Abstract: A processing apparatus for efficiently discharging both polishing liquid flowing out a surface plate and mist of polishing liquid produced through polishing with the use of simple measures, is composed of a drain receiver which is provided in proximity with the outer periphery of the surface plate, and which serves as both recovery means for recovering the polishing liquid flowing out from the surface plate and a suction means for sucking up the mist of polishing liquid produced through polishing, a common discharge pipe connecting the drain receiver to a gas-liquid separating mans, for simultaneously transferring both polishing liquid and mist of polishing liquid into the gas-liquid separating means therefrom, and a suction pump and a liquid processing means connected to the gas-liquid separating means.

Abstract: Described herein is a flat lapping machine capable of precision-abrading simultaneously flat surfaces on the front and rear sides of a work in the fashion of lapping, polishing and grinding machines. The present invention contemplates to provide a flat lapping machine which is simplified in construction as compared with conventional flap lapping machines having a large number of carriers in planetary motions, and which can stop the respective carriers easily in specific positions and directions at the end of a lapping operation. To this end, the present invention employs a large number of support gear mechanisms each constituted by a plural number of small gears and located at uniform intervals around a center gear, rotatably supporting the respective carriers in predetermined positions while the respective carriers are driven by the center gear.