Abstract: A heater having a substrate composed of a heat-resistant and electrically insulating material, a heater element formed on the surface of the substrate in a belt-shape in the longitudinal direction containing an alloy of Ag and Pd having a weight ratio Ag/Pd of 90/10 to 70/30, glass, and an inorganic oxide and/or an inorganic nitride of 0.1 to 20 wt % to the weight of the alloy of Ag and Pd, and a power supply terminal part formed in connection with the heater element. The heater is suited to use for a fixing device of an image forming apparatus.

Abstract: A heater having a substrate composed of a heat-resistant and electrically insulating material, a heater element formed on the surface of the substrate in a belt-shape in the longitudinal direction containing an alloy of Ag and Pd having a weight ratio Ag/Pd of 90/10 to 70/30, glass, and an inorganic oxide and/or an inorganic nitride of 0.1 to 20 wt % to the weight of the alloy of Ag and Pd, and a power supply terminal part formed in connection with the heater element. The heater is suited to use for a fixing device of an image forming apparatus.

Abstract: A heater, particularly useful for an imaging device, comprises a substrate primarily made of aluminum nitride (AlN) having an electrical insulating property. A heat generating member, formed on one surface of the substrate, contains silver (Ag) and palladium (Pd) having a weight ratio (Ag/Pd) in the range of 40/60˜50/50. Conductive electrodes are connected to respective ends of the heat-generating member.

Abstract: An ion generating device according to the present invention has a substrate having at least one insulating surface. A pair of electrodes is separately formed on the substrate to generate a corona discharge therebetween for ionizing gas floating in the atmosphere around the device. A protective layer having a thickness between 0.5 .mu.m and 10 .mu.m is limitedly coated on an exposed surface of the electrode.

Abstract: A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

Abstract: A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

Abstract: A method of manufacturing and monitoring the manufacture of a thick film circuit board device. The method includes the steps of forming a resistive layer in a prescribed pattern on an insulative base board, forming a first conductive layer on the insulative base board adjacent to the resistive layer with a gap of predetermined width therebetween and forming a second conductive layer in the gap and overlapping a portion of the resistive layer and the first conductive layer for establishing electrical contact between the resistive layer and the first conductive layer.

Abstract: A substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrates. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.

Abstract: A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrate. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.