Patents by Inventor Shintarou Sasaki

Shintarou Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method and manufacturing apparatus for a non-contact communication medium
    Patent number: 8349118
    Abstract: Provided is a manufacturing method for a non-contact communication medium, including: forming in a first region a first structure including an IC chip mounted on the first region, a first adhesive in an uncured state, which is applied on the IC chip, and a first plate member placed on the first adhesive; forming in a second region a second structure including a second adhesive in an uncured state, which is applied on the second region, and a second plate member placed on the second adhesive; sandwiching the first region and the second region by a first partition wall capable of partitioning the first region and accommodating the first structure and a second partition wall capable of partitioning the second region and accommodating the second structure; and heating the first partition wall and the second partition wall, to thereby thermally cure the first adhesive and the second adhesive, respectively.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: January 8, 2013
    Assignee: Sony Corporation
    Inventors: Shintarou Sasaki, Takanori Aizawa, Yuji Sakai
  • MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR A NON-CONTACT COMMUNICATION MEDIUM
    Publication number: 20110146878
    Abstract: Provided is a manufacturing method for a non-contact communication medium, including: forming in a first region a first structure including an IC chip mounted on the first region, a first adhesive in an uncured state, which is applied on the IC chip, and a first plate member placed on the first adhesive; forming in a second region a second structure including a second adhesive in an uncured state, which is applied on the second region, and a second plate member placed on the second adhesive; sandwiching the first region and the second region by a first partition wall capable of partitioning the first region and accommodating the first structure and a second partition wall capable of partitioning the second region and accommodating the second structure; and heating the first partition wall and the second partition wall, to thereby thermally cure the first adhesive and the second adhesive, respectively.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 23, 2011
    Applicant: SONY CORPORATION
    Inventors: Shintarou Sasaki, Takanori Aizawa, Yuji Sakai