Patents by Inventor Shintaro Abe

Shintaro Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132147
    Abstract: A vehicle power supply system includes a power source control device that executes a process of switching a connection state of a driving circuit to the main power source and an auxiliary power source including; a process of switching the connection state so as to transition to a backup state as a voltage decrease of the main power source occurs, and a process of switching the connection state so as to transition to a normal state as the voltage decrease of the main power source is resolved. After a voltage decrease of the main power source occurs, a turning-side control device of a steering control unit sets an output-limited state for a turning-side motor. The output-limited state is canceled upon the power source control device completing switching of the connection state so as to transition.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 25, 2024
    Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Yuuta KAJISAWA, Yuji FUJITA, Yugo NAGASHIMA, Kazuma HASEGAWA, Takashi KOUDAI, Kaishi MONOBE, Kenichi ABE, Masaharu YAMASHITA, Shintaro TAKAYAMA, Kazuaki IIDA, Yasushi HORA, Yosuke YAMASHITA, Hiroki TOMIZAWA, Nobuyori NAKAJIMA, Hayaki TANABE, Toyohiro HAYASHI, Takeshi IWANA
  • Publication number: 20240124047
    Abstract: A steering control device configured to control a steering device, the steering device including a steering shaft to which a handle is detachably coupled and a motor configured to generate torque that is given to the steering shaft. The steering control device includes a processing circuit configured to execute a process for controlling driving of the motor. The process for controlling the driving of the motor includes a lock process of driving the motor such that a rotation position of the steering shaft is fixed at a specific position, in a state where the handle has been detached from the steering shaft.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Taiki MATSUMOTO, Kenichi ABE, Yuuta KAJISAWA, Yugo NAGASHIMA, Kazuma HASEGAWA, Takashi KOUDAI, Yosuke YAMASHITA, Shintaro TAKAYAMA, Hiroyuki KATAYAMA, Masaharu YAMASHITA
  • Publication number: 20240093849
    Abstract: To prevent point illumination and fix a light-guiding body. The present invention includes: a fixation portion having a first holding portion and a second holding portion; engagement portions that restrict frontward movement of the one end portion in the front-back direction; an elastic portion that generates elastic force upward in the up-down direction, and abuts on the one end portion to maintain engagement of the engagement portions; contact portions that bring the first holding portion and the one end portion into contact with each other on both sides in the left-right direction; an abutment portion that abuts on the one end portion to restrict backward movement of the one end portion in the front-back direction; and a restriction portion that abuts on the elastic portion to restrict downward movement of the elastic portion in the up-down direction.
    Type: Application
    Filed: December 1, 2021
    Publication date: March 21, 2024
    Applicant: ICHIKOH INDUSTRIES, LTD.
    Inventors: Seito WADA, Shintaro ABE
  • Patent number: 11919579
    Abstract: A power supply system includes a system control unit, an auxiliary power supply, and an auxiliary-power-supply control unit. The system control unit and the auxiliary-power-supply control unit are configured such that information of at least one control unit of the system control unit and the auxiliary-power-supply control unit is able to be output to another control unit of the system control unit and the auxiliary-power-supply control unit. The at least one control unit is configured to output information indicating that an operation of the at least one control unit is stopped to the other control unit when the at least one control unit stops the operation of the at least one control unit.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: March 5, 2024
    Assignees: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kazuma Hasegawa, Toshihiro Takahashi, Yuji Fujita, Kenichi Abe, Yugo Nagashima, Yuuta Kajisawa, Takashi Koudai, Hiroaki Hanzawa, Atsushi Satou, Yosuke Yamashita, Shintaro Takayama, Tokuaki Hibino
  • Patent number: 11747365
    Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 5, 2023
    Assignees: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Omori, Kazuya Goto, Yasuaki Osanai, Takashi Akiniwa, Takeki Sugisawa, Takeshi Kondo, Shintaro Abe, Maki Watanabe
  • Publication number: 20220099702
    Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.
    Type: Application
    Filed: October 18, 2019
    Publication date: March 31, 2022
    Applicants: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: TOSHINORI OMORI, KAZUYA GOTO, YASUAKI OSANAI, TAKASHI AKINIWA, TAKEKI SUGISAWA, TAKESHI KONDO, SHINTARO ABE, MAKI WATANABE
  • Patent number: 11118089
    Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: September 14, 2021
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Shintaro Abe, Kanako Furutachi, Takeshi Kondo, Rikia Furusho
  • Publication number: 20200157388
    Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.
