Patents by Inventor Shinya Ajisaka

Shinya Ajisaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an electrode plate assembly for lead accumulator and device therefor
    Patent number: 6190797
    Abstract: Entry of molten lead into the space between the electrode plates from the gap between welding jig 12 and electrode plate lead 6 is prevented by a construction of pouring nozzle 17 in which the flow speed and temperature of the molten lead when molten lead is poured into the recess of the welding jig 12 are lowered. Also, admixture of oxide and/or scum is eliminated by discharging the molten lead from the bottom of reservoir 36. Furthermore, reliable joining of strap 2, electrode plate leads 6 and pillar electrode 4 is achieved by prioritising melting of electrode plate leads 6, pillar electrode 4 and the vicinity thereof by plasma welding.
    Type: Grant
    Filed: July 20, 1998
    Date of Patent: February 20, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Rikio Miyagi, Masao Ito, Hiroshi Hori, Shinya Ajisaka