Patents by Inventor Shintaro Nakatani

Shintaro Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9271400
    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: February 23, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Kai, Shintaro Nakatani, Mitsuyoshi Hira, Takao Mukai, Hisashi Yamazaki
  • Publication number: 20140003017
    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.
    Type: Application
    Filed: September 3, 2013
    Publication date: January 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Seiji KAI, Shintaro NAKATANI, Mitsuyoshi HIRA, Takao MUKAI, Hisashi YAMAZAKI
  • Patent number: 6633339
    Abstract: A decoding apparatus (VDA) for decoding a mixed video stream (STv) of a plurality of streams (interlace scheme, progressive scheme) of different frame rates in predetermined decode timing (Vmc) for seamless playback, the apparatus including a stream analyzer (Ddv, 2) for extracting each frame rate before the plurality of streams (IS, PS) are decoded and a video decode controller (CDV) for determining the timing (Vmc) for decoding a slice layer (SL) of the video stream (STv) based on the extracted frame rate. The video stream (STv) is decoded in the determined timing (Vmc). Even if the video stream (STv) is switched between the streams (IS, PS) of different frame rate, seamless playback can be carried out.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: October 14, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shoichi Goto, Shintaro Nakatani
  • Patent number: 6373905
    Abstract: A decoding apparatus comprises: decoding means which receives a first code sequence of a hierarchical structure as an input, decodes a code sequence of a selected first layer and higher layers in the first code sequence, outputs a detection signal when an error is detected while the code sequence is being decoded, and detects a second code sequence indicating the start of the first layer and higher layers in a set code sequence parsing position of the first sequence; and means for setting a code sequence parsing position which receives the detection signal and sets the parsing position of the code sequence in such a way that code sequence parsing performed by the decoding means is returned from a point at which code sequence parsing is being performed to a point at which code sequence parsing has been performed in the first code sequence.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: April 16, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Yasuda, Shintaro Nakatani