Patents by Inventor Shintaro SUGIHARA
Shintaro SUGIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894246Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.Type: GrantFiled: August 2, 2022Date of Patent: February 6, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Norio Wada, Shintaro Sugihara
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Publication number: 20230039173Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.Type: ApplicationFiled: August 2, 2022Publication date: February 9, 2023Inventors: Norio Wada, Shintaro Sugihara
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Patent number: 9960069Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: GrantFiled: January 24, 2014Date of Patent: May 1, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
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Patent number: 9922859Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: GrantFiled: January 24, 2014Date of Patent: March 20, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
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Patent number: 9694572Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.Type: GrantFiled: November 4, 2014Date of Patent: July 4, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Hajime Furuya, Goro Furutani, Yasunobu Iwamoto
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Patent number: 9263268Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.Type: GrantFiled: May 19, 2014Date of Patent: February 16, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Masahiro Yamamoto, Shintaro Sugihara, Hajime Furuya
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Publication number: 20150129137Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.Type: ApplicationFiled: November 4, 2014Publication date: May 14, 2015Inventors: Shintaro SUGIHARA, Hajime FURUYA, Goro FURUTANI, Yasunobu IWAMOTO
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Publication number: 20140349465Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.Type: ApplicationFiled: May 19, 2014Publication date: November 27, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Masahiro YAMAMOTO, Shintaro SUGIHARA, Hajime FURUYA
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Publication number: 20140208556Abstract: A joining device for joining substrates together includes a first chuck configured to draw and hold a first substrate on a lower surface thereof, a second chuck provided below the first chuck and configured to draw and hold a second substrate on an upper surface thereof, and a chuck holding unit provided below the second chuck, the chuck holding unit including an upper surface and suction grooves annularly formed on the upper surface of the chuck holding unit, the suction grooves configured to vacuum-suck the second chuck to draw and hold the second chuck.Type: ApplicationFiled: January 24, 2014Publication date: July 31, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Shintaro SUGIHARA, Naoto YOSHITAKA, Shigenori KITAHARA, Keizo HIROSE
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Publication number: 20140208557Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: ApplicationFiled: January 24, 2014Publication date: July 31, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Shintaro SUGIHARA, Naoto YOSHITAKA, Shigenori KITAHARA, Keizo HIROSE
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Publication number: 20130062013Abstract: A joint apparatus that joins a processing target substrate and a supporting substrate together, includes: a processing container that is capable of hermetically closing an inside thereof; a joint unit that joins the processing target substrate and the supporting substrate together by pressing the processing target substrate and the supporting substrate via an adhesive; and a superposed substrate temperature regulation unit that temperature-regulates a superposed substrate joined in the joint unit, wherein the joint unit and the superposed substrate temperature regulation unit are arranged in the processing container, A delivery unit for delivering the processing target substrate, the supporting substrate, or the superposed substrate to/from an outside of the processing container is provided in the processing container, and the superposed substrate temperature regulation unit is provided in the delivery unit.Type: ApplicationFiled: September 11, 2012Publication date: March 14, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Shinji OKADA, Masatoshi SHIRAISHI, Masatoshi DEGUCHI, Naoto YOSHITAKA, Shintaro SUGIHARA, Masataka MATSUNAGA