Patents by Inventor Shintaro Abe
Shintaro Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132147Abstract: A vehicle power supply system includes a power source control device that executes a process of switching a connection state of a driving circuit to the main power source and an auxiliary power source including; a process of switching the connection state so as to transition to a backup state as a voltage decrease of the main power source occurs, and a process of switching the connection state so as to transition to a normal state as the voltage decrease of the main power source is resolved. After a voltage decrease of the main power source occurs, a turning-side control device of a steering control unit sets an output-limited state for a turning-side motor. The output-limited state is canceled upon the power source control device completing switching of the connection state so as to transition.Type: ApplicationFiled: October 11, 2023Publication date: April 25, 2024Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATIONInventors: Yuuta KAJISAWA, Yuji FUJITA, Yugo NAGASHIMA, Kazuma HASEGAWA, Takashi KOUDAI, Kaishi MONOBE, Kenichi ABE, Masaharu YAMASHITA, Shintaro TAKAYAMA, Kazuaki IIDA, Yasushi HORA, Yosuke YAMASHITA, Hiroki TOMIZAWA, Nobuyori NAKAJIMA, Hayaki TANABE, Toyohiro HAYASHI, Takeshi IWANA
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Publication number: 20240124047Abstract: A steering control device configured to control a steering device, the steering device including a steering shaft to which a handle is detachably coupled and a motor configured to generate torque that is given to the steering shaft. The steering control device includes a processing circuit configured to execute a process for controlling driving of the motor. The process for controlling the driving of the motor includes a lock process of driving the motor such that a rotation position of the steering shaft is fixed at a specific position, in a state where the handle has been detached from the steering shaft.Type: ApplicationFiled: October 11, 2023Publication date: April 18, 2024Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Taiki MATSUMOTO, Kenichi ABE, Yuuta KAJISAWA, Yugo NAGASHIMA, Kazuma HASEGAWA, Takashi KOUDAI, Yosuke YAMASHITA, Shintaro TAKAYAMA, Hiroyuki KATAYAMA, Masaharu YAMASHITA
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Publication number: 20240093849Abstract: To prevent point illumination and fix a light-guiding body. The present invention includes: a fixation portion having a first holding portion and a second holding portion; engagement portions that restrict frontward movement of the one end portion in the front-back direction; an elastic portion that generates elastic force upward in the up-down direction, and abuts on the one end portion to maintain engagement of the engagement portions; contact portions that bring the first holding portion and the one end portion into contact with each other on both sides in the left-right direction; an abutment portion that abuts on the one end portion to restrict backward movement of the one end portion in the front-back direction; and a restriction portion that abuts on the elastic portion to restrict downward movement of the elastic portion in the up-down direction.Type: ApplicationFiled: December 1, 2021Publication date: March 21, 2024Applicant: ICHIKOH INDUSTRIES, LTD.Inventors: Seito WADA, Shintaro ABE
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Patent number: 11919579Abstract: A power supply system includes a system control unit, an auxiliary power supply, and an auxiliary-power-supply control unit. The system control unit and the auxiliary-power-supply control unit are configured such that information of at least one control unit of the system control unit and the auxiliary-power-supply control unit is able to be output to another control unit of the system control unit and the auxiliary-power-supply control unit. The at least one control unit is configured to output information indicating that an operation of the at least one control unit is stopped to the other control unit when the at least one control unit stops the operation of the at least one control unit.Type: GrantFiled: December 1, 2021Date of Patent: March 5, 2024Assignees: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kazuma Hasegawa, Toshihiro Takahashi, Yuji Fujita, Kenichi Abe, Yugo Nagashima, Yuuta Kajisawa, Takashi Koudai, Hiroaki Hanzawa, Atsushi Satou, Yosuke Yamashita, Shintaro Takayama, Tokuaki Hibino
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Patent number: 11747365Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.Type: GrantFiled: October 18, 2019Date of Patent: September 5, 2023Assignees: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.Inventors: Toshinori Omori, Kazuya Goto, Yasuaki Osanai, Takashi Akiniwa, Takeki Sugisawa, Takeshi Kondo, Shintaro Abe, Maki Watanabe
