method for polishing a silicon wafer. The method comprises the steps of: (a) supplying a polishing fluid to a polishing surface, the polishing fluid including an alkaline fluid and polishing particles of high-purity silica dispersed in the alkaline fluid, the polishing surface being planar; (b) bringing a silicon wafer in contact with the polishing surface; and (c) moving at least one of the silicon wafer and the polishing surface relative to the other, thereby polishing the silicon wafer. The method is characterized by the following: the polishing surface is made of a ceramic material harder than the silicon wafer and more resistant to mechanochemical polishing than silicon, and the maximum roughness of the ceramic is less than 0.02 .mu.m.

Abstract: A dressing apparatus comprises a head movably mounted on a tip portion of a body, the head having a tip having formed therein a cut-out which opens in the direction of the movement of the head and into which one of outer and inner peripheral cutting edges formed on a cut-off wheel in the form of a disc is adapted to be inserted, a tape traveling device mounted on the head and the body for causing a tape having a layer of abrasive grain on a side thereof to travel across the cut-out in the head, and an actuator disposed between the head and the body for moving the head. The dressing apparatus and a dressing method are arranged such that the one peripheral cutting edge is inserted into the cut-out in the head, and the one peripheral cutting edge and the side of the tape are brought into contact with each other while causing the tape to travel by the tape traveling device, to apply the dressing to the one peripheral cutting edge.