Patents by Inventor Shiqiang Yao

Shiqiang Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8013562
    Abstract: A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: September 6, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Wai Chuen Gan, Gary Peter Widdowson, Shiqiang Yao, Siu Yan Ho, Hon Yu Peter Ng
  • Publication number: 20100060086
    Abstract: A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.
    Type: Application
    Filed: September 9, 2009
    Publication date: March 11, 2010
    Inventors: Wai Chuen GAN, Gary Peter WIDDOWSON, Shiqiang YAO, Siu Yan HO, Hon Yu Peter NG
  • Patent number: 7665204
    Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: February 23, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Shiqiang Yao, Gary Peter Widdowson
  • Publication number: 20080086874
    Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
    Type: Application
    Filed: October 16, 2006
    Publication date: April 17, 2008
    Inventors: Yiu Ming Cheung, Shiqiang Yao, Gary Peter Widdowson
  • Patent number: 7303647
    Abstract: A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured for programmable movement along the first axis with respect to the chip in conjunction with the second actuator for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: December 4, 2007
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Shiqiang Yao, Gary Peter Widdowson
  • Publication number: 20060090846
    Abstract: A driving mechanism and driving method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism comprises a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured to drive the detachment tool for programmable movement along the first axis with respect to the chip in conjunction with the second actuator driving the detachment tool for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Yiu Cheung, Shiqiang Yao, Gary Widdowson