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Publication number: 20220099702Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.Type: ApplicationFiled: October 18, 2019Publication date: March 31, 2022Applicants: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.Inventors: TOSHINORI OMORI, KAZUYA GOTO, YASUAKI OSANAI, TAKASHI AKINIWA, TAKEKI SUGISAWA, TAKESHI KONDO, SHINTARO ABE, MAKI WATANABE
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Patent number: 11118089Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.Type: GrantFiled: June 6, 2018Date of Patent: September 14, 2021Assignee: TANAKA KIKINZOKU KOGYO K.K.Inventors: Shintaro Abe, Kanako Furutachi, Takeshi Kondo, Rikia Furusho
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Publication number: 20200157388Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.Type: ApplicationFiled: June 6, 2018Publication date: May 21, 2020Applicant: TANAKA KIKINZOKU KOGYO K.K.Inventors: Shintaro ABE, Kanako FURUTACHI, Takeshi KONDO, Rikia FURUSHO
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Patent number: 10633564Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.Type: GrantFiled: May 28, 2015Date of Patent: April 28, 2020Assignee: TANAKA KIKINZOKU KOGYO K.K.Inventors: Shintaro Abe, Rikia Furusho
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Publication number: 20190136099Abstract: The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.Type: ApplicationFiled: March 28, 2018Publication date: May 9, 2019Inventors: Koyo KOBORI, Yoshito IMAI, Shintaro ABE, Takeshi KONDO
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Patent number: 10266730Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.Type: GrantFiled: January 27, 2016Date of Patent: April 23, 2019Assignee: TANAKA KIKINZOKU KOGYO K.K.Inventors: Rikia Furusho, Shintaro Abe, Takeshi Kondo, Teruki Tanaka
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Publication number: 20180010020Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.Type: ApplicationFiled: January 27, 2016Publication date: January 11, 2018Inventors: Rikia FURUSHO, Shintaro ABE, Takeshi KONDO, Teruki TANAKA
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Patent number: 9865970Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.Type: GrantFiled: June 3, 2016Date of Patent: January 9, 2018Assignee: YAZAKI CORPORATIONInventors: Shintaro Abe, Isao Kameyama
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Publication number: 20170210951Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range.Type: ApplicationFiled: May 28, 2015Publication date: July 27, 2017Inventors: Shintaro ABE, Rikia FURUSHO
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Publication number: 20160365674Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.Type: ApplicationFiled: June 3, 2016Publication date: December 15, 2016Inventors: Shintaro Abe, Isao Kameyama
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Patent number: 9391409Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.Type: GrantFiled: May 21, 2015Date of Patent: July 12, 2016Assignee: YAZAKI CORPORATIONInventors: Shintaro Abe, Isao Kameyama
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Publication number: 20150340816Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.Type: ApplicationFiled: May 21, 2015Publication date: November 26, 2015Applicant: Yazaki CorporationInventors: Shintaro ABE, Isao KAMEYAMA
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Patent number: 7575489Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.Type: GrantFiled: August 17, 2007Date of Patent: August 18, 2009Assignee: Honda Motor Co., Ltd.Inventors: Shintaro Abe, Tsuyoshi Kumasaka, Toshinori Hanai, Hiroshi Iwakami
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Patent number: 7434656Abstract: An exhaust device includes an exhaust pipe connected at its upstream end to a cylinder head of the engine and an exhaust muffler connected to the downstream end of the exhaust pipe for suppressing the generation of noise from a heat insulating cover that covers a part of the exhaust pipe. A heat insulating cover covers a portion of the exhaust pipe near the engine and a stay is fixed to the heat insulating cover. The stay includes a supporting plate portion curved so as to partially surround the outer circumference of the exhaust pipe. A first vibration isolating member is provided that is sandwiched between the outer circumference of the exhaust pipe and the supporting plate portion, a band member is tightened to mount the supporting plate portion to the exhaust pipe, and a second vibration isolating member is sandwiched between the supporting plate portion and the band member.Type: GrantFiled: August 30, 2005Date of Patent: October 14, 2008Assignee: Honda Motor Co., Ltd.Inventors: Kazuhiro Yasuda, Masashi Koyanagi, Shintaro Abe, Kazuo Yamamoto, Tadashi Oshima
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Publication number: 20080050992Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.Type: ApplicationFiled: August 17, 2007Publication date: February 28, 2008Applicant: HONDA MOTOR CO., LTD.Inventors: Shintaro Abe, Tsuyoshi Kumasaka, Toshinori Hanai, Hiroshi Iwakami