Patents by Inventor Shiow Shya Ling

Shiow Shya Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170051185
    Abstract: Multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface and an adhesive layer on the other surface, with a conductive film construction adhered to a portion of the adhesive layer such that portions of the adhesive remain exposed. The conductive film construction includes a polymeric substrate with an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite coated by buff coating. Other multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface, and an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite particles coated on the other surface. Stripes of adhesive are present on a portion of the electrically conductive coating such that portions of the electrically conductive coating remain exposed between the adhesive stripes.
    Type: Application
    Filed: February 12, 2015
    Publication date: February 23, 2017
    Inventors: Shiow Shya Ling, Ranjith Divigalpitiya, Kam Poi Chia, Carol A. Marek, Gerrard A. Marra
  • Patent number: 9374934
    Abstract: The present invention is directed to a carrier tape having pockets for carrying electronic components. The carrier tape includes a longitudinally extending elevated central portion having a plurality of pockets formed therein and two side portions, each side portion disposed on opposite sides of the elevated central portion and extending longitudinally therewith, wherein each side portion is attached to the elevated central portion by an inclined portion such that the central portion is higher than the side portions when disposed in a flat configuration.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: June 21, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Chee Ming Ng, Shiow Shya Ling, Wai Thoo Leong
  • Publication number: 20150289427
    Abstract: The present invention is directed to a carrier tape having pockets for carrying electronic components. The carrier tape includes a longitudinally extending elevated central portion having a plurality of pockets formed therein and two side portions, each side portion disposed on opposite sides of the elevated central portion and extending longitudinally therewith, wherein each side portion is attached to the elevated central portion by an inclined portion such that the central portion is higher than the side portions when disposed in a flat configuration.
    Type: Application
    Filed: June 23, 2015
    Publication date: October 8, 2015
    Inventors: Chee Ming Ng, Shiow Shya Ling, Wai Thoo Leong
  • Patent number: 9090403
    Abstract: The present invention is directed to a carrier tape having pockets for carrying electronic components. The carrier tape includes a longitudinally extending elevated central portion having a plurality of pockets formed therein and two side portions, each side portion disposed on opposite sides of the elevated central portion and extending longitudinally therewith, wherein each side portion is attached to the elevated central portion by an inclined portion such that the central portion is higher than the side portions when disposed in a flat configuration.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: July 28, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Chee Ming Ng, Shiow Shya Ling, Wai Thoo Leong
  • Publication number: 20140305771
    Abstract: The present invention is directed to a carrier tape having pockets for carrying electronic components. The carrier tape includes a longitudinally extending elevated central portion having a plurality of pockets formed therein and two side portions, each side portion disposed on opposite sides of the elevated central portion and extending longitudinally therewith, wherein each side portion is attached to the elevated central portion by an inclined portion such that the central portion is higher than the side portions when disposed in a flat configuration.
    Type: Application
    Filed: December 4, 2012
    Publication date: October 16, 2014
    Inventors: Chee Ming Ng, Shiow Shya Ling, Wai Thoo Leong
  • Patent number: D590854
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: April 21, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Shiow Shya Ling, Kam Poi Chia, Anthonius