Patents by Inventor Shintaro Hirata

Shintaro Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8093109
    Abstract: A method for forming a semiconductor thin film includes the steps of applying an inorganic semiconductor fine particle-dispersion solution on a substrate and drying the coating to form a semiconductor fine particle layer, and immersing the semiconductor fine particle layer in a solution to form a semiconductor thin film.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: January 10, 2012
    Assignee: Sony Corporation
    Inventors: Shintaro Hirata, Daisuke Hobara
  • Patent number: 7750343
    Abstract: Disclosed herein is an electronic device of a three-terminal type including, a control electrode, first and second electrodes, and an active layer provided between the first and second electrodes so as to face the control electrode with an insulating layer interposed therebetween, the active layer being formed from an aggregate of a composite material formed from inorganic semiconductor fine particles covered with a protective layer, the protective layer including an alkyl chain having, at one end thereof, a functional group bonded to an inorganic semiconductor fine particle and further having an organic semiconductor molecule bonded to the other end thereof.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: July 6, 2010
    Assignee: Sony Corporation
    Inventors: Myung-Seok Choi, Shintaro Hirata
  • Publication number: 20100081231
    Abstract: A method for forming a semiconductor thin film includes the steps of applying an inorganic semiconductor fine particle-dispersion solution on a substrate and drying the coating to form a semiconductor fine particle layer, and immersing the semiconductor fine particle layer in a solution to form a semiconductor thin film.
    Type: Application
    Filed: September 24, 2009
    Publication date: April 1, 2010
    Applicant: SONY CORPORATION
    Inventors: Shintaro Hirata, Daisuke Hobara
  • Publication number: 20080149921
    Abstract: Disclosed herein is an electronic device of a three-terminal type including, a control electrode, first and second electrodes, and an active layer provided between the first and second electrodes so as to face the control electrode with an insulating layer interposed therebetween, the active layer being formed from an aggregate of a composite material formed from inorganic semiconductor fine particles covered with a protective layer, the protective layer including an alkyl chain having, at one end thereof, a functional group bonded to an inorganic semiconductor fine particle and further having an organic semiconductor molecule bonded to the other end thereof.
    Type: Application
    Filed: August 22, 2007
    Publication date: June 26, 2008
    Applicant: SONY CORPORATION
    Inventors: Myung-Seok Choi, Shintaro Hirata
  • Patent number: 7113931
    Abstract: A fracture structure is grown from a plurality of starting points. A fractal structure, grown from respective starting points and interconnected by interactive growths, forms a neural network. A growth speed originated at a specific starting point is determined by the probability of a material reaching a grown portion from a remote location by means of a diffusion process and the probability of a growth promoting factor reaching a grown portion by means of a diffusion process from a portion grown from a starting point other than the specific one. Anisotropy is introduced into a space in which a fractal structure is to be grown, as required.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: September 26, 2006
    Assignee: Sony Corporation
    Inventors: Ryuichi Ugajin, Yoshihiko Kuroki, Akira Ishibashi, Shintaro Hirata
  • Publication number: 20040169204
    Abstract: In a multiply-complexed one-dimensional structure having a hierarchical structure in which a linear structure as an element of a one-dimensional structure having a finite curvature is made of a thinner one-dimensional structure having a finite curvature, at least two layers of one-dimensional unit structures are bonded in at least one site. For example, in a multiply-twisted helix having a hierarchical structure in which a linear structure as an element of a spiral structure is made of a thinner spiral structure, at least two layers of the unit spiral structures are bonded in at least one site. Alternatively, in a multiply-looped ring structure having a hierarchical structure in which a linear structure as an element of a ring structure is made of a thinner ring structure, at least two layers of ring unit structures are bonded in at least one site.
    Type: Application
    Filed: March 8, 2004
    Publication date: September 2, 2004
    Inventors: Ryuichi Ugajin, Shintaro Hirata, Masakazu Ukita
  • Patent number: 6759676
    Abstract: In a multiply-complexed one-dimensional structure having a hierarchical structure in which a linear structure as an element of a one-dimensional structure having a finite curvature is made of a thinner one-dimensional structure having a finite curvature, at least two layers of one-dimensional unit structures are bonded in at least one site. For example, in a multiply-twisted helix having a hierarchical structure in which a linear structure as an element of a spiral structure is made of a thinner spiral structure, at least two layers of the unit spiral structures are bonded in at least one site. Alternatively, in a multiply-looped ring structure having a hierarchical structure in which a linear structure as an element of a ring structure is made of a thinner ring structure, at least two layers of ring unit structures are bonded in at least one site.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: July 6, 2004
    Assignee: Sony Corporation
    Inventors: Ryuichi Ugajin, Shintaro Hirata, Masakazu Ukita
  • Publication number: 20030071239
    Abstract: In a multiply-complexed one-dimensional structure having a hierarchical structure in which a linear structure as an element of a one-dimensional structure having a finite curvature is made of a thinner one-dimensional structure having a finite curvature, at least two layers of one-dimensional unit structures are bonded in at least one site. For example, in a multiply-twisted helix having a hierarchical structure in which a linear structure as an element of a spiral structure is made of a thinner spiral structure, at least two layers of the unit spiral structures are bonded in at least one site. Alternatively, in a multiply-looped ring structure having a hierarchical structure in which a linear structure as an element of a ring structure is made of a thinner ring structure, at least two layers of ring unit structures are bonded in at least one site.
    Type: Application
    Filed: February 26, 2002
    Publication date: April 17, 2003
    Inventors: Ryuichi Ugajin, Shintaro Hirata, Masakazu Ukita