    Type: Application
    Filed: June 6, 2018
    Publication date: May 21, 2020
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Shintaro ABE, Kanako FURUTACHI, Takeshi KONDO, Rikia FURUSHO
  • Patent number: 10633564
    Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: April 28, 2020
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Shintaro Abe, Rikia Furusho
  • Publication number: 20190136099
    Abstract: The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.
    Type: Application
    Filed: March 28, 2018
    Publication date: May 9, 2019
    Inventors: Koyo KOBORI, Yoshito IMAI, Shintaro ABE, Takeshi KONDO
  • Patent number: 10266730
    Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: April 23, 2019
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Rikia Furusho, Shintaro Abe, Takeshi Kondo, Teruki Tanaka
  • Publication number: 20180010020
    Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.
    Type: Application
    Filed: January 27, 2016
    Publication date: January 11, 2018
    Inventors: Rikia FURUSHO, Shintaro ABE, Takeshi KONDO, Teruki TANAKA
  • Patent number: 9865970
    Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: January 9, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Shintaro Abe, Isao Kameyama
  • Publication number: 20170210951
    Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range.
    Type: Application
    Filed: May 28, 2015
    Publication date: July 27, 2017
    Inventors: Shintaro ABE, Rikia FURUSHO
  • Publication number: 20160365674
    Abstract: A connector includes a housing unit which accommodates terminals which are crimped onto respective ends of a plurality of electric wires. The housing unit includes housings of a number corresponding to a number of the terminals, each of the housings configured to accommodate each of the terminals. At least one of the housings is formed by a material which has a dielectric constant at which impedance between each of the terminals is a desired impedance.
    Type: Application
    Filed: June 3, 2016
    Publication date: December 15, 2016
    Inventors: Shintaro Abe, Isao Kameyama
  • Patent number: 9391409
    Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: July 12, 2016
    Assignee: YAZAKI CORPORATION
    Inventors: Shintaro Abe, Isao Kameyama
  • Publication number: 20150340816
    Abstract: An electronic device connector includes a connector housing that is combined with a case of an electronic device and a terminal fitting that is held by the connector housing. When the connector housing is combined with the case, the terminal fitting is electrically connected to a contact portion of the electronic device. The terminal fitting includes an internal conductor, an external conductor disposed around the internal conductor, and a dielectric disposed between the internal conductor and the external conductor which are concentrically disposed. The internal conductor and the external conductor are integrally provided with spring portions capable of being elastically deformed in contact with the contact portion of the electronic device.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 26, 2015
    Applicant: Yazaki Corporation
    Inventors: Shintaro ABE, Isao KAMEYAMA
  • Patent number: 7575489
    Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: August 18, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventors: Shintaro Abe, Tsuyoshi Kumasaka, Toshinori Hanai, Hiroshi Iwakami
  • Patent number: 7434656
    Abstract: An exhaust device includes an exhaust pipe connected at its upstream end to a cylinder head of the engine and an exhaust muffler connected to the downstream end of the exhaust pipe for suppressing the generation of noise from a heat insulating cover that covers a part of the exhaust pipe. A heat insulating cover covers a portion of the exhaust pipe near the engine and a stay is fixed to the heat insulating cover. The stay includes a supporting plate portion curved so as to partially surround the outer circumference of the exhaust pipe. A first vibration isolating member is provided that is sandwiched between the outer circumference of the exhaust pipe and the supporting plate portion, a band member is tightened to mount the supporting plate portion to the exhaust pipe, and a second vibration isolating member is sandwiched between the supporting plate portion and the band member.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: October 14, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazuhiro Yasuda, Masashi Koyanagi, Shintaro Abe, Kazuo Yamamoto, Tadashi Oshima
  • Publication number: 20080050992
    Abstract: To provide a small watercraft capable of suppressing vibration and noise of a vessel body, a jet pump is mounted to a hull via a thrust plate. A dynamic damper is disposed as an adjunct at a plate mounting portion that attaches the thrust plate to the hull. More specifically, the thrust plate is first mounted to the hull. Then, with a flange portion of the jet pump pressed up against a rear surface of the thrust plate, a second bolt is screwed in toward the thrust plate from an outward side of the hull. The jet pump is thereby attached to the rear surface of the thrust plate.
    Type: Application
    Filed: August 17, 2007
    Publication date: February 28, 2008
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Shintaro Abe, Tsuyoshi Kumasaka, Toshinori Hanai, Hiroshi Iwakami